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STM32L072VZI6

STMicroelectronics

STM32L072VZI6 by STMicroelectronics

STM32L072VZI6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 terminals. With integrated DAC and ADC channels, it's ideal for low-power applications in industrial settings. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.570

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 19,968 parts In-Stock

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-

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$2.570

10k+ parts

$2.540

19,968

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$2.570

$2.540

EBV Elektronik

Germany . 6,656 parts In-Stock

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6,656

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IBS Electronics

USA . 19,968 parts In-Stock

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-

100+ parts

-

1k+ parts

$3.341

10k+ parts

$3.302

19,968

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$3.341

$3.302

Chip Stock

USA . 6,393 parts In-Stock

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Vyrian

USA . 4,709 parts In-Stock

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Digiode

USA . 2,396 parts In-Stock

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Conversion2

USA . 619 parts In-Stock

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619

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Anansix

USA . 516 parts In-Stock

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516

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Distributors (Availability)

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Vigor

Singapore . 5,884 parts In-Stock

1+ parts

$3.530

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5,884

$3.530

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AZTECH Wire

Italy . 946 parts In-Stock

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$14.920

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946

$14.920

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Microchip USA

USA . 5,081 parts In-Stock

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$27.484

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5,081

$27.484

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

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$40.672

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$36.605

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1,909

$40.672

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$36.605

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MKK Technologies

India . 2,289 parts In-Stock

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$76.482

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2,289

$76.482

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DigiPath Technology Company

USA . 2,289 parts In-Stock

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$76.482

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2,289

$76.482

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Perfect Parts

USA . 6,057 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Corphita

USA . 4,831 parts In-Stock

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Eastek

USA . 3,328 parts In-Stock

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3,328

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 166 parts In-Stock

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$48.630

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166

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$48.630

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Overview

Elevate your innovations with the STM32L072VZI6 from STMicroelectronics, a leader in high-performance microcontrollers. Designed for efficiency and versatility, this chip caters to a wide array of applications, from wearables to industrial automation. Its low power consumption and robust features empower developers to create advanced solutions without compromise. Trust in ST’s legacy of quality to unlock new possibilities and enhance your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material provides excellent protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more compact assembly on printed circuit boards, changing the size constraints of your designs.

Maximum Supply Voltage: 3.6 V

Operating at a low maximum supply voltage helps in reducing overall power consumption, enhancing battery life in portable applications.

Package Shape: SQUARE

A square-shaped package allows for efficient layout and routing on PCBs, contributing to space-saving designs.

Bit Size: 32

The 32-bit architecture provides a wider data processing capability, making it suitable for complex applications requiring efficient computation.

DAC Channels: YES

Built-in Digital-to-Analog Converters enable direct analog output control, which is beneficial for audio or signal processing applications.

No. of Terminals: 100

With 100 terminals, this microcontroller supports a large number of peripherals and connections, maximizing flexibility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This packaging style contributes to space-efficient designs, allowing for application in compact devices without compromising on functionality.

Minimum Supply Voltage: 1.8 V

Operating at a minimum supply voltage of 1.8V enables it to operate efficiently in low-power environments and extends battery life.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this microcontroller suitable for industrial applications where heat resistance is crucial.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers a balance of performance and energy efficiency, making it ideal for cost-sensitive applications.

Minimum Operating Temperature: -40 °C

This allows the microcontroller to function in extreme environments, expanding its usability across a range of applications.

ADC Channels: YES

Having built-in Analog-to-Digital Converters supports real-time data acquisition and processing, which is essential for sensor-based applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency, improving overall system performance by offloading the CPU.

Terminal Position: BOTTOM

Bottom-placed terminals facilitate easier integration into PCB layouts, promoting design flexibility.

ROM Words: 196608

A substantial ROM size allows for accommodating complex firmware, making this microcontroller suitable for sophisticated applications.

Maximum Seated Height: 0.6 mm

A low seated height helps in maintaining a compact profile, ideal for space-constrained applications.

Digital To Analog Converters: 2-Ch 12-Bit

The dual-channel DACs with 12-bit resolution enable high-quality analog signal generation for various applications.

Width: 7 mm

A compact width supports space-efficient design, allowing it to fit in smaller electronic devices.

Data EEPROM Size: 6K

The EEPROM size allows for the storage of critical configuration data, ensuring the microcontroller can retain important information even when powered off.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

The extensive set of peripherals enhances functionality, making this microcontroller highly versatile for a variety of tasks.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides adequate processing speed for most applications while maintaining power efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures compatibility with most soldering processes, simplifying production.

Length: 7 mm

The small length makes it suitable for tight spaces within devices, offering layout flexibility.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance under demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a RISC architecture optimizes the instruction set for efficiency, allowing for faster processing.

No. of Timers: 8

Having multiple timers allows for sophisticated time-based processes, improving control over operations.

RAM Bytes: 20480

A significant RAM size supports complex data handling and multitasking capabilities, benefiting advanced applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration capabilities, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enhances thermal performance and may offer better electrical connection in compact designs.

Analog To Digital Convertors: 16-Ch 12-Bit

The capability to convert 16 channels with 12-bit resolution allows detailed analysis of multiple signals, ideal for sensor-heavy applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V provides a fine balance of efficiency and performance for a wide range of embedded applications.

No. of DMA Channels: 7

Seven DMA channels enable efficient data management operations, alleviating the CPU for more critical tasks.

PWM Channels: YES

The presence of PWM channels allows for effective motor control and power regulation applications.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Extensive connectivity options support a wide range of interfaces, making integration into various systems effortless.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, providing flexibility throughout the product lifecycle.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables higher density integration, making it suitable for modern compact circuitry.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates appropriate handling procedures, ensuring quality during manufacturing and assembly.

Speed: 32 rpm

This speed rating suggests the microcontroller's relevance in systems requiring precise timing and control operations.

On Chip Program ROM Width: 8

An 8-bit width for on-chip program ROM supports efficient data processing and coding practices for embedded systems.

No. of I/O Lines: 84

Having 84 I/O lines allows for extensive peripheral connectivity, making this microcontroller suitable for complex projects.

Technical Specifications

Microcontrollers STM32L072VZI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

7

No. of I/O Lines:

84

No. of Terminals:

100

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072VZI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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