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STM32L031G4U6TR

STMicroelectronics

STM32L031G4U6TR by STMicroelectronics

STM32L031G4U6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 25 MHz clock speed. With 8 KB RAM and 16 KB ROM, it's ideal for low-power applications like IoT devices. Its rich peripherals include ADC, DMA, and multiple communication interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,412 parts In-Stock

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9,412

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Digiode

USA . 2,641 parts In-Stock

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2,641

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Anansix

USA . 2,074 parts In-Stock

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2,074

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,833 parts In-Stock

1+ parts

$10.440

100+ parts

$10.370

1k+ parts

$10.340

10k+ parts

$10.310

5,833

$10.440

$10.370

$10.340

$10.310

AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$12.150

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610

$12.150

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Component Stockers USA

USA . 5,011 parts In-Stock

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$26.110

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5,011

$26.110

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IDEA Electronic Components Group

UK . 974 parts In-Stock

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$57.455

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-

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$51.709

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974

$57.455

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$51.709

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MKK Technologies

India . 2,056 parts In-Stock

1+ parts

$108.040

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2,056

$108.040

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DigiPath Technology Company

USA . 2,056 parts In-Stock

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$108.040

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2,056

$108.040

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QUARKTWIN TECHNOLOGY LTD

USA . 6,366 parts In-Stock

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6,366

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Vigor

Singapore . 4,950 parts In-Stock

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Corphita

USA . 2,677 parts In-Stock

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2,677

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Parana Technologies

USA . 2,193 parts In-Stock

1+ parts

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$68.696

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2,193

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$68.696

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Overview

Unlock the potential of your designs with the STM32L031G4U6TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this ultra-low-power chip delivers outstanding performance in compact applications, from wearable tech to industrial sensors. With a robust Cortex-M0 core and versatile peripherals, it ensures seamless connectivity and efficient processing, empowering you to innovate without compromise. Elevate your projects and experience unparalleled value with ST's cutting-edge technology!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for more compact designs, making the product ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage supports a range of applications, especially those requiring more power.

Package Shape: SQUARE

Square package shape provides a balanced footprint, which is beneficial for layout and heat dissipation.

Bit Size: 32

32-bit architecture allows for efficient processing of complex computations and larger data sets, enhancing performance.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for various peripherals, increasing versatility in applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile is suitable for applications where height restrictions are significant, such as wearables or compact devices.

Minimum Supply Voltage: 1.8 V

With a low minimum supply voltage, the microcontroller can operate in battery-powered devices, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures makes it suitable for industrial environments with challenging thermal conditions.

CPU Family: CORTEX-M0

The Cortex-M0 family is known for its low power consumption and efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for use in extreme environments, making it suitable for industrial and automotive applications.

ADC Channels: YES

Built-in ADC channels provide the capability for real-time analog signal processing, crucial for sensor applications.

DMA Channels: YES

Direct Memory Access allows for efficient data transfers, improving overall system performance by freeing up CPU resources.

Terminal Position: QUAD

Quad terminal positioning ensures a secure and stable connection, enhancing reliability in high-vibration environments.

ROM Words: 16384

The sizable ROM supports large firmware and application code, making it versatile for complex projects.

Maximum Seated Height: 0.6 mm

Compact seated height allows for flexible integration into various designs, particularly in low-profile applications.

Width: 4 mm

The small width contributes to its suitability for miniature electronic devices and tight PCB layouts.

Data EEPROM Size: 1K

1K EEPROM allows storing small amounts of non-volatile data, essential for applications needing configuration settings.

Peripherals: BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

A rich set of built-in peripherals enhances functionality, allowing for diverse applications without needing additional components.

Maximum Clock Frequency: 25 MHz

A 25 MHz clock frequency strikes a balance between performance and power consumption, suitable for various applications.

Length: 4 mm

Short length aids in fitting into compact designs, making it an ideal choice for portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh conditions, suitable for demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction processing, contributing to faster and energy-efficient operations.

No. of Timers: 5

Multiple timers support complex timing operations in applications such as motor control and signal generation.

RAM Bytes: 8192

With 8192 bytes of RAM, the microcontroller can handle more variables and data during execution, improving functionality.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated applications.

Terminal Form: NO LEAD

No lead form reduces the footprint for surface mount applications, allowing for advanced designs and reducing material costs.

Analog To Digital Converters: 10-Ch 12-Bit

The high-resolution ADC with multiple channels supports accurate digital representation of analog signals, beneficial for sensor applications.

Nominal Supply Voltage: 3 V

A nominal voltage of 3 V is compatible with a wide range of battery technologies, facilitating ease of integration.

No. of DMA Channels: 7

Seven DMA channels enable efficient data handling, increasing throughput in data-intensive applications.

PWM Channels: YES

Integrated PWM channels simplify control of motors and other devices requiring precise timing, enhancing design efficiency.

Connectivity: I2C, IRDA, SPI(2), UART, USART

Multiple connectivity options support a broad range of peripherals, making the microcontroller flexible for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the firmware and applications at any time.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density PCB designs, enabling compact layouts.

Speed: 32 rpm

The specified speed informs about the microcontroller's performance capabilities in real-time applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient data processing, fitting into a wide range of application needs.

No. of I/O Lines: 21

Having 21 I/O lines provides extensive interfacing capabilities with external components and systems, enhancing the product's utility.

Technical Specifications

Microcontrollers STM32L031G4U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

No. of DMA Channels:

7

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI(2), UART, USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031G4U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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