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STM32L031E4Y6TR

STMicroelectronics

STM32L031E4Y6TR by STMicroelectronics

STM32L031E4Y6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w 1.8V and 3.6V, and supports up to 25 MHz clock speed. With integrated ADC, DMA channels, and multiple timers, it's ideal for low-power applications in industrial settings. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,934 parts In-Stock

1+ parts

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2,934

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Anansix

USA . 2,436 parts In-Stock

1+ parts

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2,436

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Digiode

USA . 855 parts In-Stock

1+ parts

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855

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,750 parts In-Stock

1+ parts

$1.220

100+ parts

-

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-

10k+ parts

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9,750

$1.220

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Microchip USA

USA . 5,921 parts In-Stock

1+ parts

$10.007

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-

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5,921

$10.007

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AZTECH Wire

Italy . 648 parts In-Stock

1+ parts

$10.830

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-

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648

$10.830

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

1+ parts

$15.294

100+ parts

-

1k+ parts

$13.765

10k+ parts

-

1,124

$15.294

-

$13.765

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MKK Technologies

India . 127 parts In-Stock

1+ parts

$28.760

100+ parts

-

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127

$28.760

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DigiPath Technology Company

USA . 127 parts In-Stock

1+ parts

$28.760

100+ parts

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127

$28.760

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Corphita

USA . 2,514 parts In-Stock

1+ parts

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2,514

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Parana Technologies

USA . 1,783 parts In-Stock

1+ parts

-

100+ parts

$18.286

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1,783

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$18.286

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Overview

Unlock the potential of your next project with the STM32L031E4Y6TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This ultra-low-power MCU boasts an impressive range of features perfect for IoT, wearable tech, and industrial applications. Enjoy unmatched reliability and efficiency while reducing energy consumption, enabling your designs to thrive in any environment—from smart homes to advanced medical devices. Elevate your projects with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances the reliability and longevity of the microcontroller in various applications.

Surface Mount: YES

Surface mount capability allows for compact board designs and easier integration into modern electronic systems.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with various low-power applications without risking damage.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to effective placement on PCBs, optimizing space and layout.

Bit Size: 32

The 32-bit architecture enables higher performance and efficiency, allowing for more complex calculations and operations.

No. of Terminals: 25

With 25 terminals, this microcontroller offers a rich interface for connecting to other devices and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

A very thin profile and fine pitch design facilitate high-density circuitry, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enhances flexibility in power source selection, especially for battery-operated devices.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C makes this microcontroller suitable for industrial applications in challenging environments.

CPU Family: CORTEX-M0

The Cortex-M0 core is known for its energy efficiency and performance, making this microcontroller ideal for power-sensitive applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range (-40 °C to 85 °C) ensures reliable operation in extreme environments.

ADC Channels: YES

The inclusion of ADC channels allows for direct interfacing with analog sensors, adding versatility to the microcontroller.

DMA Channels: YES

Direct Memory Access (DMA) support enhances performance by freeing the CPU from data transfer processes.

Terminal Position: BOTTOM

Bottom-positioned terminals improve thermal dissipation and make the device more effective for mounting on PCBs.

ROM Words: 16384

With 16,384 ROM words available, there's ample space for program code, allowing for complex applications.

Maximum Seated Height: 0.585 mm

A low maximum seated height supports compact designs and can fit into ultra-thin devices.

Width: 2.097 mm

Narrow width facilitates integration in compact assemblies without compromising functionality.

Data EEPROM Size: 1K

1K data EEPROM provides non-volatile storage for critical parameters or configuration data.

Peripherals: BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

A rich set of peripherals enables versatile application designs, catering to a wide range of functionality.

Maximum Clock Frequency: 25 MHz

A clock frequency of 25 MHz allows for fast data processing and responsive system performance.

Length: 2.493 mm

The compact length supports high-density designs, fitting well in modern electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates the microcontroller's reliability for long-term use in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures efficient instruction execution, leading to overall system performance improvements.

No. of Timers: 5

Five timers allow for complex timing operations, enhancing the control of processes in real-time applications.

RAM Bytes: 8192

8KB of RAM supports sufficient data handling capabilities for intricate applications.

Technology: CMOS

CMOS technology ensures low power consumption, making this microcontroller suitable for battery-powered applications.

Terminal Form: BALL

Ball terminal form promotes better soldering and connectivity in surface mount applications.

Analog To Digital Convertors: 10-Ch 12-Bit

Ten channels of 12-bit analog-to-digital converters allow for accurate and versatile signal measurement.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a balance between performance and power efficiency, making it widely applicable.

No. of DMA Channels: 7

With seven DMA channels, this microcontroller can efficiently handle multiple data transfer operations simultaneously.

PWM Channels: YES

The presence of PWM channels enables control of motors and other devices with precision.

Connectivity: I2C, IRDA, SPI(2), UART, USART

Diverse connectivity options facilitate easy integration with a variety of peripherals and communication standards.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, enhancing product flexibility.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is suitable for high-density packaging, making it effective for advanced electronics.

Speed: 32 rpm

Speed capabilities make this microcontroller apt for applications that require precise timing and control.

On Chip Program ROM Width: 8

An 8-bit wide program ROM enables efficient handling of data and instructions within the microcontroller.

No. of I/O Lines: 20

Twenty I/O lines provide significant interfacing capabilities for various sensors and modules.

Technical Specifications

Microcontrollers STM32L031E4Y6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B25

Length:

2.493 mm

No. of DMA Channels:

7

No. of I/O Lines:

20

No. of Terminals:

25

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.097 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI(2), UART, USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), PVD, PWM(2), RTC, TEMPERATURE SENSOR, TIMER(5), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031E4Y6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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