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STM32L011G3U7

STMicroelectronics

STM32L011G3U7 by STMicroelectronics

STM32L011G3U7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w 1.8V and 3.6V, and includes 2048 bytes of RAM. With low power modes and multiple connectivity options like I2C and SPI, it's ideal for battery-operated devices. Its compact design suits applications in IoT and wearable tech.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,774 parts In-Stock

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7,774

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Anansix

USA . 2,385 parts In-Stock

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2,385

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Digiode

USA . 1,401 parts In-Stock

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1,401

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J2 Sourcing AB

Sweden . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,486 parts In-Stock

1+ parts

$1.140

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7,486

$1.140

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Microchip USA

USA . 4,803 parts In-Stock

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$9.327

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4,803

$9.327

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AZTECH Wire

Italy . 99 parts In-Stock

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$14.880

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99

$14.880

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Component Stockers USA

USA . 4,035 parts In-Stock

1+ parts

$22.040

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4,035

$22.040

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IDEA Electronic Components Group

UK . 488 parts In-Stock

1+ parts

$23.664

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$21.298

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488

$23.664

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$21.298

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MKK Technologies

India . 2,364 parts In-Stock

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$44.499

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2,364

$44.499

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$44.499

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2,364

$44.499

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Parana Technologies

USA . 2,134 parts In-Stock

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$28.294

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2,134

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$28.294

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Corphita

USA . 1,380 parts In-Stock

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1,380

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Overview

Unleash the power of innovation with the STM32L011G3U7 microcontroller from STMicroelectronics, renowned for its superior quality and reliability. This ultra-low-power solution excels in applications ranging from wearables to IoT devices, offering exceptional performance in a compact design. With versatile connectivity and robust processing capabilities, it empowers developers to create energy-efficient solutions that elevate user experiences while optimizing battery life. Choose STM32L011G3U7 and transform your ideas into reality!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design ensures easy integration into compact applications, ideal for space-constrained environments.

Maximum Supply Voltage: 3.6 V

This voltage range allows for compatibility with a variety of power sources and battery-operated applications.

On Chip Data RAM Width: 8

An 8-bit RAM width can efficiently handle low-power, 8-bit data processing tasks.

Package Shape: SQUARE

The square package shape facilitates efficient layout and routing on printed circuit boards.

Bit Size: 32

A 32-bit architecture enables advanced processing capabilities and better performance for complex applications.

No. of Terminals: 28

28 terminals provide ample connectivity for a range of external peripherals and components.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier makes it ideal for applications where height and space are critical.

Minimum Supply Voltage: 1.8 V

A low minimum supply voltage allows for operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller is suited for demanding environmental conditions.

CPU Family: CORTEX-M0

The ARM Cortex-M0 core offers a balance of performance and low power consumption, perfect for embedded systems.

No. of External Interrupts: 16

16 external interrupts allow for responsive and flexible control of peripherals and real-time applications.

Minimum Operating Temperature: -40 °C

This low minimum temperature rating makes it reliable for use in extreme environments and outdoor applications.

ADC Channels: YES

Integrated ADC channels facilitate sensor interfaces, enhancing the microcontroller's applicability in various applications.

DMA Channels: YES

DMA channels improve data transfer efficiency, freeing up CPU time for other tasks, thus enhancing overall performance.

Terminal Position: QUAD

Quad terminal positioning aids in easier soldering and improved signal integrity.

ROM Words: 8192

A sizable ROM allows for substantial program storage, accommodating complex applications.

Maximum Seated Height: 0.6 mm

The low seated height is advantageous for designs requiring minimal profile components.

Width: 4 mm

The compact width is ideal for space-constrained designs without sacrificing performance.

Data EEPROM Size: 512

A built-in EEPROM allows for non-volatile data storage, crucial for applications requiring settings retention.

Peripherals: BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT(2)

Rich peripheral set enhances functionality and supports various application requirements directly on-chip.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz enables efficient processing of tasks and supports demanding applications.

Length: 4 mm

The short length complements its compact form factor, making it suitable for modern electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides efficient instruction processing, optimizing power and performance.

No. of Timers: 4

Having multiple timers enables sophisticated time-management scenarios for applications like motor control or signal generation.

RAM Bytes: 2048

2048 bytes of RAM support moderate data processing needs, enhancing the controller's utility in diverse applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, perfect for battery-powered devices.

Terminal Form: NO LEAD

The no lead form contributes to a reduction in overall footprint and enables better thermal management.

Analog To Digital Convertors: 10-Ch 12-Bit

10-channel, 12-bit ADC enhances precision in data acquisition from sensors, making it suitable for high-resolution applications.

Maximum Supply Current: 6.5 mA

Low supply current translates to extended battery life in portable and low-power devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is common in many battery technologies, facilitating easy compatibility.

No. of DMA Channels: 5

Five DMA channels provide substantial data handling capability while freeing CPU resources for other processes.

No. of Serial I/Os: 2

Two serial I/O lines support flexible communication options with other devices, enhancing connectivity.

PWM Channels: YES

PWM support allows for precise control of motors and lighting, making this microcontroller ideal for automation applications.

Connectivity: I2C, LPUART, SPI, UART

Multiple connectivity options facilitate integration with a wide range of sensors and communication peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of the microcontroller without needing replacements.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density placement on PCBs, suitable for advanced designs.

Format: FIXED POINT

The fixed-point format allows for efficient numerical operations, beneficial in real-time embedded applications.

Speed: 32 rpm

A speed of 32 rpm is suitable for low-speed motor applications, complementing the microcontroller's control capabilities.

Low Power Mode: YES

The availability of low power mode enhances energy efficiency, making it suitable for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides compatibility with legacy systems and efficient processing for simpler applications.

No. of I/O Lines: 24

24 I/O lines afford significant interfacing capabilities, making it versatile for a wide range of applications.

Technical Specifications

Microcontrollers STM32L011G3U7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of External Interrupts:

16

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC28,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

32 rpm

Maximum Supply Current:

6.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

512

Connectivity:

I2C, LPUART, SPI, UART

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32L011G3U7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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