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STM32H7B3IIK6Q

STMicroelectronics

STM32H7B3IIK6Q by STMicroelectronics

STM32H7B3IIK6Q by STMicroelectronics is a 32-bit microcontroller with integrated cache, 201 terminals, and 24-Ch 16-Bit ADC. Ideal for industrial applications due to its wide temperature range, it offers connectivity options like CAN, I2C, SPI, and USB along with low power mode for energy efficiency. With a max clock frequency of 50 MHz and extensive peripheral support including timers and DMA channels, it's suitable for various embedded systems.

Median Price

$7.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 4,032 parts In-Stock

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-

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$7.960

4,032

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$7.960

Distributors (In-Stock)

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Digiode

USA . 4,904 parts In-Stock

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4,904

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IBS Electronics

USA . 4,032 parts In-Stock

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$11.935

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4,032

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$11.935

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Vyrian

USA . 3,926 parts In-Stock

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3,926

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Anansix

USA . 1,514 parts In-Stock

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1,514

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$8.030

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-

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551

$8.030

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Ampacity Inc.

Singapore . 3,914 parts In-Stock

1+ parts

$8.110

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3,914

$8.110

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Semicontronic

India . 3,863 parts In-Stock

1+ parts

$8.110

100+ parts

$7.907

1k+ parts

$7.867

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-

3,863

$8.110

$7.907

$7.867

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Microchip USA

USA . 2,972 parts In-Stock

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$37.746

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$37.746

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Corohmni

South Africa . 376 parts In-Stock

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$47.356

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376

$47.356

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Advanced Electronics

New Zealand . 98 parts In-Stock

1+ parts

$54.214

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$51.503

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$51.503

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98

$54.214

$51.503

$51.503

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IDEA Electronic Components Group

UK . 795 parts In-Stock

1+ parts

$73.360

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$66.024

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795

$73.360

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$66.024

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Aztec Data Supply Inc.

USA . 307 parts In-Stock

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$73.710

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307

$73.710

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MKK Technologies

India . 66 parts In-Stock

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$137.948

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66

$137.948

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DigiPath Technology Company

USA . 66 parts In-Stock

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$137.948

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66

$137.948

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Vigor

Singapore . 7,556 parts In-Stock

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GreenTree Electronics

Israel . 4,153 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,390 parts In-Stock

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Continental Prestige Electronics

USA . 2,390 parts In-Stock

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Corphita

USA . 2,130 parts In-Stock

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2,130

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Parana Technologies

USA . 1,048 parts In-Stock

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$87.713

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$87.713

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock unparalleled performance and efficiency with the STM32H7B3IIK6Q microcontroller from STMicroelectronics. With integrated cache, advanced peripherals, and a maximum clock frequency of 50MHz, this product offers cutting-edge technology for a wide range of industrial applications. Experience the exceptional quality and reliability of STMicroelectronics, a leading manufacturer in the industry. Benefit from the value and advantages of the STM32H7B3IIK6Q, delivering superior performance and flexibility to meet your project requirements. Elevate your designs with this innovative microcontroller and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and low cost, making the product a cost-effective choice.

Integrated Cache:

YES - The integrated cache improves processing speed and efficiency, enhancing overall performance.

Surface Mount:

YES - The surface mount design allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage:

3.6 V - The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

On Chip Data RAM Width:

8 - The wide data RAM width enables efficient data processing and storage capabilities.

Address Bus Width:

26 - The large address bus width allows for access to a wide range of memory locations.

Package Shape:

SQUARE - The square package shape offers a compact design, ideal for space-constrained applications.

Bit Size:

32 - The 32-bit architecture provides enhanced processing capabilities and performance.

DAC Channels:

YES - The presence of DAC channels allows for accurate analog signal conversion, expanding functionality.

No. of Terminals:

201 - The high number of terminals provides versatile connectivity options for various peripherals and devices.

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH - This package style offers durability, compactness, and precise connection options.

Minimum Supply Voltage:

1.62 V - The low minimum supply voltage allows for power-efficient operation and compatibility with low-power applications.

Maximum Operating Temperature:

85 °C - The high maximum operating temperature ensures reliability in a wide range of operating environments.

CPU Family:

STM32 - The STM32 CPU family is known for its high performance and advanced features, making it a reliable choice.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures functionality in extreme cold conditions.

ADC Channels:

YES - The availability of ADC channels allows for precise analog signal conversion, enhancing versatility.

DMA Channels:

YES - The presence of DMA channels improves data transfer efficiency and reduces CPU workload.

Terminal Position:

BOTTOM - The bottom terminal position simplifies PCB layout and component arrangement.

ROM Words:

2097152 - The large ROM capacity provides ample storage for program data, enabling complex applications to run smoothly.

Maximum Seated Height:

0.6 mm - The low maximum seated height allows for slim device designs, saving space in compact applications.

Digital To Analog Convertors:

3-Ch 12-Bit - The high-quality DAC channels ensure accurate and reliable analog signal conversion, enhancing output precision.

RAM Words:

1413120 - The large RAM capacity enables efficient data processing and storage, supporting complex algorithms and applications.

Width:

10 mm - The 10 mm width offers a compact form factor, suitable for space-constrained designs.

Boundary Scan:

YES - The boundary scan feature allows for easy testing and debugging of the product during development and production.

External Data Bus Width:

24 - The wide external data bus width enables fast data transfer and processing capabilities.

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(18), WDT(2) - The wide range of peripherals provides additional functionality and versatility for various applications.

Maximum Clock Frequency:

50 MHz - The high maximum clock frequency ensures fast processing speeds and data throughput.

Length:

10 mm - The 10 mm length ensures a compact design, ideal for space-efficient applications.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type:

MICROCONTROLLER, RISC - The RISC microcontroller type offers high performance, low power consumption, and enhanced processing capabilities.

No. of Timers:

18 - The high number of timers provides precise timing control for various functions and tasks.

Technology:

CMOS - The CMOS technology offers low power consumption, high noise immunity, and reliable performance.

Terminal Form:

BALL - The ball terminal form simplifies soldering and connection processes during assembly.

Analog To Digital Convertors:

24-Ch 16-Bit - The multiple ADC channels with high resolution ensure accurate and reliable analog signal conversion for input data.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage provides stable power delivery for consistent performance and operation.

No. of DMA Channels:

5 - The presence of 5 DMA channels enables efficient data transfer and processing, reducing CPU overhead.

PWM Channels:

YES - The availability of PWM channels allows for precise control of pulse-width modulation, ideal for motor control and other applications.

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SPI(6), SDMMC(2), SWPMI, UART(5), USART(5), USB - The wide range of connectivity options provides seamless integration with various peripherals and communication protocols.

ROM Programmability:

FLASH - The flash ROM programmability offers flexibility for firmware updates and customization without removing the chip.

Terminal Pitch:

0.65 mm - The small terminal pitch allows for high-density packaging, suitable for compact designs and miniaturized applications.

Format:

FIXED POINT - The fixed-point format simplifies numerical calculations and data processing, ensuring accuracy and efficiency.

Speed:

280 rpm - The high speed capability enables fast data processing and execution of complex algorithms.

Low Power Mode:

YES - The low-power mode helps reduce power consumption during idle or low-demand periods, extending battery life and efficiency.

On Chip Program ROM Width:

8 - The on-chip program ROM width of 8 bits allows for efficient storage and retrieval of program instructions.

No. of I/O Lines:

128 - The high number of I/O lines offers versatile interfacing options for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers STM32H7B3IIK6Q attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

24

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B201

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of I/O Lines:

128

No. of Terminals:

201

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,15X15,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

1413120

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

280 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(4), LPUART, SAI(2), SPI(6), SDMMC(2), SWPMI, UART(5), USART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(5), POR, RTC, TIMER(18), WDT(2)

Analog To Digital Convertors:

24-Ch 16-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

STM32H7B3IIK6Q Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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