Loading...

STM32L072KBU7TR

STMicroelectronics

STM32L072KBU7TR by STMicroelectronics

STM32L072KBU7TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 2 DAC channels. With 32 MHz max clock speed and multiple connectivity options, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Vyrian

USA . 3,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,927

-

-

-

-

Anansix

USA . 2,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

-

-

-

-

Digiode

USA . 1,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,587 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,587

$2.790

-

-

-

AZTECH Wire

Italy . 671 parts In-Stock

1+ parts

$15.120

100+ parts

-

1k+ parts

-

10k+ parts

-

671

$15.120

-

-

-

Microchip USA

USA . 5,133 parts In-Stock

1+ parts

$21.731

100+ parts

-

1k+ parts

-

10k+ parts

-

5,133

$21.731

-

-

-

Component Stockers USA

USA . 1,301 parts In-Stock

1+ parts

$32.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,301

$32.880

-

-

-

IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$65.533

100+ parts

-

1k+ parts

$58.980

10k+ parts

-

1,047

$65.533

-

$58.980

-

MKK Technologies

India . 1,998 parts In-Stock

1+ parts

$123.231

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$123.231

-

-

-

DigiPath Technology Company

USA . 1,998 parts In-Stock

1+ parts

$123.231

100+ parts

-

1k+ parts

-

10k+ parts

-

1,998

$123.231

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,349

-

-

-

-

Corphita

USA . 4,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,578

-

-

-

-

Parana Technologies

USA . 1,376 parts In-Stock

1+ parts

-

100+ parts

$78.355

1k+ parts

-

10k+ parts

-

1,376

-

$78.355

-

-

Overview

Elevate your projects with the STM32L072KBU7TR microcontroller from STMicroelectronics, a leader in innovation and quality. This power-efficient, compact solution boasts exceptional performance, making it perfect for diverse applications like IoT, wearable tech, and industrial automation. With robust features such as advanced ADCs and DACs, it ensures seamless integration and unmatched reliability, empowering you to create cutting-edge designs that stand out in today’s competitive market.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact PCBs, optimizing space and improving performance.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with various power supply systems, providing versatility in applications.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space and uniform thermal distribution.

Bit Size: 32

A 32-bit architecture provides enhanced processing capabilities, enabling faster execution of complex algorithms.

DAC Channels: YES

Includes Digital-to-Analog Conversion channels, making it suitable for applications requiring analog signal output.

No. of Terminals: 32

With 32 terminals, this microcontroller can connect to multiple peripherals and devices, ensuring flexible design options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile and effective heat management enhance thermal performance, suitable for high-density applications.

Minimum Supply Voltage: 1.8 V

Lower supply voltage requirement leads to reduced power consumption, ideal for battery-powered devices.

Maximum Operating Temperature: 105 °C

High temperature rating allows for reliable operation in industrial environments with extreme conditions.

CPU Family: CORTEX-M0

Based on the efficient and widely used Cortex-M0 architecture, it ensures lower power consumption while maintaining performance.

Minimum Operating Temperature: -40 °C

This capability enables usage in harsh environmental conditions, making it suitable for outdoor and industrial applications.

ADC Channels: YES

Offers multiple Analog-to-Digital Conversion channels, making it ideal for sensor applications requiring precise measurements.

DMA Channels: YES

Incorporation of Direct Memory Access channels enhances data transfer efficiency, boosting overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates excellent soldering and connectivity options for robust applications.

ROM Words: 131072

Significant ROM capacity allows for ample code storage, accommodating complex software applications.

Maximum Seated Height: 0.6 mm

A low seated height enables compact designs, making it ideal for space-constrained applications.

Digital To Analog Converters: 2-Ch 12-Bit

With 12-bit precision, it provides high-quality analog output for detailed signal processing tasks.

Width: 5 mm

Compact width supports space-efficient designs while maintaining a balance between functionality and size.

Data EEPROM Size: 6K

Generous EEPROM size enables storage of configuration and calibration data without needing reset on power loss.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Diverse peripherals enhance versatility, allowing integration into various applications without additional components.

Maximum Clock Frequency: 32 MHz

Higher clock frequency translates to better performance and responsiveness in time-sensitive applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in critical and demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances efficiency, leading to lower power consumption and heat generation.

No. of Timers: 8

Multiple timers provide extensive timing and control capabilities for various applications, enhancing task management.

RAM Bytes: 20480

Ample RAM supports complex applications, allowing for better performance and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for a range of applications.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering and reduces the risk of thermal damage during assembly.

Analog To Digital Converters: 10-Ch 12-Bit

Provides multiple high-resolution ADC channels, making it ideal for sensor applications that require accuracy in data sampling.

Nominal Supply Voltage: 3 V

The nominal supply voltage balances efficiency and power requirements, optimizing battery life in portable applications.

No. of DMA Channels: 7

Multiple DMA channels optimize data transfer capabilities, reducing CPU load and improving overall system efficiency.

PWM Channels: YES

Presence of PWM channels allows for precise control in applications such as motor control and dimming.

Connectivity: I2C(3), IRDA, PMBUS, SMBUS, SPI(4), UART, USART(3), USB

Extensive connectivity options facilitate integration into diverse systems, enhancing compatibility and flexibility.

ROM Programmability: FLASH

Flash programmability enables easy updates to firmware, improving long-term usability and adaptability of the device.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports modern PCB designs, ensuring compatibility with advanced manufacturing techniques.

Speed: 32 rpm

A speed rating of 32 rpm makes it suitable for low-speed control applications, ensuring precision in task performance.

On-Chip Program ROM Width: 8

The 8-bit program ROM width optimizes data handling capabilities, enhancing performance for specific tasks.

No. of I/O Lines: 23

With 23 I/O lines, this microcontroller allows for significant interfacing capabilities, supporting complex designs.

Technical Specifications

Microcontrollers STM32L072KBU7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

23

No. of Terminals:

32

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), IRDA, PMBUS, SMBUS, SPI(4), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072KBU7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20