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STM32L072RBI6TR

STMicroelectronics

STM32L072RBI6TR by STMicroelectronics

STM32L072RBI6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 64 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for low-power IoT applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 2,483 parts In-Stock

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2,483

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Digiode

USA . 1,728 parts In-Stock

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1,728

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Anansix

USA . 723 parts In-Stock

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723

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Distributors (Availability)

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AZTECH Wire

Italy . 130 parts In-Stock

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$11.950

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130

$11.950

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IDEA Electronic Components Group

UK . 305 parts In-Stock

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$21.980

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$19.782

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305

$21.980

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$19.782

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Microchip USA

USA . 6,640 parts In-Stock

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$22.974

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$22.974

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MKK Technologies

India . 1,761 parts In-Stock

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$41.331

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DigiPath Technology Company

USA . 1,761 parts In-Stock

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$41.331

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Component Stockers USA

USA . 698 parts In-Stock

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$52.610

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Vigor

Singapore . 2,748 parts In-Stock

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Parana Technologies

USA . 1,734 parts In-Stock

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$26.280

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Corphita

USA . 474 parts In-Stock

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Overview

Unlock the full potential of your next project with the STM32L072RBI6TR microcontroller from STMicroelectronics. Renowned for its innovation and reliability, STMicroelectronics delivers exceptional quality that empowers a wide range of applications—from wearables to smart home devices. With ultra-low power consumption and versatile connectivity options, this 32-bit powerhouse ensures high performance while maximizing battery life, making it the perfect choice for cutting-edge designs. Experience unmatched value and elevate your creations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various applications.

Surface Mount: YES

Compatible with modern manufacturing processes, allowing for compact designs.

Maximum Supply Voltage: 3.6 V

Supports a wide operating range, making it suitable for low-power applications.

Package Shape: SQUARE

Efficient use of board space due to a compact square design.

Bit Size: 32

32-bit architecture delivers enhanced performance and processing capabilities.

DAC Channels: YES

On-chip DAC functionality allows for analog output generation, increasing versatility.

No. of Terminals: 64

Provides ample connectivity options for diverse applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Ideal for high-density applications with limited space.

Minimum Supply Voltage: 1.8 V

Features low-voltage operation for energy-efficient designs.

Maximum Operating Temperature: 85 °C

Robust performance in high-temperature environments suitable for industrial applications.

CPU Family: CORTEX-M0

Efficient processor architecture ensuring low power consumption with adequate performance.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold, making it suitable for outdoor and industrial use.

ADC Channels: YES

Integrated ADC enables the microcontroller to interact with analog signals effectively.

DMA Channels: YES

Enhances data transfer efficiency, minimizing CPU workload for complex applications.

Terminal Position: BOTTOM

Facilitates easy integration into PCB designs for effective thermal management.

ROM Words: 131072

Sufficient program memory for managing complex applications and algorithms.

Maximum Seated Height: 0.6 mm

Low-profile design allows for compact placement in space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

High-resolution DACs provide precise analog output capabilities.

Width: 5 mm

Compact width supports space-saving designs in various applications.

Data EEPROM Size: 6K

Non-volatile memory ensures data retention even when power is lost.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Diverse peripherals enhance functionality, making the microcontroller versatile for various tasks.

Maximum Clock Frequency: 32 MHz

Offers good processing speed for various time-sensitive applications.

Length: 5 mm

Compact length supports very tight designs and layout flexibility.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsher conditions, suitable for industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture maximizes performance per watt, ideal for low-power applications.

No. of Timers: 8

Multiple timers enable complex timing and control operations for intricate applications.

RAM Bytes: 20480

Sufficient RAM for executing multiple tasks or managing data efficiently.

Technology: CMOS

CMOS technology allows for low power consumption and high speed operations.

Terminal Form: BALL

Ball grid array (BGA) enhances the performance of the IC with better heat dissipation.

Analog To Digital Convertors: 15-Ch 12-Bit

High-channel and resolution ADCs allow integration with multiple sensors for versatile applications.

Nominal Supply Voltage: 3 V

Standard supply voltage for optimal performance and efficiency.

No. of DMA Channels: 7

Allows for significant data throughput without burdening the CPU.

PWM Channels: YES

PWM capability supports motor control and other applications requiring variable output.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Multiple communication interfaces ensure compatibility with a variety of devices.

ROM Programmability: FLASH

Flash memory allows for easy updates and modifications to firmware.

Terminal Pitch: 0.5 mm

Fine pitch helps to maintain compact layouts while allowing higher terminal density.

Speed: 32 rpm

Allows for smooth operation at moderate speeds, useful in motor control scenarios.

On Chip Program ROM Width: 8

8-bit ROM width allows for flexible program storage, optimizing memory usage.

No. of I/O Lines: 50

Extensive I/O lines provide flexibility in interfacing with external components.

Technical Specifications

Microcontrollers STM32L072RBI6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

50

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072RBI6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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