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STM32L072CZY3TR

STMicroelectronics

STM32L072CZY3TR by STMicroelectronics

STM32L072CZY3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 125 °C, and supports up to 49 terminals. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for automotive applications. Its low power consumption (1.8V-3.6V) makes it perfect for energy-sensitive designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,707 parts In-Stock

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2,707

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Anansix

USA . 1,889 parts In-Stock

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1,889

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,100 parts In-Stock

1+ parts

$3.220

100+ parts

-

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5,100

$3.220

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AZTECH Wire

Italy . 675 parts In-Stock

1+ parts

$8.810

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675

$8.810

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Microchip USA

USA . 6,311 parts In-Stock

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$25.070

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6,311

$25.070

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IDEA Electronic Components Group

UK . 113 parts In-Stock

1+ parts

$50.746

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$45.672

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113

$50.746

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$45.672

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MKK Technologies

India . 917 parts In-Stock

1+ parts

$95.425

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917

$95.425

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DigiPath Technology Company

USA . 917 parts In-Stock

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$95.425

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917

$95.425

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Corphita

USA . 1,622 parts In-Stock

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1,622

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Parana Technologies

USA . 1,301 parts In-Stock

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$60.675

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1,301

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$60.675

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Overview

Unlock the future of innovation with the STM32L072CZY3TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this 32-bit powerhouse is perfect for automotive applications and beyond, delivering superior performance in compact designs. Enjoy low power consumption, versatile connectivity options, and advanced features that empower your projects and enhance user experiences. Elevate your designs and embrace endless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material provides durability and resistance against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a more compact design, enabling easier integration into smaller electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-power applications.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient PCB design and layout, optimizing space usage.

Bit Size: 32

Having a 32-bit architecture enhances performance and supports complex computation, making it suitable for advanced applications.

DAC Channels: YES

Built-in DAC channels enable the microcontroller to output analog signals, increasing its versatility in various applications.

No. of Terminals: 49

A higher number of terminals allows for greater connectivity options with peripherals and other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design enable high-density mounting and efficient use of board space.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage supports battery-powered devices, extending service life in low-power applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes it suitable for automotive and industrial applications where heat dissipation is a concern.

CPU Family: CORTEX-M0

The ARM Cortex-M0 family provides efficient processing power and low power consumption, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Supports operation in extreme cold environments, making it reliable for outdoor and harsh condition applications.

ADC Channels: YES

Integrated ADC channels allow for direct reading of sensor data, enhancing the device's capabilities in data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels streamline data transfers, improving overall performance by freeing up CPU cycles.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better heat dissipation and supports advanced PCB design layouts.

ROM Words: 196608

A substantial ROM size provides ample space for program storage, allowing complex applications to run efficiently.

Maximum Seated Height: 0.585 mm

Low seated height allows for a compact design, contributing to thinner and smaller consumer electronics.

Digital To Analog Convertors: 2-Ch 12-Bit

The presence of 12-bit DACs ensures high precision in analog output, which is crucial for audio and signal processing applications.

Width: 3.258 mm

A narrow width helps in fitting the microcontroller into compact spaces while maintaining design flexibility.

Data EEPROM Size: 6K

On-chip EEPROM allows for data storage without losing information during power outages, ideal for critical applications.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

A rich set of peripherals enhances functionality and allows for versatile applications, making it a good choice for diverse projects.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz delivers fast processing capabilities, suitable for real-time applications.

Length: 3.294 mm

Compact length facilitates the use of microcontroller in space-constrained applications, offering design versatility.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in critical systems where performance under extreme conditions is pivotal.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller optimizes instruction processing efficiency, leading to reduced power consumption and quicker execution.

No. of Timers: 8

Multiple timers provide robust support for various timing operations, enhancing the microcontroller's capabilities in real-time applications.

RAM Bytes: 20480

Adequate RAM size supports complex program execution and improved performance for multitasking applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it ideal for battery-powered applications.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and good electrical connections in compact designs.

Analog To Digital Convertors: 13-Ch 12-Bit

With multiple ADC channels, it can process various analog signals simultaneously, making it suitable for multi-sensor applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is standard for many low-power systems, ensuring compatibility with a wide range of devices.

No. of DMA Channels: 7

Multiple DMA channels allow for efficient signal processing and data handling, enhancing the microcontroller's performance in multitasking operations.

PWM Channels: YES

Integrated PWM channels support advanced motor control and signal modulation, making it versatile for varied applications.

Connectivity: I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Extensive connectivity options facilitate integration with numerous devices and sensors, promoting flexibility in system design.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates to firmware, ensuring long-term usability and adaptability of the device.

Terminal Pitch: 0.4 mm

A fine terminal pitch aids in high-density mounting on PCBs, which is essential for modern electronic devices.

Speed: 32 rpm

A maximum speed of 32 rpm indicates efficiency in processing and responding to tasks, which is beneficial for real-time applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width optimizes data handling and processing efficiency, which is crucial for performance-intensive applications.

No. of I/O Lines: 40

With 40 I/O lines, this microcontroller can support a wide array of external components and functionalities, enhancing flexibility.

Technical Specifications

Microcontrollers STM32L072CZY3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B49

Length:

3.294 mm

No. of DMA Channels:

7

No. of I/O Lines:

40

No. of Terminals:

49

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

20480

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.258 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

I2C(3), I2S, IRDA, PMBUS, SMBUS, SPI(6), UART, USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(5), RTC, TIMER(8), WDT(2)

Analog To Digital Convertors:

13-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32L072CZY3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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