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STM32H747AII6TR

STMicroelectronics

STM32H747AII6TR by STMicroelectronics

STM32H747AII6TR microcontroller from STMicroelectronics features a 32-bit CPU with a max clock frequency of 48 MHz, integrated DAC and ADC channels, and operates in extreme temperatures (-40 °C to 85 °C). Ideal for industrial applications, it supports various connectivity options. Its compact design includes a very thin profile grid array package with 169 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,298 parts In-Stock

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7,298

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Anansix

USA . 2,487 parts In-Stock

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2,487

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Digiode

USA . 1,325 parts In-Stock

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1,325

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Distributors (Availability)

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AZTECH Wire

Italy . 71 parts In-Stock

1+ parts

$19.430

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71

$19.430

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

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$27.358

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-

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$24.622

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1,982

$27.358

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$24.622

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MKK Technologies

India . 1,971 parts In-Stock

1+ parts

$51.445

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1,971

$51.445

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DigiPath Technology Company

USA . 1,971 parts In-Stock

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$51.445

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1,971

$51.445

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Corphita

USA . 4,560 parts In-Stock

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4,560

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Parana Technologies

USA . 2,109 parts In-Stock

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$32.711

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2,109

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$32.711

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Overview

Unleash your innovation with the STM32H747AII6TR microcontroller from STMicroelectronics, the trusted leader in semiconductor solutions. This powerhouse is designed for industrial applications, delivering exceptional performance and energy efficiency. Its versatile connectivity options and robust features empower developers to create cutting-edge IoT devices, smart appliances, and automation systems, ensuring reliability and quality that enhance your product's value and marketability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material provides a robust housing, suitable for varied applications.

Integrated Cache: YES

Improves processing efficiency and speed, enhancing overall performance.

Surface Mount: YES

Allows for compact designs and easy assembly in modern electronics.

Maximum Supply Voltage: 3.6 V

Supports a range of power sources, contributing to flexibility in design.

On Chip Data RAM Width: 8

Enables efficient data handling for applications requiring quick data access.

Address Bus Width: 26

Allows for a large memory addressing range, enhancing capability in complex applications.

Package Shape: SQUARE

Optimizes layout and placement on PCB, suitable for tight spaces.

Bit Size: 32

Provides sufficient processing power for a wide range of applications.

DAC Channels: YES

Integrated digital to analog conversion offers versatility in output signal generation.

No. of Terminals: 169

Offers extensive connectivity options for complex systems and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Space-efficient design enables high-density PCB layouts.

Minimum Supply Voltage: 1.62 V

Low-voltage operation supports battery-powered applications with extended lifetimes.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring reliability under demanding conditions.

CPU Family: STM32

Widely recognized family with strong community support and resources.

Minimum Operating Temperature: -40 °C

Enables use in harsh environments, ensuring functionality in extreme conditions.

ADC Channels: YES

Facilitates analog signal processing, critical for sensor and control applications.

DMA Channels: YES

Allows for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Enhances thermal performance and ease of integration on PCBs.

ROM Words: 2097152

Provides ample storage for complex applications and firmware.

Maximum Seated Height: 0.6 mm

Ultra-thin profile aids in design flexibility and compactness.

Digital To Analog Converters: 2-Ch 12-Bit

Offers high-resolution analog outputs for precise signal generation.

RAM Words: 1019904

Generous RAM allows for complex computations and smooth multi-tasking.

Width: 7 mm

Compact dimensions enable integration into space-limited designs.

Boundary Scan: YES

Facilitates easier testing and debugging in manufacturing and development.

External Data Bus Width: 16

Supports efficient data transfer and connection to external memory or devices.

Peripherals: BOR, COMPARATOR(2), DMA, POR, RTC, TIMER(22), WDT(4)

Comprehensive peripheral set enhances functionality for various applications.

Maximum Clock Frequency: 48 MHz

Provides sufficient speed for most control, communication, and processing tasks.

Length: 7 mm

Contributes to a compact design footprint, ideal for portable applications.

Temperature Grade: INDUSTRIAL

Designed for long-term operation in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Efficient architecture allows for power-efficient designs and high performance.

No. of Timers: 22

Flexible timing options support a variety of applications and control scenarios.

Technology: CMOS

Ensures low power consumption while maintaining high performance.

Terminal Form: BALL

Allows for easier access in multi-layer PCB designs.

Analog To Digital Converters: 28-Ch 16-Bit

High-resolution ADCs enable precise measurements for sensor applications.

Nominal Supply Voltage: 3.3 V

Common voltage requirement makes it compatible with many power supplies.

No. of DMA Channels: 4

More DMA channels allow for improved data handling efficiency.

PWM Channels: YES

Pulse Width Modulation support enables control of motors and other devices.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Versatile communication options facilitate easy integration into diverse applications.

ROM Programmability: FLASH

Flash memory enables easy updates and modifications to firmware.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density component placement on PCBs.

Format: FIXED POINT

Fixed-point format enhances arithmetic precision for various applications.

Speed: 480 rpm

Sufficient speed for motion control applications, enhancing responsiveness.

Low Power Mode: YES

Extends battery life in portable applications by reducing power consumption.

On Chip Program ROM Width: 8

Facilitates efficient code execution with compact storage.

No. of I/O Lines: 112

A high number of input/output lines provide flexibility in interfacing with various peripherals.

Technical Specifications

Microcontrollers STM32H747AII6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

STM32

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

112

No. of Terminals:

169

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

1019904

ROM Words:

2097152

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

480 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SPI(6), SDMMC(2), SWPMI, UART(4), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA, POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

28-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H747AII6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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