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STM32L071VBT6TR

STMicroelectronics

STM32L071VBT6TR by STMicroelectronics

STM32L071VBT6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 terminals. With a supply voltage range of 1.8V to 3.6V, it's ideal for low-power applications like IoT devices. Its rich peripherals include ADC, DMA channels, and multiple connectivity options (I2C, SPI).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,531

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-

-

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Digiode

USA . 2,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,712

-

-

-

-

Anansix

USA . 1,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,475

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 10,137 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

-

10k+ parts

-

10,137

$2.930

-

-

-

AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$18.710

100+ parts

-

1k+ parts

-

10k+ parts

-

799

$18.710

-

-

-

Microchip USA

USA . 3,606 parts In-Stock

1+ parts

$24.680

100+ parts

$24.530

1k+ parts

$24.450

10k+ parts

$24.380

3,606

$24.680

$24.530

$24.450

$24.380

IDEA Electronic Components Group

UK . 586 parts In-Stock

1+ parts

$30.845

100+ parts

-

1k+ parts

$27.760

10k+ parts

-

586

$30.845

-

$27.760

-

MKK Technologies

India . 2,345 parts In-Stock

1+ parts

$58.002

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

$58.002

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-

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DigiPath Technology Company

USA . 2,345 parts In-Stock

1+ parts

$58.002

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

$58.002

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-

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Corphita

USA . 1,803 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,803

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Parana Technologies

USA . 269 parts In-Stock

1+ parts

-

100+ parts

$36.880

1k+ parts

-

10k+ parts

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269

-

$36.880

-

-

Overview

Elevate your projects with the STM32L071VBT6TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This low-power powerhouse combines exceptional performance and efficiency, making it perfect for IoT devices, wearable tech, and industrial applications. With its robust features and reliable quality, you can trust this microcontroller to deliver seamless connectivity and advanced functionality, ensuring your designs stand out in a competitive market. Enjoy the peace of mind that comes with choosing a manufacturer renowned for excellence and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, enabling efficient use of circuit board space.

Maximum Supply Voltage: 3.6 V

The ability to operate at a maximum supply voltage of 3.6 V ensures compatibility with low-power systems.

Package Shape: SQUARE

The square package shape helps to evenly distribute thermal and electrical characteristics, allowing for better performance.

Bit Size: 32

A 32-bit architecture enables efficient processing and high performance, suitable for complex applications.

No. of Terminals: 100

With 100 terminals, the microcontroller can connect to multiple peripherals, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design are excellent for space-constrained applications, making it easier to design compact devices.

Minimum Supply Voltage: 1.8 V

A minimum supply voltage of 1.8 V allows the microcontroller to function effectively in low-voltage environments.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this product reliable for industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 CPU family offers a balance of performance and power efficiency, ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

The capability to operate as low as -40 °C makes it suitable for extreme environmental conditions.

ADC Channels: YES

Integrated ADC channels facilitate direct digital conversion of analog signals, streamlining design and integration.

DMA Channels: YES

Having DMA channels allows for efficient data transfer without CPU intervention, improving system performance.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in PCB design and helps in better signal integrity.

ROM Words: 131072

With 131072 ROM words, it supports complex applications and plenty of onboard instructions.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a low-profile design conducive to compact assembly.

Width: 14 mm

The width of 14 mm is standard, facilitating easier integration into existing designs.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

The rich set of peripherals enhances the microcontroller's capabilities for various applications like monitoring, timing, and data handling.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz ensures fast processing speeds for responsive applications.

Length: 14 mm

With a length of 14 mm, the microcontroller fits standard designs with ease.

Temperature Grade: INDUSTRIAL

Industry-grade temperature performance ensures reliability in harsh environments typical for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides higher performance with lower power consumption, ideal for embedded systems.

No. of Timers: 8

Eight timers allow for complex timing applications such as generating multiple events or controlling processes.

Technology: CMOS

CMOS technology allows for low power consumption, making it suitable for battery-powered and portable devices.

Terminal Form: GULL WING

The gull-wing terminal form ensures good solder joint integrity, which is crucial for long-lasting applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V makes it compatible with many existing systems and components.

No. of DMA Channels: 7

Seven DMA channels provide ample bandwidth for high data throughput without burdening the CPU.

PWM Channels: YES

Integrated PWM channels allow for advanced control features such as motor speed control and dimming applications.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Multiple connectivity options provide flexibility in communication with other devices, crucial for complex applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in the application, enhancing user experience.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density layouts, maximizing space on the PCB.

Speed: 32 rpm

The speed capability allows for responsive control in real-time applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is efficient for data processing and allows for cost-effective design.

No. of I/O Lines: 84

With 84 I/O lines, this microcontroller can handle numerous external components simultaneously, boosting functionality.

Technical Specifications

Microcontrollers STM32L071VBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

7

No. of I/O Lines:

84

No. of Terminals:

100

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071VBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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