Loading...

STM32L071CZT3TR

STMicroelectronics

STM32L071CZT3TR by STMicroelectronics

STM32L071CZT3TR by STMicroelectronics is a low-power 32-bit microcontroller ideal for automotive applications. It operates b/w -40 °C to 125 °C, with a supply voltage range of 1.8V to 3.6V and features include ADC, DMA, and multiple connectivity options. Its compact design (7mm x 7mm) ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,979

-

-

-

-

Anansix

USA . 2,507 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,507

-

-

-

-

Digiode

USA . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,572 parts In-Stock

1+ parts

$3.390

100+ parts

-

1k+ parts

-

10k+ parts

-

7,572

$3.390

-

-

-

AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$12.450

100+ parts

-

1k+ parts

-

10k+ parts

-

623

$12.450

-

-

-

Microchip USA

USA . 4,572 parts In-Stock

1+ parts

$25.340

100+ parts

$25.180

1k+ parts

$25.100

10k+ parts

$25.030

4,572

$25.340

$25.180

$25.100

$25.030

IDEA Electronic Components Group

UK . 938 parts In-Stock

1+ parts

$39.082

100+ parts

-

1k+ parts

$35.173

10k+ parts

-

938

$39.082

-

$35.173

-

MKK Technologies

India . 1,067 parts In-Stock

1+ parts

$73.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,067

$73.490

-

-

-

DigiPath Technology Company

USA . 1,067 parts In-Stock

1+ parts

$73.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,067

$73.490

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,193

-

-

-

-

Corphita

USA . 2,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,883

-

-

-

-

Parana Technologies

USA . 724 parts In-Stock

1+ parts

-

100+ parts

$46.728

1k+ parts

-

10k+ parts

-

724

-

$46.728

-

-

Overview

Unlock innovation with the STM32L071CZT3TR microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Tailored for low-power applications, it excels in energy efficiency without compromising performance, making it ideal for IoT devices, wearable tech, and automotive systems. Experience seamless connectivity and robust features that empower your designs while benefiting from ST's commitment to excellence and reliability—fueling your projects with superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for compact designs and ease of integration into modern PCBs.

Maximum Supply Voltage: 3.6 V

The relatively low maximum supply voltage increases compatibility with various power sources and helps reduce power consumption.

Package Shape: SQUARE

A square shape allows for uniform thermal management and easier alignment during PCB assembly.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and larger data sets efficiently.

No. of Terminals: 48

The high number of terminals provides flexibility in interfacing with various peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style aids in reducing the overall height of assemblies and allows for higher density designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enhances the microcontroller's suitability for battery-operated applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this microcontroller reliable for automotive applications.

CPU Family: CORTEX-M0

The Cortex-M0 core offers low power consumption and efficiency, ideal for energy-sensitive applications.

Minimum Operating Temperature: -40 °C

This extreme temperature range ensures performance in harsh environments, meeting the requirements of automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels allow for direct sensor interfacing, making it suitable for analog data acquisition.

DMA Channels: YES

The presence of DMA channels improves data handling efficiency, allowing for faster data transfers with minimal CPU intervention.

Terminal Position: QUAD

Quad terminal positioning enhances the mounting options and stability of the microcontroller on the PCB.

ROM Words: 196608

A significant amount of ROM storage allows for complex programs and large firmware applications.

Maximum Seated Height: 1.6 mm

A low seated height aids in creating slimmer and more compact designs in electronic devices.

Width: 7 mm

The compact width contributes to space efficiency in designs, accommodating tight layouts.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

A rich set of peripherals increases the microcontroller's versatility across multiple applications.

Maximum Clock Frequency: 32 MHz

The clock frequency supports efficient processing for various real-time applications without excessive power usage.

Length: 7 mm

The overall length maintains a compact profile, allowing for easier placement in dense electronic designs.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, it is designed to withstand the rigors of car environments, ensuring reliability.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it can execute instructions faster and more efficiently, enhancing overall performance.

No. of Timers: 8

Eight timers allow for precise control in various timing and event-driven applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it a good choice for portable devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring strong electrical connections.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is compatible with common battery levels, enhancing its applicability in portable devices.

No. of DMA Channels: 7

Seven DMA channels provide significant bandwidth for large data transfers, improving processing efficiency.

PWM Channels: YES

Integration of PWM channels allows for precise control in applications such as motor control and dimming LEDs.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Multiple connectivity options enable seamless communication with a wide range of devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows firmware updates and easy reprogramming of the microcontroller, enhancing flexibility.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for a higher density of connections, beneficial in compact PCB designs.

Speed: 32 rpm

Although typically a measure of motor speed, this value indicates responsiveness in the system, suitable for performance-critical applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width is suitable for addressing simple tasks with minimal complexity.

No. of I/O Lines: 37

A large number of I/O lines offers flexibility for connecting various peripherals and external devices.

Technical Specifications

Microcontrollers STM32L071CZT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

37

No. of Terminals:

48

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071CZT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20