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STM32L072CZY6DTR

STMicroelectronics

STM32L072CZY6DTR by STMicroelectronics

STM32L072CZY6DTR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 49 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,442 parts In-Stock

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6,442

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Digiode

USA . 3,066 parts In-Stock

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3,066

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Anansix

USA . 403 parts In-Stock

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403

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,294 parts In-Stock

1+ parts

$2.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,294

$2.800

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AZTECH Wire

Italy . 110 parts In-Stock

1+ parts

$15.020

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110

$15.020

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Microchip USA

USA . 7,382 parts In-Stock

1+ parts

$21.800

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7,382

$21.800

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IDEA Electronic Components Group

UK . 1,224 parts In-Stock

1+ parts

$75.997

100+ parts

-

1k+ parts

$68.397

10k+ parts

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1,224

$75.997

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$68.397

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MKK Technologies

India . 1,611 parts In-Stock

1+ parts

$142.907

100+ parts

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1,611

$142.907

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DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$142.907

100+ parts

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1,611

$142.907

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Parana Technologies

USA . 2,269 parts In-Stock

1+ parts

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100+ parts

$90.866

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2,269

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$90.866

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Corphita

USA . 792 parts In-Stock

1+ parts

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792

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Overview

Unlock innovation with the STM32L072CZY6DTR microcontroller from STMicroelectronics, a trusted leader in semiconductor excellence. Designed for low-power applications, this versatile chip empowers your projects with seamless connectivity and robust performance. Whether you're developing smart wearables or IoT solutions, its compact design and industrial-grade resilience ensure reliability and efficiency. Experience the advantage of superior technology that drives your vision forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight design, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller is compatible with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into multiple PCB layouts.

Bit Size: 32

Being a 32-bit microcontroller allows for efficient processing and handling of complex computations.

DAC Channels: YES

Integrated DAC channels enable precise analog signal generation for various applications.

No. of Terminals: 49

A higher number of terminals provide ample connectivity options for peripherals and expansion.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style supports high-density designs, ideal for miniature and portable applications.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage enhances power efficiency, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, it is suitable for industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 architecture provides a balance of performance and power efficiency, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range allows the microcontroller to operate in extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels allow for direct measurement of analog signals, crucial for sensor applications.

DMA Channels: YES

DMA capability enhances performance by allowing high-speed data transfers without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning can improve thermal management and electrical performance.

ROM Words: 196608

A significant ROM capacity allows for complex applications and firmware, enabling advanced features.

Maximum Seated Height: 0.585 mm

The low seated height facilitates a compact design which is essential for space-constrained applications.

Digital To Analog Converters: 2-Ch 12-Bit

Dual DACs provide flexibility for generating two independent analog outputs, enhancing design capabilities.

Width: 3.258 mm

The small width supports a compact board layout, improving overall design efficiency.

Data EEPROM Size: 6K

Adequate EEPROM storage ensures that critical data can be retained even without power.

Peripherals: COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

A rich set of peripherals makes this microcontroller versatile for a variety of applications.

Maximum Clock Frequency: 32 MHz

A clock frequency of 32 MHz supports high-speed operations, suitable for real-time processing.

Length: 3.294 mm

Compact length ensures that it fits easily into space-restricted designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance while maintaining lower power consumption.

No. of Timers: 8

Multiple timers enable sophisticated timing and control applications.

RAM Bytes: 20480

Ample RAM allows for efficient data processing and buffering, enhancing application performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form is ideal for high-density connections, offering excellent soldering reliability.

Analog To Digital Converters: 13-Ch 12-Bit

The presence of multiple ADC channels enhances capability for monitoring and processing various signal types.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V supports low-power consumption for energy-efficient applications.

PWM Channels: YES

PWM channels facilitate precise control over motors and other devices, enhancing versatility.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Extensive connectivity options provide flexibility for integration with a variety of devices and systems.

ROM Programmability: FLASH

Flash ROM programmability ensures easy updates and customizability for firmware without hardware changes.

Terminal Pitch: 0.4 mm

The fine terminal pitch supports high-density layouts, allowing for more compact and sophisticated designs.

Speed: 32 rpm

Operational speed at 32 rpm implies suitability for applications requiring moderate speed control.

On Chip Program ROM Width: 8

An 8-bit program ROM width aids in efficient data handling and manipulation.

No. of I/O Lines: 40

A generous number of I/O lines allows for considerable interfacing capabilities with other components.

Technical Specifications

Microcontrollers STM32L072CZY6DTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B49

Length:

3.294 mm

No. of DMA Channels:

0

No. of I/O Lines:

40

No. of Terminals:

49

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.258 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

13-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072CZY6DTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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