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STM32L071C8T7

STMicroelectronics

STM32L071C8T7 by STMicroelectronics

STM32L071C8T7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 105 °C, and supports up to 48 terminals. With a max supply voltage of 3.6V and integrated ADC/DMA channels, it's ideal for low-power industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$2.672

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,971 parts In-Stock

1+ parts

$2.672

100+ parts

$2.176

1k+ parts

$1.904

10k+ parts

-

5,971

$2.672

$2.176

$1.904

-

Verical

USA . 5,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,971

-

-

-

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EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

-

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1,000

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-

Distributors (In-Stock)

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Vyrian

USA . 7,187 parts In-Stock

1+ parts

-

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-

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7,187

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-

-

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Elcom Components

USA . 4,500 parts In-Stock

1+ parts

-

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4,500

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Anansix

USA . 2,891 parts In-Stock

1+ parts

-

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2,891

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Digiode

USA . 2,673 parts In-Stock

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-

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2,673

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,590 parts In-Stock

1+ parts

$2.520

100+ parts

-

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-

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-

1,590

$2.520

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-

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AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$15.710

100+ parts

-

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464

$15.710

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Microchip USA

USA . 2,652 parts In-Stock

1+ parts

$20.104

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2,652

$20.104

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Component Stockers USA

USA . 3,768 parts In-Stock

1+ parts

$32.920

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3,768

$32.920

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IDEA Electronic Components Group

UK . 152 parts In-Stock

1+ parts

$34.813

100+ parts

-

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$31.332

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152

$34.813

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$31.332

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MKK Technologies

India . 1,362 parts In-Stock

1+ parts

$65.463

100+ parts

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1,362

$65.463

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$65.463

100+ parts

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1,362

$65.463

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Perfect Parts

USA . 712,320 parts In-Stock

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712,320

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

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$41.624

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1,731

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$41.624

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Corphita

USA . 1,217 parts In-Stock

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1,217

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Overview

Unlock the potential of your next project with the STM32L071C8T7 microcontroller from STMicroelectronics—a trusted leader in innovation. This versatile, low-power solution is perfect for smart applications, IoT devices, and industrial automation, delivering exceptional performance without compromising energy efficiency. Experience seamless integration and reliability, ensuring your designs thrive in demanding environments while maximizing value and reducing time to market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and reliability, making this microcontroller suitable for industrial applications.

Surface Mount: YES

Surface mount design allows for compact layout and integration into modern electronic circuits, facilitating versatile design options.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage enhances compatibility with battery-operated devices, extending operational life.

Package Shape: SQUARE

The square shape provides uniform thermal performance and efficient space utilization on the PCB.

Bit Size: 32

32-bit architecture allows for processing of larger data types and improved performance in complex applications.

No. of Terminals: 48

A higher number of terminals enables more peripheral connections, ensuring extensive interfacing capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile design is ideal for space-constrained applications, allowing for flexible placement in compact designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for energy-efficient designs, especially in battery-managed devices.

Maximum Operating Temperature: 105 °C

High temperature tolerance makes this microcontroller suitable for demanding industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 architecture provides low power consumption with efficient performance for embedded applications.

Minimum Operating Temperature: -40 °C

Extreme temperature range ensures reliable operation in harsh conditions, making it suitable for outdoor and industrial use.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, increasing the microcontroller's versatility.

DMA Channels: YES

The presence of DMA channels enhances data transfer efficiency, freeing up CPU time for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates easy PCB routing and effective signal integrity.

ROM Words: 65536

This ample ROM capacity supports advanced application development while allowing for substantial program storage.

Maximum Seated Height: 1.6 mm

The compact seated height allows for integration in slim profiles and tight web designs.

Width: 7 mm

A width of 7 mm promotes space-saving designs, suitable for various consumer and industrial electronics.

Peripherals: BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Diverse peripheral support facilitates the development of complex functionalities in a single chip.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency provides efficient processing speed, enabling smooth operation of tasks.

Length: 7 mm

Similar to the width, the length of 7 mm supports tight PCB layouts without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade components provide reliability for long-term deployment in critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures reduced instruction cycles for higher speed per clock cycle performance.

No. of Timers: 8

Multiple timers allow for precise timing operations and event management in applications.

Technology: CMOS

CMOS technology benefits in lower power consumption, making it ideal for battery-operated applications.

Terminal Form: GULL WING

Gull-wing terminals ensure easy soldering and better mechanical stability on the PCB.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage aligns with prevalent power supply options, enhancing integration.

No. of DMA Channels: 7

Multiple DMA channels provide flexibility in data handling while minimizing CPU load.

PWM Channels: YES

PWM capability allows for efficient motor control and other pulse-width modulation applications.

Connectivity: I2C(3), I2S, LPUART, SPI(6), USART(4)

Diverse connectivity options support a wide range of external devices and protocols, enhancing application versatility.

ROM Programmability: FLASH

Flash programmability enables easy updates and flexibility in applications, facilitating rapid prototyping.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density connections on the PCB, maximizing design efficiency.

Speed: 32 rpm

An operational speed of 32 rpm signifies efficiency in applications such as control systems.

On Chip Program ROM Width: 8

8-bit ROM width enhances compatibility with a variety of data types and memory allocation strategies.

No. of I/O Lines: 37

A generous number of I/O lines provide considerable interfacing capabilities for various sensors and actuators.

Technical Specifications

Microcontrollers STM32L071C8T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of DMA Channels:

7

No. of I/O Lines:

37

No. of Terminals:

48

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(3), I2S, LPUART, SPI(6), USART(4)

Peripherals:

BOR, COMPARATOR, DMA(7), POR, RTC, TIMER(8), WDT(2)

Trade Compliance

STM32L071C8T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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