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STM32L072RBT3

STMicroelectronics

STM32L072RBT3 by STMicroelectronics

STM32L072RBT3 from STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 64 terminals, and operates in extreme temperatures (-40 °C to 125 °C). It supports multiple connectivity options like I2C and SPI, making it ideal for automotive applications. With integrated ADC/DAC channels and low power consumption, it's perfect for energy-efficient designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,231 parts In-Stock

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Digiode

USA . 4,589 parts In-Stock

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4,589

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Anansix

USA . 393 parts In-Stock

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393

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Distributors (Availability)

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Vigor

Singapore . 1,473 parts In-Stock

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$3.560

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1,473

$3.560

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AZTECH Wire

Italy . 698 parts In-Stock

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$14.740

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698

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Microchip USA

USA . 2,796 parts In-Stock

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$26.656

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$26.656

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

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$30.824

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$27.741

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2,087

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$27.741

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MKK Technologies

India . 313 parts In-Stock

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$57.962

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DigiPath Technology Company

USA . 313 parts In-Stock

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$57.962

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Corphita

USA . 2,866 parts In-Stock

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Parana Technologies

USA . 1,877 parts In-Stock

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$36.854

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Perfect Parts

USA . 1,075 parts In-Stock

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Overview

Unleash the potential of your next project with the STM32L072RBT3 microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, STMicroelectronics delivers a powerhouse that seamlessly integrates advanced features, perfect for automotive, IoT, and wearable applications. Benefit from energy efficiency, versatile connectivity, and robust performance in a compact design, all while enjoying the peace of mind that comes from partnering with a leader in semiconductor innovation. Transform your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides good protection and insulation, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic assemblies.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances energy efficiency, making it suitable for battery-operated devices.

Package Shape: SQUARE

The square package shape optimizes space on PCBs, improving layout and design flexibility.

Bit Size: 32

A 32-bit architecture provides enhanced performance and a larger address space, supporting more complex applications.

DAC Channels: YES

The presence of DAC channels enables easier conversion of digital signals to analog, ideal for audio and sensor applications.

No. of Terminals: 64

A higher number of terminals allows for ample connectivity options, facilitating more peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style supports high-density designs, making it suitable for modern electronics where space is critical.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage contributes to energy savings, widening its application in energy-sensitive devices.

Maximum Operating Temperature: 125 °C

A high operating temperature rating ensures reliability and performance in demanding environments, such as automotive applications.

CPU Family: CORTEX-M0

Based on the efficient Cortex-M0 architecture, it provides low power consumption and solid performance for embedded applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures enhances its viability for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC capabilities allow for direct sensor interfacing, making it versatile for a range of applications.

DMA Channels: YES

DMA channels improve data transfer efficiency, offloading the CPU and enhancing the system's overall performance.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient space utilization on PCB layouts and aids in robust soldering.

ROM Words: 131072

A significant ROM capacity supports extensive embedded applications, allowing for complex software and firmware.

Maximum Seated Height: 1.6 mm

Low seated height enables slimmer designs, important in portable consumer electronics.

Digital To Analog Convertors: 2-Ch 12-Bit

The inclusion of 12-bit DACs allows for high-resolution signal conversion, beneficial in audio and sensor applications.

Width: 10 mm

A compact width aids in designing space-efficient electronic products.

Data EEPROM Size: 6K

Adequate EEPROM size is available for storing configuration data and user settings, enhancing flexibility.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

A wide range of integrated peripherals reduces component count and complexity in designs, improving reliability.

Maximum Clock Frequency: 32 MHz

A 32 MHz clock frequency ensures good processing speed for various real-time applications.

Length: 10 mm

Compact length helps in minimizing the overall footprint on the PCB, advantageous in small-scale designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it ensures robustness in harsh operating conditions, ensuring longevity.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to efficient instruction execution, enhancing performance in embedded systems.

No. of Timers: 8

Multiple timers support various timing and control applications, adding flexibility to the design.

RAM Bytes: 20480

Ample RAM facilitates the handling of complex tasks and multiple applications, making it suitable for demanding projects.

Technology: CMOS

CMOS technology offers low power consumption, allowing for efficient designs suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and easy integration into standard PCB designs.

Analog To Digital Convertors: 16-Ch 12-Bit

A robust ADC allows for high-resolution data acquisition from a variety of sensors, enhancing functionality.

Nominal Supply Voltage: 3 V

A nominal supply voltage that aligns with many common power sources makes integration straightforward.

No. of DMA Channels: 7

Multiple DMA channels ensure efficient data movement, increasing throughput in data-intensive applications.

PWM Channels: YES

The presence of PWM channels allows for precise control in motor and light applications, enhancing versatility.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Diverse connectivity options enable compatibility with a wide range of devices, making it suitable for complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, increasing the product lifecycle.

Terminal Pitch: 0.5 mm

A fine terminal pitch is suitable for high-density designs, accommodating the miniaturization trends in electronics.

Speed: 32 rpm

Capable of operating at this speed allows integration into applications requiring moderate dynamic performance.

On Chip Program ROM Width: 8

An 8-bit ROM width simplifies integration with common microcontroller design practices, enhancing usability.

No. of I/O Lines: 51

A high number of I/O lines allows for extensive interfacing possibilities, ideal for complex designs.

Technical Specifications

Microcontrollers STM32L072RBT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

7

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072RBT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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