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STM32L041F6P7

STMicroelectronics

STM32L041F6P7 by STMicroelectronics

STM32L041F6P7 by STMicroelectronics is a 32-bit microcontroller with 26 external interrupts, 10 ADC channels, and 8 timers. Operating at up to 25 MHz, it features low power mode and offers connectivity through I2C, LPUART, SPI, and USART. Ideal for industrial applications requiring high performance in a compact form factor.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 107 parts In-Stock

1+ parts

$1.440

100+ parts

$1.350

1k+ parts

$1.290

10k+ parts

-

107

$1.440

$1.350

$1.290

-

Mouser Electronics

USA . 4,150 parts In-Stock

1+ parts

$2.070

100+ parts

$1.390

1k+ parts

$1.090

10k+ parts

$0.986

4,150

$2.070

$1.390

$1.090

$0.986

DigiKey

USA . 39 parts In-Stock

1+ parts

$2.070

100+ parts

$1.238

1k+ parts

$1.124

10k+ parts

$1.024

39

$2.070

$1.238

$1.124

$1.024

Element14

Singapore . 555 parts In-Stock

1+ parts

$2.760

100+ parts

$2.550

1k+ parts

$2.390

10k+ parts

-

555

$2.760

$2.550

$2.390

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,333 parts In-Stock

1+ parts

$0.933

100+ parts

-

1k+ parts

-

10k+ parts

-

4,333

$0.933

-

-

-

Vyrian

USA . 4,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,256

-

-

-

-

Anansix

USA . 1,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,521

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,942 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

-

10k+ parts

-

4,942

$0.884

-

-

-

Continental Prestige Electronics

USA . 5,836 parts In-Stock

1+ parts

$2.380

100+ parts

$1.670

1k+ parts

$1.260

10k+ parts

-

5,836

$2.380

$1.670

$1.260

-

Vigor

Singapore . 2,614 parts In-Stock

1+ parts

$2.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,614

$2.980

-

-

-

IDEA Electronic Components Group

UK . 318 parts In-Stock

1+ parts

$63.085

100+ parts

-

1k+ parts

$56.777

10k+ parts

-

318

$63.085

-

$56.777

-

MKK Technologies

India . 1,911 parts In-Stock

1+ parts

$118.628

100+ parts

-

1k+ parts

-

10k+ parts

-

1,911

$118.628

-

-

-

DigiPath Technology Company

USA . 1,911 parts In-Stock

1+ parts

$118.628

100+ parts

-

1k+ parts

-

10k+ parts

-

1,911

$118.628

-

-

-

Lixinc

USA . 9,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,299

-

-

-

-

Parana Technologies

USA . 1,437 parts In-Stock

1+ parts

-

100+ parts

$75.428

1k+ parts

-

10k+ parts

-

1,437

-

$75.428

-

-

Perfect Parts

USA . 663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

663

-

-

-

-

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Eastek

USA . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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38

-

-

-

-

Overview

Unlock the power of innovation with the STM32L041F6P7 microcontroller by STMicroelectronics. Crafted with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features and capabilities that deliver exceptional performance. Experience seamless connectivity with I2C, LPUART, SPI, and USART interfaces. Say goodbye to limitations and hello to endless possibilities with the STM32L041F6P7. Elevate your projects with this cutting-edge technology and redefine what is possible in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength, insulation, and resistance to heat and chemicals, making the microcontroller durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing manufacturing costs and saving space on the board.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows the microcontroller to work with a wide range of power sources without risking damage.

Package Shape: RECTANGULAR

Rectangular package shape provides easy integration into various designs and allows for efficient use of available board space.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex computations and process large amounts of data quickly and efficiently.

No. of Terminals: 20

Having 20 terminals allows for a sufficient number of connections for interfacing with external components, peripherals, and communication interfaces.

No. of External Interrupts: 26

With 26 external interrupts, the microcontroller can respond to a variety of external events and signals promptly, enhancing real-time responsiveness.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures of -40°C ensures reliable performance in harsh environmental conditions.

ADC Channels: YES

Integrated Analog-to-Digital Converters (ADC) allow the microcontroller to interface with analog sensors and signals, enabling precise data acquisition and processing.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between memory and peripherals, reducing CPU load and enhancing overall system performance.

ROM Words: 32768

With 32K words of Read-Only Memory (ROM), the microcontroller can store program instructions and data, allowing for versatile and feature-rich applications.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency of 25 MHz enables fast execution of instructions and efficient operation of the microcontroller, suitable for demanding applications.

RAM Bytes: 8192

8K bytes of Random Access Memory (RAM) provides ample storage for variables, data buffers, and stack operations, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide voltage range, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADCs allow for high-resolution analog-to-digital conversion, enabling accurate measurement and processing of analog signals.

PWM Channels: YES

Pulse-Width Modulation (PWM) channels provide precise control over analog outputs such as motor speed, LED brightness, and audio volume, enhancing system flexibility.

Connectivity: I2C, LPUART, SPI(2), USART

Support for multiple communication interfaces like I2C, SPI, and UART enables versatile connectivity with external devices, sensors, and networks, expanding the microcontroller's applicability.

Low Power Mode: YES

Low power mode functionality allows the microcontroller to operate in power-saving modes, extending battery life in portable devices and reducing overall power consumption.

Technical Specifications

Microcontrollers STM32L041F6P7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Low Power Mode:

YES

No. of DMA Channels:

7

No. of External Interrupts:

26

No. of I/O Lines:

15

No. of Terminals:

20

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

32 rpm

Maximum Supply Current:

5.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.3 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

I2C, LPUART, SPI(2), USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(4), RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L041F6P7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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