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STM32H757ZIY6TR

STMicroelectronics

STM32H757ZIY6TR by STMicroelectronics

STM32H757ZIY6TR by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 22 timers, CAN and USB connectivity, and low power mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,392 parts In-Stock

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Anansix

USA . 2,041 parts In-Stock

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Digiode

USA . 1,372 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semicontronic

India . 1,151 parts In-Stock

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$7.000

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$6.825

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$6.790

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-

1,151

$7.000

$6.825

$6.790

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AZTECH Wire

Italy . 387 parts In-Stock

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$19.709

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387

$19.709

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Ampacity Inc.

Singapore . 747 parts In-Stock

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$33.000

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747

$33.000

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Aztec Data Supply Inc.

USA . 4,832 parts In-Stock

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$33.020

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$33.020

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IDEA Electronic Components Group

UK . 1,090 parts In-Stock

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$36.988

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$33.289

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Microchip USA

USA . 5,908 parts In-Stock

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$43.145

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Corohmni

South Africa . 219 parts In-Stock

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$51.637

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$51.637

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$51.706

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$49.121

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$49.121

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$51.706

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$49.121

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MKK Technologies

India . 2,341 parts In-Stock

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$69.553

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DigiPath Technology Company

USA . 2,341 parts In-Stock

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$69.553

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Continental Prestige Electronics

USA . 5,469 parts In-Stock

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Corphita

USA . 4,676 parts In-Stock

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Vigor

Singapore . 4,000 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$2.966

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$2.966

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$2.966

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$2.966

$2.966

$2.966

Parana Technologies

USA . 735 parts In-Stock

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$44.224

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Argo Parts USA

USA . 619 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the full potential of your next embedded system with the STM32H757ZIY6TR microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics is known for its exceptional quality and reliability. The STM32H757ZIY6TR offers a wide range of applications, making it the perfect choice for various projects. With its advanced features and integrated cache, this microcontroller provides lightning-fast performance and enhanced efficiency, ensuring seamless operation. Its compact design and surface mount capability make it easy to integrate into any system. Experience the power of the STM32H757ZIY6TR and elevate your projects to new heights with its unmatched value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Address Bus Width: 24

The wide address bus width allows for larger memory addressing capabilities, enabling the microcontroller to handle complex programs and data.

Bit Size: 32

The 32-bit architecture provides higher processing power and performance compared to lower bit sizes, making it suitable for demanding applications.

DAC Channels: YES

The presence of DAC channels allows for accurate analog signal generation, which is essential for applications requiring precise control and monitoring.

ADC Channels: YES

Having ADC channels enables the microcontroller to convert analog signals into digital data, making it suitable for applications involving sensor interfaces and measurements.

DMA Channels: YES

DMA channels help in improving data transfer efficiency by allowing direct memory access without CPU intervention, enhancing the overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and streamlined execution of instructions, making it ideal for real-time applications and tasks.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

The extensive connectivity options enable the microcontroller to easily communicate with other devices and peripherals, enhancing its versatility for various applications.

Technical Specifications

Microcontrollers STM32H757ZIY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B156

Length:

4.96 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

99

No. of Terminals:

156

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA156,12X13,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

1048576

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

480 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.64 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

23-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H757ZIY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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