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STM32L011K4U3TR

STMicroelectronics

STM32L011K4U3TR by STMicroelectronics

STM32L011K4U3TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 2048 bytes RAM, and 16384 ROM words. It features 10-Ch 12-Bit ADC channels, 5 DMA channels, and PWM support. Ideal for low-power applications requiring connectivity via I2C, LPUART, SPI, and UART interfaces at a max clock frequency of 32 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,648 parts In-Stock

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9,648

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Digiode

USA . 4,554 parts In-Stock

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4,554

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Anansix

USA . 1,948 parts In-Stock

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1,948

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Vigor

Singapore . 7,700 parts In-Stock

1+ parts

$1.600

100+ parts

-

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7,700

$1.600

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AZTECH Wire

Italy . 527 parts In-Stock

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$5.042

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527

$5.042

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Microchip USA

USA . 4,733 parts In-Stock

1+ parts

$13.133

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4,733

$13.133

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$19.000

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290

$19.000

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IDEA Electronic Components Group

UK . 71 parts In-Stock

1+ parts

$44.323

100+ parts

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$39.891

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71

$44.323

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$39.891

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Aztec Data Supply Inc.

USA . 1,075 parts In-Stock

1+ parts

$69.222

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1,075

$69.222

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Corohmni

South Africa . 99 parts In-Stock

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$79.919

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99

$79.919

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MKK Technologies

India . 1,315 parts In-Stock

1+ parts

$83.346

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1,315

$83.346

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DigiPath Technology Company

USA . 1,315 parts In-Stock

1+ parts

$83.346

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1,315

$83.346

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Argo Parts USA

USA . 3,546 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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Corphita

USA . 2,945 parts In-Stock

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Continental Prestige Electronics

USA . 2,673 parts In-Stock

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2,673

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Parana Technologies

USA . 1,740 parts In-Stock

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$52.995

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1,740

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$52.995

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Elevate your projects with the STM32L011K4U3TR by STMicroelectronics, a top-tier microcontroller that delivers unparalleled performance and reliability. With cutting-edge technology and a renowned manufacturer backing it, this device is perfect for a wide range of applications in the industry. From its low power mode to its high clock frequency, this microcontroller offers exceptional value and benefits to customers looking for precision and efficiency. Take your designs to the next level with the STM32L011K4U3TR and experience the difference quality makes.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy integration onto printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Ability to handle a maximum supply voltage of 3.6V provides flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 bits enables efficient data processing and storage.

Package Shape: SQUARE

Square package shape allows for easier placement and routing on a PCB, optimizing space utilization.

Bit Size: 32

A 32-bit architecture enables faster and more efficient data processing compared to lower bit sizes.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles offer flexibility in design and thermal management, suitable for various application requirements.

Minimum Supply Voltage: 1.8 V

Support for a minimum supply voltage of 1.8V allows for operation in low-power or battery-powered applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliability in harsh environmental conditions.

CPU Family: CORTEX-M0

Being part of the Cortex-M0 family indicates a balance of performance and power efficiency, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for reliable operation in cold environments.

ADC Channels: YES

Integrated Analog to Digital Converters provide the capability to interface with analog sensors or signals, expanding the range of applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

QUAD terminal position provides a standard layout for easy PCB design and assembly.

ROM Words: 16384

Large ROM capacity of 16384 words allows for storing program instructions and data, facilitating complex applications.

Maximum Seated Height: 0.6 mm

Low maximum seated height of 0.6mm enables compact and slim device designs.

Width: 5 mm

Compact width of 5mm contributes to a small form factor and easy integration into space-constrained designs.

Data EEPROM Size: 512

Having a 512 bytes capacity for Data EEPROM allows for non-volatile data storage, preserving critical information even when power is removed.

Peripherals: BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(9), WDT(2)

A rich set of peripherals including Brownout Reset (BOR), Comparators, DMA, Power-On Reset (POR), Real-Time Clock (RTC), Timers, and Watchdog Timer (WDT) offer enhanced functionality for various applications.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32MHz allows for fast processing and execution of instructions.

Length: 5 mm

Short length of 5mm contributes to a compact form factor, ideal for space-constrained applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with a Reduced Instruction Set Computing (RISC) architecture offers a balance of performance and power efficiency for embedded applications.

No. of Timers: 4

Having 4 timers provides the capability to manage time-sensitive tasks and events in the system.

RAM Bytes: 2048

Having 2048 bytes of RAM allows for efficient data storage and manipulation during program execution.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form simplifies the assembly process and reduces the risk of soldering errors.

Analog To Digital Convertors: 10-Ch 12-Bit

Having 10 Analog to Digital Converters with 12-bit resolution enables accurate and precise conversion of analog signals to digital values.

Maximum Supply Current: 6.5 mA

Low maximum supply current of 6.5mA indicates efficient power consumption, suitable for battery-powered applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V allows for compatibility with common power sources and regulators.

No. of Serial I/Os: 2

Having 2 Serial I/Os provides options for communication with external devices or peripherals using serial protocols.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of digital signals, useful for applications such as motor control or LED dimming.

Connectivity: I2C, LPUART, SPI, UART

Support for various communication interfaces such as I2C, LPUART, SPI, and UART expands compatibility with external devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy reprogramming of the internal memory, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm enables high-density mounting on PCBs, saving space and improving overall design flexibility.

Format: FIXED POINT

Fixed-point format is suitable for applications requiring precise and predictable arithmetic operations without the overhead of floating-point calculations.

Speed: 32 rpm

Operates at a speed of 32 rotations per minute, suitable for applications requiring precise timing or control over motor speed.

Low Power Mode: YES

Availability of low power mode enhances energy efficiency and prolongs battery life in portable or battery-powered devices.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 bits allows for storing program instructions directly on the chip, reducing external memory requirements.

No. of I/O Lines: 28

Having 28 I/O lines provides significant flexibility for interfacing with external components, sensors, and peripherals in a variety of applications.

Technical Specifications

Microcontrollers STM32L011K4U3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

28

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C, LPUART, SPI, UART

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L011K4U3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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