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STM32L053R8H6D

STMicroelectronics

STM32L053R8H6D by STMicroelectronics

STM32L053R8H6D microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.65V and 3.6V, and supports up to 15 ADC channels. With a max clock frequency of 25 MHz, it's ideal for low-power applications like IoT devices. Its compact design includes 64 terminals in a thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,410 parts In-Stock

1+ parts

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5,410

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Digiode

USA . 2,076 parts In-Stock

1+ parts

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2,076

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Anansix

USA . 1,646 parts In-Stock

1+ parts

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1,646

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,880 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,880

$2.830

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AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$14.910

100+ parts

-

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10k+ parts

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894

$14.910

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Microchip USA

USA . 4,871 parts In-Stock

1+ parts

$21.170

100+ parts

$21.040

1k+ parts

$20.970

10k+ parts

$20.910

4,871

$21.170

$21.040

$20.970

$20.910

IDEA Electronic Components Group

UK . 672 parts In-Stock

1+ parts

$44.769

100+ parts

-

1k+ parts

$40.292

10k+ parts

-

672

$44.769

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$40.292

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MKK Technologies

India . 1,756 parts In-Stock

1+ parts

$84.185

100+ parts

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1,756

$84.185

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DigiPath Technology Company

USA . 1,756 parts In-Stock

1+ parts

$84.185

100+ parts

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1,756

$84.185

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Corphita

USA . 2,714 parts In-Stock

1+ parts

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2,714

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Parana Technologies

USA . 689 parts In-Stock

1+ parts

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100+ parts

$53.528

1k+ parts

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689

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$53.528

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Overview

Unlock the potential of your next project with the STM32L053R8H6D microcontroller from STMicroelectronics. Renowned for its reliability and innovation, STMicroelectronics delivers this compact powerhouse designed for energy-efficient applications in IoT, wearable tech, and industrial automation. With impressive performance in a thin-profile package, it ensures seamless connectivity and advanced functionalities, helping you create smart, responsive solutions while maximizing value and efficiency. Embrace quality and excellence with STM32!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern circuit boards, saving space in designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with low-power applications, extending battery life.

Package Shape: SQUARE

The square package shape optimizes space usage on PCBs, allowing for efficient layout and potentially reducing costs.

Bit Size: 32

The 32-bit architecture provides improved processing power and efficiency, enabling the handling of complex tasks and algorithms.

DAC Channels: YES

Having DAC channels enhances the microcontroller’s capability to convert digital signals to analog, useful in audio and signal processing applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers extensive connectivity options, making it versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package facilitates high-density packaging, suitable for advanced electronics.

Minimum Supply Voltage: 1.65 V

A minimum supply voltage of 1.65 V allows the microcontroller to operate efficiently in low-power scenarios, ideal for battery-operated devices.

Maximum Operating Temperature: 85 °C

Rated for a maximum operating temperature of 85 °C, it can withstand high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures reliable performance in extreme cold conditions, critical for outdoor applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to gather analog inputs, expanding its application in sensor interfaces.

DMA Channels: YES

DMA channels enhance data transfer efficiency, allowing for high-performance applications where speed is critical.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better layout designs and can improve thermal performance in various applications.

ROM Words: 65536

With 65536 ROM words available, this microcontroller stands out for its programmability and storage capabilities for code and data.

Maximum Seated Height: 1.2 mm

The low seated height supports the design of slim and compact devices, which is a significant advantage in portable applications.

Digital To Analog Convertors: 1-Ch 12-Bit

The 1-channel, 12-bit DAC provides good resolution for applications requiring precise analog signal output.

Width: 5 mm

At a width of just 5 mm, this microcontroller is ideal for space-constrained designs, such as wearables or compact consumer electronics.

Data EEPROM Size: 2K

A 2K EEPROM size is beneficial for saving small, frequently changing data, making it perfect for certain applications.

Peripherals: COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(6), WDT(2)

Rich peripheral set enhances the microcontroller’s capabilities, facilitating a wide variety of interfacing and control scenarios.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz allows for rapid processing and execution of tasks, improving overall performance.

Length: 5 mm

With a length of 5 mm, this microcontroller maintains a compact footprint, adding to its versatility in diverse applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this microcontroller a robust choice for critical applications in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of RISC architecture ensures efficient processing and lower power consumption, beneficial for battery-operated devices.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can handle complex data processing tasks, suitable for various applications.

Technology: CMOS

CMOS technology enhances performance with lower power consumption, making it suitable for portable and battery-sensitive applications.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and allows for improved thermal performance in high-density packaging.

Analog To Digital Convertors: 15-Ch 12-Bit

With 15 channels of 12-bit ADC, the microcontroller excels in applications requiring accurate analog signal measurement.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is suitable for low-power applications, enhancing battery longevity in devices.

PWM Channels: YES

The inclusion of PWM channels is essential for motor control and dimming applications, adding versatility to its functionality.

Connectivity: I2C(2), I2S, SPI(4), UART, USART(2), USB

Wide connectivity options allow seamless integration with other devices and peripherals, enhancing communication capabilities.

ROM Programmability: FLASH

Flash programmability allows for convenient updating of firmware, making it easy to modify applications as requirements evolve.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm facilitates compact designs and high-density layouts, essential for modern electronic devices.

Speed: 32 rpm

At a speed of 32 rpm, this microcontroller is optimized for real-time processing in controlling various mechanical applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a wide range of applications and ensures compatibility with various programming environments.

No. of I/O Lines: 50

Having 50 I/O lines offers significant flexibility in device interfacing, enabling a broader range of applications.

Technical Specifications

Microcontrollers STM32L053R8H6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), I2S, SPI(4), UART, USART(2), USB

Peripherals:

COMPARATOR(2), DMA(7), LCD, POR, RTC, TIMER(6), WDT(2)

Analog To Digital Convertors:

15-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L053R8H6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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