Loading...

STM32L031G6U3TR

STMicroelectronics

STM32L031G6U3TR by STMicroelectronics

STM32L031G6U3TR from STMicroelectronics is a 32-bit microcontroller ideal for low-power applications. It operates b/w 1.65V and 3.6V, features 21 I/O lines, and supports ADC and PWM channels. Its compact design makes it perfect for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,480

-

-

-

-

Digiode

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,163

-

-

-

-

Anansix

USA . 674 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

674

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,481 parts In-Stock

1+ parts

$12.994

100+ parts

-

1k+ parts

-

10k+ parts

-

5,481

$12.994

-

-

-

IDEA Electronic Components Group

UK . 2,072 parts In-Stock

1+ parts

$17.587

100+ parts

-

1k+ parts

$15.828

10k+ parts

-

2,072

$17.587

-

$15.828

-

AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$17.910

100+ parts

-

1k+ parts

-

10k+ parts

-

312

$17.910

-

-

-

MKK Technologies

India . 2,200 parts In-Stock

1+ parts

$33.071

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$33.071

-

-

-

DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$33.071

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$33.071

-

-

-

Vigor

Singapore . 6,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,200

-

-

-

-

Eastek

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.270

10k+ parts

-

3,000

-

-

$2.270

-

GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$21.028

1k+ parts

-

10k+ parts

-

387

-

$21.028

-

-

Corphita

USA . 237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

237

-

-

-

-

Overview

Unlock the potential of your projects with the STM32L031G6U3TR microcontroller from STMicroelectronics, renowned for its exceptional quality and reliability. This ultra-low-power solution excels in battery-operated devices, offering efficiency and performance that elevate your designs. With a compact footprint and versatile features, it's perfect for IoT applications, wearable tech, and smart sensors. Choose STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature ensures that the microcontroller can be easily integrated into compact PCB designs, saving space and enhancing manufacturability.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, the microcontroller is suitable for battery-operated devices, ensuring low power consumption and extended battery life.

Package Shape: SQUARE

The square package shape is advantageous for uniform heat distribution and ease of placement in automated assembly processes.

Bit Size: 32

A 32-bit architecture allows for advanced processing capabilities, enabling more complex computations and the handling of larger data types, which is essential for modern applications.

No. of Terminals: 28

With 28 terminals, this microcontroller offers a good balance of I/O options, making it versatile for various interfacing needs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style facilitates effective heat dissipation and enhances performance in thermal-sensitive applications, making it a reliable choice.

Minimum Supply Voltage: 1.65 V

A minimum supply voltage of 1.65 V enables operation in low-power environments, making this microcontroller suitable for energy-efficient designs.

ADC Channels: YES

Availability of ADC channels allows for analog signal processing, enabling the microcontroller to interact with real-world signals, which broadens its application scope.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer without CPU intervention, improving overall performance and reducing processing time.

Terminal Position: QUAD

Quad terminal position enhances the ease of connectivity and layout flexibility on PCB, facilitating better circuit design.

Width: 4 mm

The compact width is advantageous for space-constrained applications, allowing for efficient use of board real estate.

Maximum Clock Frequency: 25 MHz

A maximum clock frequency of 25 MHz provides sufficient processing speed for a range of applications, ensuring responsiveness and performance.

Length: 4 mm

Its 4 mm length contributes to its small footprint, making the microcontroller suitable for portable and compact devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture enhances instruction execution efficiency, leading to faster processing and reduced power consumption.

Technology: CMOS

The CMOS technology ensures lower power dissipation and higher noise immunity, contributing to an overall more reliable microcontroller.

Terminal Form: NO LEAD

A no-lead terminal form offers better performance in high-frequency applications, reducing potential inductance and improving signal integrity.

Nominal Supply Voltage: 3 V

Operating nominally at 3 V allows compatibility with a wide range of power sources while maintaining efficiency.

PWM Channels: YES

PWM channels provide capabilities for motor control and other applications requiring precise signal modulation, enhancing the microcontroller's versatility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables dense packing of terminals, facilitating complex functionalities while maintaining a compact design.

Speed: 32 rpm

Though the speed specification might seem specific, it indicates potential for applications in motion control or similar scenarios.

No. of I/O Lines: 21

With 21 I/O lines, this microcontroller can interface with multiple sensors and devices simultaneously, making it suitable for complex designs.

Technical Specifications

Microcontrollers STM32L031G6U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

4 mm

No. of I/O Lines:

21

No. of Terminals:

28

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

STM32L031G6U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20