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STM32L071CBT3TR

STMicroelectronics

STM32L071CBT3TR by STMicroelectronics

STM32L071CBT3TR from STMicroelectronics is a 32-bit microcontroller ideal for automotive applications, operating b/w -40 °C to 125 °C. It features a max supply voltage of 3.6V, 48 terminals, and supports multiple connectivity options like I2C and SPI. With integrated ADC and DMA channels, it excels in low-power embedded systems.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 7,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.320

7,200

-

-

-

$2.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 7,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.016

7,200

-

-

-

$3.016

Vyrian

USA . 4,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

4,450

-

-

-

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Digiode

USA . 2,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,715

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-

-

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Anansix

USA . 1,532 parts In-Stock

1+ parts

-

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1,532

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$3.030

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

$3.030

-

-

-

AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$17.570

100+ parts

-

1k+ parts

-

10k+ parts

-

638

$17.570

-

-

-

IDEA Electronic Components Group

UK . 1,100 parts In-Stock

1+ parts

$21.675

100+ parts

-

1k+ parts

$19.508

10k+ parts

-

1,100

$21.675

-

$19.508

-

Microchip USA

USA . 3,602 parts In-Stock

1+ parts

$23.040

100+ parts

$22.900

1k+ parts

$22.830

10k+ parts

$22.750

3,602

$23.040

$22.900

$22.830

$22.750

MKK Technologies

India . 740 parts In-Stock

1+ parts

$40.759

100+ parts

-

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-

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740

$40.759

-

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DigiPath Technology Company

USA . 740 parts In-Stock

1+ parts

$40.759

100+ parts

-

1k+ parts

-

10k+ parts

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740

$40.759

-

-

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Component Stockers USA

USA . 2,362 parts In-Stock

1+ parts

$49.460

100+ parts

-

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2,362

$49.460

-

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Corphita

USA . 1,799 parts In-Stock

1+ parts

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1,799

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Parana Technologies

USA . 1,777 parts In-Stock

1+ parts

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100+ parts

$25.916

1k+ parts

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10k+ parts

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1,777

-

$25.916

-

-

Overview

Unlock the potential of your projects with the STM32L071CBT3TR microcontroller from STMicroelectronics, a trusted industry leader in high-quality semiconductor solutions. Designed for low-power applications, this versatile chip excels in automotive and IoT innovation, offering seamless connectivity and robust performance. Experience enhanced efficiency and reliability, empowering you to create cutting-edge devices that stand out in today's competitive landscape. Choose excellence; choose STM32!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliable performance and longevity in various environments.

Surface Mount: YES

Allows for compact designs and efficient use of PCB space, making it ideal for modern applications.

Maximum Supply Voltage: 3.6 V

Provides versatility for various applications that require low voltage operation.

Package Shape: SQUARE

Optimal shape for surface mount technology, facilitating effective thermal performance.

Bit Size: 32

A 32-bit architecture enhances processing capabilities, suitable for complex applications.

No. of Terminals: 48

Offers a significant number of terminals, allowing for extensive I/O options for various functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design ensures space efficiency and is ideal for compact electronic devices.

Minimum Supply Voltage: 1.8 V

Flexibility in voltage requirements supports low-power applications, extending battery life.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes it suitable for automotive and industrial applications.

CPU Family: CORTEX-M0

ARM Cortex-M0 core provides high performance with low power consumption, perfect for embedded systems.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures ensures reliability in harsh conditions.

ADC Channels: YES

Inclusion of ADC channels enables the microcontroller to interact with analog signals, enhancing its versatility.

DMA Channels: YES, No. of DMA Channels: 7

DMA support improves data transfer efficiency, allowing the CPU to perform other tasks while data is processed.

Terminal Position: QUAD

Quad terminal positioning provides a reliable mounting and soldering option for enhanced connectivity.

ROM Words: 131072

Ample ROM memory supports complex applications and larger code bases without the need for external memory.

Maximum Seated Height: 1.6 mm

Slim profile helps in designing compact products, especially where space is limited.

Width: 7 mm, Length: 7 mm

Small physical dimensions make it suitable for space-constrained applications, facilitating innovative designs.

Temperature Grade: AUTOMOTIVE

Automotive grade quality assures durability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient instruction sets, resulting in improved performance and energy efficiency.

No. of Timers: 8

Multiple timers allow for precise timing control in various applications, improving functionality.

Technology: CMOS

CMOS technology ensures low power consumption alongside high-speed performance.

Terminal Form: GULL WING

Gull wing terminal form factor allows for easy soldering, facilitating reliable connections.

Nominal Supply Voltage: 3 V

The nominal voltage aligns well with battery-operated devices, optimizing energy efficiency.

PWM Channels: YES

PWM support makes it ideal for applications requiring motor control and signal modulation.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Multiple connectivity options ensure versatility and compatibility with various peripherals and sensors.

ROM Programmability: FLASH

Flash memory provides easy program updates, enhancing flexibility in application development.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density connections, essential for modern compact designs.

Speed: 32 rpm

32 MHz clock speed allows for efficient processing capability suitable for demanding applications.

On Chip Program ROM Width: 8

8-bit width for program ROM optimizes the size of data handled, providing efficient throughput.

No. of I/O Lines: 37

A generous number of I/O lines enables extensive interfacing capabilities, ideal for varied project requirements.

Technical Specifications

Microcontrollers STM32L071CBT3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

37

No. of Terminals:

48

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071CBT3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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