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STM32L031K6U3

STMicroelectronics

STM32L031K6U3 by STMicroelectronics

STM32L031K6U3 by STMicroelectronics is a 32-bit microcontroller with 32 terminals, operating at up to 25 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for automotive applications due to its wide temperature range of -40°C to 125°C. With various peripherals like PWM, UART, and SPI, it offers versatile connectivity options for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,469 parts In-Stock

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6,469

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Anansix

USA . 464 parts In-Stock

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464

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Digiode

USA . 335 parts In-Stock

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335

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Nova Conductors

Japan . 90 parts In-Stock

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90

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Distributors (Availability)

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AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$11.221

100+ parts

-

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336

$11.221

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Microchip USA

USA . 4,463 parts In-Stock

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$15.112

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4,463

$15.112

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Aztec Data Supply Inc.

USA . 2,759 parts In-Stock

1+ parts

$30.825

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2,759

$30.825

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Ampacity Inc.

Singapore . 634 parts In-Stock

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$34.000

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634

$34.000

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

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$34.039

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$30.635

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1,632

$34.039

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$30.635

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Corohmni

South Africa . 6 parts In-Stock

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$44.339

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6

$44.339

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MKK Technologies

India . 1,590 parts In-Stock

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$64.008

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1,590

$64.008

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DigiPath Technology Company

USA . 1,590 parts In-Stock

1+ parts

$64.008

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1,590

$64.008

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Continental Prestige Electronics

USA . 3,920 parts In-Stock

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3,920

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Argo Parts USA

USA . 2,823 parts In-Stock

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2,823

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,531 parts In-Stock

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$40.699

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1,531

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$40.699

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Corphita

USA . 877 parts In-Stock

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877

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Overview

Unleash the power of innovation with the STM32L031K6U3 microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality products that exceed expectations. This microcontroller offers a wide range of applications in various industries, providing unmatched value and benefits to customers. Experience superior performance, reliable connectivity, and advanced features with the STM32L031K6U3, making it the perfect choice for your next project. Elevate your designs with STMicroelectronics today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and ensuring reliable connections.

Maximum Supply Voltage: 3.6 V

Can operate at a higher voltage, providing flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for easy placement and compact design on PCBs.

Bit Size: 32

32-bit architecture provides higher computational power and performance.

No. of Terminals: 32

Sufficient terminals for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles for different mounting and cooling requirements.

Minimum Supply Voltage: 1.8 V

Can operate at a lower voltage, suitable for low power applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding industrial applications.

CPU Family: CORTEX-M0

Belongs to the energy-efficient and cost-effective ARM Cortex-M0 CPU family.

Minimum Operating Temperature: -40 °C

Capable of operating in harsh environments with low temperatures.

ADC Channels: YES

Built-in Analog to Digital Converters for accurate conversion of analog signals.

DMA Channels: YES

Direct Memory Access channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position enables easy connection and organization of terminals on the chip.

ROM Words: 32768

Ample ROM words for storing program code and data.

Maximum Seated Height: 0.6 mm

Low seated height for compact and slim designs.

Width: 5 mm

Compact width for space-constrained applications.

Data EEPROM Size: 1K

1K EEPROM size for storing non-volatile data.

Peripherals: BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Rich set of peripherals for enhanced functionality and versatility.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast and responsive operation.

Length: 5 mm

Compact length for space-saving designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade for reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient and high-speed processing.

No. of Timers: 5

Multiple timers for accurate time-based operations and control.

RAM Bytes: 8192

Ample RAM for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high-speed operation.

Terminal Form: NO LEAD

Leadless terminal form for easy and reliable soldering.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel 12-bit ADCs for precise analog signal conversion.

Nominal Supply Voltage: 3 V

Nominal supply voltage for stable and reliable operation.

No. of DMA Channels: 7

7 DMA channels for efficient data transfer and processing.

PWM Channels: YES

Pulse Width Modulation channels for precise control of output signals.

Connectivity: I2C, IRDA, SPI(2), UART, USART

Multiple connectivity options for interfacing with external devices.

ROM Programmability: FLASH

Flash ROM programmability for easy and convenient program updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and compact PCB layout.

Speed: 32 rpm

Capable of processing data at a speed of 32 revolutions per minute.

On Chip Program ROM Width: 8

8-bit program ROM width for efficient program execution.

No. of I/O Lines: 27

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32L031K6U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of DMA Channels:

7

No. of I/O Lines:

27

No. of Terminals:

32

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI(2), UART, USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031K6U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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