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STM32L072RZH6TR

STMicroelectronics

STM32L072RZH6TR by STMicroelectronics

STM32L072RZH6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features 15-Ch 12-Bit ADCs, 2-Ch 12-Bit DACs, and offers various peripherals like PWM(5) and UART for industrial applications requiring high-speed processing and connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 2,500 parts In-Stock

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2,500

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Vyrian

USA . 8,413 parts In-Stock

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8,413

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Digiode

USA . 1,133 parts In-Stock

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1,133

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Anansix

USA . 125 parts In-Stock

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125

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Vigor

Singapore . 3,590 parts In-Stock

1+ parts

$3.290

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3,590

$3.290

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AZTECH Wire

Italy . 677 parts In-Stock

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$13.970

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677

$13.970

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Ampacity Inc.

Singapore . 2,066 parts In-Stock

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$16.000

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2,066

$16.000

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Microchip USA

USA . 3,632 parts In-Stock

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$25.020

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$25.020

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Corohmni

South Africa . 344 parts In-Stock

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$26.612

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344

$26.612

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Aztec Data Supply Inc.

USA . 4,518 parts In-Stock

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$57.480

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IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$70.777

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$63.699

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417

$70.777

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$63.699

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MKK Technologies

India . 826 parts In-Stock

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$133.091

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826

$133.091

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DigiPath Technology Company

USA . 826 parts In-Stock

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$133.091

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Corphita

USA . 2,362 parts In-Stock

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Continental Prestige Electronics

USA . 2,310 parts In-Stock

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Argo Parts USA

USA . 2,259 parts In-Stock

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Parana Technologies

USA . 902 parts In-Stock

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$84.624

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$84.624

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Discover the STM32L072RZH6TR by STMicroelectronics, a high-quality microcontroller designed to meet your application needs. With a wide range of peripherals including DAC and ADC channels, DMA capabilities, and multiple timers, this product offers exceptional value and flexibility. Whether you're working on industrial automation, IoT devices, or consumer electronics, this Cortex-M0 CPU family microcontroller provides efficient performance with a maximum clock frequency of 32 MHz. Trust STMicroelectronics for reliable products that deliver superior performance and innovation to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand harsh environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility and compatibility with various power sources, increasing the versatility of the microcontroller.

Bit Size: 32

32-bit architecture enables high-performance computing and efficient processing of complex algorithms, making it suitable for a wide range of applications.

ADC Channels: YES

Analog-to-Digital Converters allow for accurate conversion of analog signals to digital data, enhancing the microcontroller's capability to interface with sensors and other analog devices.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU, resulting in enhanced performance and reduced power consumption.

ROM Words: 196608

Large ROM capacity allows for storing a significant amount of program code and data, enabling the microcontroller to execute complex tasks effectively.

Maximum Clock Frequency: 32 MHz

High clock frequency facilitates fast processing speed, enabling quick execution of instructions and tasks.

RAM Bytes: 20480

Generous RAM capacity provides ample space for temporary data storage, ensuring smooth operation and multitasking capability.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Multiple connectivity options allow for seamless integration with various communication interfaces, expanding the microcontroller's compatibility and usability in diverse systems.

Technical Specifications

Microcontrollers STM32L072RZH6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

50

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072RZH6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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