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STM32H747ZIY6TR

STMicroelectronics

STM32H747ZIY6TR by STMicroelectronics

STM32H747ZIY6TR by STMicroelectronics is a 32-bit microcontroller with 24-bit address bus width, 3.6V max supply voltage, and 48MHz clock frequency. Ideal for industrial applications requiring CAN, I2C, SPI connectivity and featuring 23-Ch ADC, 2-Ch DAC, and low power mode support.

Median Price

$14.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$14.530

100+ parts

-

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94

$14.530

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Vyrian

USA . 5,461 parts In-Stock

1+ parts

-

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5,461

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Digiode

USA . 4,196 parts In-Stock

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4,196

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Anansix

USA . 2,581 parts In-Stock

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2,581

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,510 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

10k+ parts

-

4,510

$8.000

$7.800

$7.760

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Ampacity Inc.

Singapore . 4,911 parts In-Stock

1+ parts

$11.000

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-

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-

4,911

$11.000

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.530

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-

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2,000

$14.530

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AZTECH Wire

Italy . 466 parts In-Stock

1+ parts

$20.830

100+ parts

-

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466

$20.830

-

-

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$37.418

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-

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108

$37.418

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Microchip USA

USA . 6,907 parts In-Stock

1+ parts

$41.269

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-

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6,907

$41.269

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Aztec Data Supply Inc.

USA . 2,659 parts In-Stock

1+ parts

$42.760

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-

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2,659

$42.760

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IDEA Electronic Components Group

UK . 643 parts In-Stock

1+ parts

$57.624

100+ parts

-

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$51.862

10k+ parts

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643

$57.624

-

$51.862

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$84.530

100+ parts

$80.304

1k+ parts

$80.304

10k+ parts

-

2,500

$84.530

$80.304

$80.304

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MKK Technologies

India . 1,655 parts In-Stock

1+ parts

$108.359

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1,655

$108.359

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DigiPath Technology Company

USA . 1,655 parts In-Stock

1+ parts

$108.359

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1,655

$108.359

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QUARKTWIN TECHNOLOGY LTD

USA . 7,566 parts In-Stock

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7,566

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Eastek

USA . 5,000 parts In-Stock

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$17.280

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5,000

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$17.280

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GreenTree Electronics

Israel . 5,000 parts In-Stock

1+ parts

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5,000

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Continental Prestige Electronics

USA . 4,659 parts In-Stock

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4,659

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Argo Parts USA

USA . 2,626 parts In-Stock

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2,626

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Corphita

USA . 2,231 parts In-Stock

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2,231

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Parana Technologies

USA . 178 parts In-Stock

1+ parts

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$68.898

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178

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$68.898

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$4.636

1k+ parts

$4.636

10k+ parts

$4.636

100

-

$4.636

$4.636

$4.636

Modulus Dynamics

Lithuania . 100 parts In-Stock

1+ parts

-

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100

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Overview

Unlock the full potential of your electronic designs with the STM32H747ZIY6TR by STMicroelectronics. This high-quality microcontroller offers unparalleled performance and reliability, thanks to its innovative design and cutting-edge technology. Seamlessly integrated into a wide range of applications, this product provides exceptional value and benefits to customers seeking efficient and powerful solutions for their projects. Experience the advantages of working with a trusted manufacturer like STMicroelectronics, and elevate your designs to new heights with the STM32H747ZIY6TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is commonly used in electronic components, ensuring longevity and portability.

Integrated Cache: YES

Improves overall system performance by reducing access time to frequently used data and instructions.

Surface Mount: YES

Easy to solder onto circuit boards, saving space and providing a clean and organized assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing flexibility in design.

Address Bus Width: 24

Supports large memory address spaces, enabling the handling of more data and complex applications.

Bit Size: 32

Enables high-speed processing and performance for demanding applications.

DAC Channels: YES

Allows for analog output capabilities, essential for interfacing with sensors, actuators, and other analog devices.

No. of Terminals: 156

Offers a high level of connectivity for interfacing with various external components and peripherals.

CPU Family: STM32

Part of a well-established and reliable microcontroller family known for its versatility and performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where higher temperature tolerances are required.

ADC Channels: YES

Enables analog input capabilities for converting external signals into digital data for processing.

Technical Specifications

Microcontrollers STM32H747ZIY6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B156

Length:

4.96 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

99

No. of Terminals:

156

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA156,13X13,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

1019904

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.58 mm

Speed:

480 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.64 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA, POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

23-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H747ZIY6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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