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STM32L031C4U6

STMicroelectronics

STM32L031C4U6 by STMicroelectronics

STM32L031C4U6 from STMicroelectronics is a 32-bit microcontroller ideal for low-power applications, featuring a max supply voltage of 3.6V and operating temp range of -40 °C to 85 °C. It includes 10 ADC channels and supports I2C, SPI, and USART connectivity. With its compact design and advanced peripherals, it's perfect for IoT devices and wearable tech.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,206 parts In-Stock

1+ parts

-

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5,206

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Digiode

USA . 4,368 parts In-Stock

1+ parts

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-

1k+ parts

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4,368

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Anansix

USA . 1,951 parts In-Stock

1+ parts

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1,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

$1.650

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Microchip USA

USA . 3,489 parts In-Stock

1+ parts

$13.197

100+ parts

-

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10k+ parts

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3,489

$13.197

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AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$15.900

100+ parts

-

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736

$15.900

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IDEA Electronic Components Group

UK . 250 parts In-Stock

1+ parts

$21.500

100+ parts

-

1k+ parts

$19.350

10k+ parts

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250

$21.500

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$19.350

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Component Stockers USA

USA . 4,020 parts In-Stock

1+ parts

$30.690

100+ parts

-

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4,020

$30.690

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MKK Technologies

India . 2,262 parts In-Stock

1+ parts

$40.430

100+ parts

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2,262

$40.430

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DigiPath Technology Company

USA . 2,262 parts In-Stock

1+ parts

$40.430

100+ parts

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2,262

$40.430

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Corphita

USA . 2,236 parts In-Stock

1+ parts

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2,236

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Parana Technologies

USA . 491 parts In-Stock

1+ parts

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100+ parts

$25.707

1k+ parts

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491

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$25.707

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Overview

Unlock your innovation potential with the STM32L031C4U6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for ultra-low power applications, this 32-bit powerhouse ensures efficiency without compromising performance. Whether it’s smart home devices, wearables, or IoT applications, its compact design and advanced features deliver unmatched versatility. Experience reliability and support from a trusted manufacturer, empowering your projects to thrive!

Feature Benefit Bullets

Surface Mount: YES

This microcontroller's surface mount design allows for efficient and compact PCB layouts, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The ability to operate at a maximum supply voltage of 3.6 V ensures compatibility with a wide range of power supply systems.

Package Shape: SQUARE

The square package shape facilitates uniform pin arrangement and optimal thermal performance.

Bit Size: 32

Being a 32-bit microcontroller allows for higher processing power and better performance in complex applications.

No. of Terminals: 48

The 48 terminals provide ample connectivity options for interfacing with various peripherals, enhancing the microcontroller's versatility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile enables integration into compact electronic designs without compromising performance, while the heat sink/slug aids in thermal management.

Minimum Supply Voltage: 1.8 V

With a minimum supply voltage of 1.8 V, this MCU can operate efficiently in low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

The ability to function in temperatures up to 85 °C ensures reliable performance in demanding environments.

CPU Family: CORTEX-M0

The Cortex-M0 family is known for its energy efficiency and high performance, making this microcontroller suitable for embedded systems.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures (-40 °C) increases the microcontroller's usability in harsh environments.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to process analog signals, making it versatile for sensor applications.

DMA Channels: YES

DMA channels enhance data processing efficiency by allowing peripheral devices to access memory without CPU intervention.

Terminal Position: QUAD

The quad terminal position supports effective routing on printed circuit boards, optimizing communication and signal integrity.

ROM Words: 16384

With 16384 ROM words, this microcontroller can store complex programs and algorithms, offering flexibility in application development.

Width: 7 mm

The compact width allows for easy integration into tight spaces within electronic designs.

Data EEPROM Size: 1024

A 1024-byte data EEPROM allows for non-volatile data storage, critical for applications requiring data retention without power.

Peripherals: BOR, COMPARATOR(2), DMA(7), POR, PWM(4), RTC, TIMER(10), WDT(2)

A comprehensive set of peripherals enhances the capability to manage diverse tasks and simplify system design.

Maximum Clock Frequency: 25 MHz

The 25 MHz clock frequency supports fast processing, making this microcontroller suitable for real-time applications.

Length: 7 mm

A 7 mm length complements the compact design, ideal for portable and miniature devices.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it offers efficient instruction execution, contributing to power savings and enhanced performance.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can handle multiple tasks and applications simultaneously.

Terminal Form: NO LEAD

No lead terminals provide excellent performance characteristics and reduce the footprint on PCB.

Analog To Digital Converters: 10-Ch 12-Bit

10-channel, 12-bit ADCs allow for high-quality analog signal conversion, enhancing data accuracy in sensor applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V makes it compatible with standard electronics power supplies while maintaining low power consumption.

PWM Channels: YES

The presence of PWM channels facilitates motor control, LED dimming, and other applications requiring precise signal modulation.

Connectivity: I2C, LPUART, SPI(2), USART

Multiple connectivity options ensure seamless communication with various devices, improving integration into diverse systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications of firmware, enhancing the product's longevity.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density circuit designs, enabling more compact and intricate layouts.

Speed: 32 rpm

Rated speed of 32 rpm indicates its capability to handle motion control applications effectively.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient processing and reduced memory use for many applications.

No. of I/O Lines: 38

Having 38 I/O lines provides ample input and output options for interfacing with various sensors and devices.

Technical Specifications

Microcontrollers STM32L031C4U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.65V MINIMUM SUPPLY DETECTOR DISABLED

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

38

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

8192

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1024

Connectivity:

I2C, LPUART, SPI(2), USART

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, PWM(4), RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L031C4U6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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