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STM32L053C8T3

STMicroelectronics

STM32L053C8T3 by STMicroelectronics

STM32L053C8T3 microcontroller from STMicroelectronics features a 32-bit architecture, operates b/w 1.8V and 3.6V, and supports up to 25 MHz clock speed. With integrated ADC/DAC channels and multiple connectivity options, it's ideal for automotive applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,618 parts In-Stock

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4,618

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Anansix

USA . 1,164 parts In-Stock

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1,164

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Digiode

USA . 178 parts In-Stock

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178

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Distributors (Availability)

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AZTECH Wire

Italy . 891 parts In-Stock

1+ parts

$14.650

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891

$14.650

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Microchip USA

USA . 3,258 parts In-Stock

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$24.318

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3,258

$24.318

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IDEA Electronic Components Group

UK . 2,331 parts In-Stock

1+ parts

$24.820

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$22.338

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2,331

$24.820

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$22.338

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MKK Technologies

India . 2,207 parts In-Stock

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$46.672

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2,207

$46.672

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DigiPath Technology Company

USA . 2,207 parts In-Stock

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$46.672

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2,207

$46.672

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Component Stockers USA

USA . 1,379 parts In-Stock

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$55.320

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1,379

$55.320

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Parana Technologies

USA . 927 parts In-Stock

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$29.676

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927

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$29.676

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Corphita

USA . 344 parts In-Stock

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Overview

Unlock limitless possibilities with the STM32L053C8T3 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficiency and versatility, this 32-bit powerhouse excels in low-power applications while delivering reliable performance across various industries—from wearable devices to smart home technology. Experience superior quality, robust support, and unmatched value, ensuring your projects thrive in any environment. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material ensures longevity and reliability in various applications.

Surface Mount: YES

Facilitates compact designs and efficient circuit layouts, ideal for modern electronics.

Maximum Supply Voltage: 3.6 V

Allows flexibility in power supply options while maintaining low power consumption.

Package Shape: SQUARE

Efficient use of space in PCB designs, promoting ease of integration.

Bit Size: 32

Supports complex calculations and operations, making it suitable for advanced applications.

DAC Channels: YES

Enables precise analog output, beneficial for audio and signal processing applications.

No. of Terminals: 48

Provides ample connectivity options for extensive peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal for space-constrained designs, ensuring a sleek form factor.

Minimum Supply Voltage: 1.8 V

Wide voltage range supports battery-powered designs and energy-efficient applications.

Maximum Operating Temperature: 125 °C

Designed for high reliability in harsh environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme temperatures, ideal for outdoor and industrial use.

ADC Channels: YES

Facilitates analog input processing, essential for sensor applications.

DMA Channels: YES

Enhances data transfer efficiency by allowing peripherals to access memory independently, reducing CPU load.

Terminal Position: QUAD

Allows for effective placement on PCBs, maximizing layout flexibility.

ROM Words: 65536

Provides substantial program storage, enabling complex applications and firmware.

Maximum Seated Height: 1.6 mm

Low profile design is suitable for compact electronic devices.

Digital To Analog Converters: 1-Ch 12-Bit

High-resolution DAC enables excellent performance in audio and control applications.

Width: 7 mm

Compact size helps in reducing PCB area, facilitating smaller devices.

Data EEPROM Size: 2K

Allows for non-volatile data storage, essential for settings retention in embedded systems.

Peripherals: BOR, COMPARATOR(2), DMA, LCD, POR, RTC, TIMER(7), WDT(2)

A rich set of built-in peripherals enhances functionality, making it versatile for various applications.

Maximum Clock Frequency: 25 MHz

Offers adequate processing speed for real-time applications and interim signal processing.

Length: 7 mm

Compact footprint enables space-efficient designs without sacrificing functionality.

Temperature Grade: AUTOMOTIVE

Ensures high reliability and compliance with automotive standards, suitable for automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient processing and low power consumption.

RAM Bytes: 8192

Ample RAM size supports complex processing tasks and data handling.

Technology: CMOS

Low power consumption and high integration capability, ideal for portable applications.

Terminal Form: GULL WING

Effective for soldering and enhances reliability in mounted applications.

Analog To Digital Converters: 10-Ch 12-Bit

High-resolution ADCs provide accurate digital representation of analog signals for data acquisition.

Nominal Supply Voltage: 3 V

Standard voltage, simplifying design and compliance with common electronic components.

PWM Channels: YES

Supports motor control and signal modulation applications.

Connectivity: I2C(2), I2S, SPI(4), UART, USART(2), USB

Diverse communication interfaces enable seamless integration into various systems.

ROM Programmability: FLASH

Allows for easy updates and rewrites, providing flexibility for firmware development.

Terminal Pitch: 0.5 mm

Fine pitch aids in high-density designs, maximizing PCB design efficiency.

Speed: 32 rpm

Provides sufficient speed for many standard applications, ensuring effective operation.

On Chip Program ROM Width: 8

Standard width enhances compatibility and facilitates efficient programming.

No. of I/O Lines: 37

Generous I/O options support connectivity with multiple devices and peripherals.

Technical Specifications

Microcontrollers STM32L053C8T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2), I2S, SPI(4), UART, USART(2), USB

Peripherals:

BOR, COMPARATOR(2), DMA, LCD, POR, RTC, TIMER(7), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L053C8T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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