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STM32L021D4P7DTR

STMicroelectronics

STM32L021D4P7DTR by STMicroelectronics

STM32L021D4P7DTR by STMicroelectronics is a 32-bit microcontroller ideal for low-power applications. It operates b/w 1.65V and 3.6V, features 14 terminals, and supports ADC, DMA, and PWM channels. Perfect for IoT devices and portable electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,176 parts In-Stock

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7,176

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Anansix

USA . 1,969 parts In-Stock

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1,969

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Digiode

USA . 1,126 parts In-Stock

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1,126

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 3,716 parts In-Stock

1+ parts

$9.633

100+ parts

-

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3,716

$9.633

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AZTECH Wire

Italy . 1,146 parts In-Stock

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$9.820

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1,146

$9.820

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IDEA Electronic Components Group

UK . 877 parts In-Stock

1+ parts

$44.994

100+ parts

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$40.494

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877

$44.994

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$40.494

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MKK Technologies

India . 1,000 parts In-Stock

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$84.607

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1,000

$84.607

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DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$84.607

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1,000

$84.607

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Vigor

Singapore . 9,980 parts In-Stock

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9,980

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Corphita

USA . 4,188 parts In-Stock

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4,188

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Parana Technologies

USA . 682 parts In-Stock

1+ parts

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$53.797

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682

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$53.797

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Overview

Unlock your project's potential with the STM32L021D4P7DTR microcontroller from STMicroelectronics, a leader in quality and innovation. This versatile, low-power solution is perfect for battery-operated devices, ensuring efficiency without sacrificing performance. With its compact design and advanced features, it seamlessly integrates into various applications—from IoT to wearables—enhancing reliability and user experience. Choose STMicroelectronics for unmatched support and cutting-edge technology that drives your success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact electronic systems, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This allows compatibility with various power supply configurations without exceeding voltage limits, ensuring stable performance.

Package Shape: RECTANGULAR

The rectangular package shape aids in efficient space utilization on printed circuit boards (PCBs), facilitating compact design.

Bit Size: 32

A 32-bit size allows for processing of larger data sets and enhanced computational power, which is beneficial for complex applications.

No. of Terminals: 14

Fourteen terminals provide ample connectivity options for interfacing with other components, enhancing versatility in designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch make this microcontroller suitable for high-density applications, improving layout efficiency.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage supports battery-operated applications, extending battery life and conserving power.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors, making it ideal for data acquisition applications.

DMA Channels: YES

DMA channels allow for efficient data transfer with minimal CPU intervention, enhancing overall system performance.

Terminal Position: DUAL

Dual terminal positioning enhances the routing flexibility on PCBs, facilitating easier design and component placement.

Width: 4.4 mm

A compact width enables it to fit into small enclosures, making it suitable for portable and space-constrained devices.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides sufficient processing speed for demanding applications while maintaining power efficiency.

Length: 5 mm

Short length enhances compatibility with miniature devices, facilitating compact system design.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller ensures high performance with low power consumption, ideal for battery-powered applications.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, making this microcontroller reliable for various applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and structural integrity, ensuring durability in various operating conditions.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V optimizes power management while ensuring effective device operation in a variety of environments.

PWM Channels: YES

The inclusion of PWM channels enables efficient control of motors and other devices, making it suitable for robotics and automation.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact layout on the PCB, reducing space while maintaining connectivity integrity.

Speed: 32 rpm

Operating at 32 rpm suggests a stable performance for applications requiring rotational motion or control.

No. of I/O Lines: 11

With 11 I/O lines, this microcontroller allows for considerable flexibility in connecting with various sensors and actuators.

Technical Specifications

Microcontrollers STM32L021D4P7DTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

No. of I/O Lines:

11

No. of Terminals:

14

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

STM32L021D4P7DTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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