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STM32L053C8U6D

STMicroelectronics

STM32L053C8U6D by STMicroelectronics

STM32L053C8U6D from STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates at up to 25 MHz. It features ADC, DMA, and PWM channels, making it ideal for low-power applications like IoT devices. Its compact design (7x7 mm) ensures efficient integration in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,089 parts In-Stock

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3,089

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Digiode

USA . 463 parts In-Stock

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463

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Anansix

USA . 329 parts In-Stock

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329

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Vigor

Singapore . 4,768 parts In-Stock

1+ parts

$2.530

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4,768

$2.530

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AZTECH Wire

Italy . 57 parts In-Stock

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$11.140

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57

$11.140

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IDEA Electronic Components Group

UK . 972 parts In-Stock

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$15.035

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$13.531

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972

$15.035

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$13.531

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Microchip USA

USA . 2,853 parts In-Stock

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$20.260

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$20.140

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$20.070

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$20.010

2,853

$20.260

$20.140

$20.070

$20.010

MKK Technologies

India . 281 parts In-Stock

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$28.272

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DigiPath Technology Company

USA . 281 parts In-Stock

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$28.272

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281

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Component Stockers USA

USA . 1,719 parts In-Stock

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$44.530

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$44.530

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QUARKTWIN TECHNOLOGY LTD

USA . 11,376 parts In-Stock

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Corphita

USA . 3,688 parts In-Stock

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Parana Technologies

USA . 371 parts In-Stock

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$17.976

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371

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$17.976

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Overview

Unlock innovation with the STM32L053C8U6D microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for low-power applications, it delivers outstanding performance and efficiency, making it ideal for wearables, IoT devices, and smart sensors. With a compact design and versatile features, this microcontroller empowers developers to create next-gen solutions effortlessly. Trust in STMicroelectronics for unmatched quality and support that drives your projects forward!

Feature Benefit Bullets

Surface Mount: YES

Being surface mount compatible allows for a more compact design, making it suitable for applications where space is a constraint.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage offers flexibility in power supply options, accommodating various power management schemes.

Package Shape: SQUARE

A square package shape aids in uniform heat distribution, an important factor for maintaining performance in embedded applications.

Bit Size: 32

A 32-bit architecture provides a good balance of performance and efficiency, enabling the microcontroller to handle complex computations.

No. of Terminals: 48

With 48 terminals, this microcontroller offers a substantial number of I/O options for interfacing with various peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile reduces weight and size, which is ideal for portable and compact devices.

Minimum Supply Voltage: 1.65 V

This low minimum supply voltage allows the microcontroller to be used in battery-powered devices, extending operational life.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to process analog signals directly, enhancing its versatility in sensor applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer without CPU intervention, allowing for high-speed data handling.

Terminal Position: QUAD

Quad terminal positioning allows for a more straightforward PCB layout, promoting better signal integrity.

Width: 7 mm

A compact width enhances the potential for design miniaturization, increasingly important in modern electronics.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides adequate processing speed for a wide variety of applications.

Length: 7 mm

The 7 mm length contributes to compact designs, which is beneficial for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for faster instruction execution and efficient power usage, enhancing performance.

Terminal Form: NO LEAD

No lead terminals improve solderability and reduce the risk of mechanical failure due to lead fatigue.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is optimal for a wide range of applications, ensuring compatibility with various power supplies.

PWM Channels: YES

PWM channels allow for precise control of motor speeds and other applications requiring variable signal outputs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suited for high-density applications, allowing more components to fit within confined spaces.

Speed: 32 rpm

A speed rating of 32 rpm indicates suitability for low-speed applications such as sensors and control systems.

No. of I/O Lines: 37

With 37 I/O lines, this microcontroller enables ample connectivity for peripherals, sensors, and actuators.

Technical Specifications

Microcontrollers STM32L053C8U6D attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32L053C8U6D Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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