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STM32H7B3LIH6QTR

STMicroelectronics

STM32H7B3LIH6QTR by STMicroelectronics

STM32H7B3LIH6QTR by STMicroelectronics is a 32-bit microcontroller with 225 terminals, 1413120 RAM words, and 2097152 ROM words. It features 24-Ch 16-Bit ADCs, 3-Ch 12-Bit DACs, and operates at a max frequency of 50 MHz. Ideal for industrial applications requiring high-performance computing and extensive peripheral connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,800

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-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,848

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-

-

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Anansix

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,390

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-

-

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Digiode

USA . 164 parts In-Stock

1+ parts

-

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-

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164

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,128 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,128

$3.000

-

-

-

AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$6.616

100+ parts

-

1k+ parts

-

10k+ parts

-

431

$6.616

-

-

-

Semicontronic

India . 293 parts In-Stock

1+ parts

$24.000

100+ parts

$23.400

1k+ parts

$23.280

10k+ parts

-

293

$24.000

$23.400

$23.280

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$29.301

100+ parts

$27.836

1k+ parts

$27.836

10k+ parts

-

5,000

$29.301

$27.836

$27.836

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Microchip USA

USA . 4,272 parts In-Stock

1+ parts

$40.021

100+ parts

-

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-

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4,272

$40.021

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

1+ parts

$59.440

100+ parts

-

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-

10k+ parts

-

89

$59.440

-

-

-

Corohmni

South Africa . 256 parts In-Stock

1+ parts

$62.018

100+ parts

-

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-

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256

$62.018

-

-

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IDEA Electronic Components Group

UK . 1,886 parts In-Stock

1+ parts

$63.153

100+ parts

-

1k+ parts

$56.838

10k+ parts

-

1,886

$63.153

-

$56.838

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MKK Technologies

India . 2,216 parts In-Stock

1+ parts

$118.756

100+ parts

-

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2,216

$118.756

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DigiPath Technology Company

USA . 2,216 parts In-Stock

1+ parts

$118.756

100+ parts

-

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-

10k+ parts

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2,216

$118.756

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Corphita

USA . 4,347 parts In-Stock

1+ parts

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4,347

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Continental Prestige Electronics

USA . 4,324 parts In-Stock

1+ parts

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4,324

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.073

1k+ parts

$0.073

10k+ parts

$0.073

300

-

$0.073

$0.073

$0.073

Parana Technologies

USA . 171 parts In-Stock

1+ parts

-

100+ parts

$75.510

1k+ parts

-

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171

-

$75.510

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Argo Parts USA

USA . 133 parts In-Stock

1+ parts

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133

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Bastille Electronics

Australia . 64 parts In-Stock

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64

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Overview

Unleash the power of innovation with the STM32H7B3LIH6QTR microcontroller by STMicroelectronics. Known for their superior quality and cutting-edge technology, STMicroelectronics delivers top-of-the-line microcontrollers that cater to a wide range of applications. With integrated cache, DAC channels, ADC channels, and a multitude of peripherals, this microcontroller provides unmatched performance and versatility. Whether you are working on IoT devices, automotive applications, or industrial automation, the STM32H7B3LIH6QTR is your go-to solution for seamless connectivity, efficient operation, and unparalleled reliability. Elevate your projects to new heights with the STM32H7B3LIH6QTR from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Integrated Cache: YES

The integrated cache helps improve the performance of the microcontroller by storing frequently used data for quick access.

Surface Mount: YES

Surface mount technology allows for easy assembly onto circuit boards, making the integration process simpler and more efficient.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input levels.

Address Bus Width: 26

A wider address bus allows the microcontroller to access a larger memory space, enabling it to handle more complex tasks and programs.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities and efficiency, making the microcontroller suitable for advanced applications.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components, increasing its versatility in various systems.

No. of Terminals: 225

The high number of terminals allows for a high level of connectivity and integration with external components, expanding the microcontroller's capabilities.

Maximum Operating Temperature: 85 °C

The wide temperature range at which this microcontroller can operate makes it suitable for industrial applications where temperature fluctuations are common.

CPU Family: STM32

Being part of the STM32 family indicates that this microcontroller is supported by a reputable manufacturer known for producing high-quality and reliable products.

Technical Specifications

Microcontrollers STM32H7B3LIH6QTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B225

Length:

13 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

168

No. of Terminals:

225

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA225,15X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

1413120

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

280 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SPI(6), SDMMC(2), SWPMI, UART(5), USART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(18), WDT(2)

Analog To Digital Convertors:

24-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

STM32H7B3LIH6QTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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