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STM32H745IGK6

STMicroelectronics

STM32H745IGK6 by STMicroelectronics

STM32H745IGK6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 1048576 bytes of RAM, and 36-Ch 16-Bit ADC. It operates at up to 48 MHz clock frequency, suitable for applications requiring high-speed data processing and connectivity via CAN, ETHERNET, I2C, SPI, UART, USB interfaces. The package style is GRID ARRAY with very thin profile and fine pitch terminals.

Median Price

$8.742

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,008 parts In-Stock

1+ parts

$8.373

100+ parts

-

1k+ parts

-

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5,008

$8.373

-

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Verical

USA . 5,008 parts In-Stock

1+ parts

-

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5,008

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Future Electronics

Canada . 4,032 parts In-Stock

1+ parts

-

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-

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10k+ parts

$9.110

4,032

-

-

-

$9.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 217 parts In-Stock

1+ parts

$11.845

100+ parts

-

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217

$11.845

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Vyrian

USA . 7,818 parts In-Stock

1+ parts

-

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7,818

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-

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IBS Electronics

USA . 4,032 parts In-Stock

1+ parts

-

100+ parts

-

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$12.160

4,032

-

-

-

$12.160

Anansix

USA . 541 parts In-Stock

1+ parts

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541

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Nova Conductors

Japan . 55 parts In-Stock

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55

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,155 parts In-Stock

1+ parts

$8.930

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

$8.930

-

-

-

Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$10.600

100+ parts

-

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-

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32

$10.600

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Semicontronic

India . 24 parts In-Stock

1+ parts

$10.600

100+ parts

$10.335

1k+ parts

$10.282

10k+ parts

-

24

$10.600

$10.335

$10.282

-

Corphita

USA . 791 parts In-Stock

1+ parts

$11.221

100+ parts

-

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791

$11.221

-

-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$17.599

100+ parts

$16.719

1k+ parts

$16.719

10k+ parts

-

5,000

$17.599

$16.719

$16.719

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Corohmni

South Africa . 274 parts In-Stock

1+ parts

$27.814

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274

$27.814

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Microchip USA

USA . 3,301 parts In-Stock

1+ parts

$41.177

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3,301

$41.177

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Aztec Data Supply Inc.

USA . 1,825 parts In-Stock

1+ parts

$53.990

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-

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1,825

$53.990

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IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$73.098

100+ parts

-

1k+ parts

$65.788

10k+ parts

-

863

$73.098

-

$65.788

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MKK Technologies

India . 1,976 parts In-Stock

1+ parts

$137.455

100+ parts

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1,976

$137.455

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DigiPath Technology Company

USA . 1,976 parts In-Stock

1+ parts

$137.455

100+ parts

-

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10k+ parts

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1,976

$137.455

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Continental Prestige Electronics

USA . 5,867 parts In-Stock

1+ parts

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5,867

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Vigor

Singapore . 1,779 parts In-Stock

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1,779

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Parana Technologies

USA . 1,324 parts In-Stock

1+ parts

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$87.399

1k+ parts

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10k+ parts

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1,324

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$87.399

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

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500

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Argo Parts USA

USA . 375 parts In-Stock

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375

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Overview

Unleash the power of innovation with the STM32H745IGK6 by STMicroelectronics, a cutting-edge microcontroller that offers unparalleled quality and reliability. Designed by a trusted manufacturer, this device is perfect for a wide range of applications in various industries. With integrated cache and advanced features, this microcontroller delivers superior performance and efficiency. Experience seamless connectivity and enhanced functionality with the STM32H745IGK6, providing exceptional value and benefits to customers looking to stay ahead in today's competitive market. Unlock endless possibilities and elevate your projects with this top-of-the-line microcontroller.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by reducing access time to frequently used data, making it a good choice for applications that require high speed processing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the microcontroller, making it suitable for a wide range of applications.

Bit Size: 32

The 32-bit architecture provides higher processing capabilities and performance compared to lower bit microcontrollers, making it suitable for complex tasks and high-speed applications.

ADC Channels: YES

Having Analog-To-Digital Converters (ADC) channels allows the microcontroller to interface with analog sensors, making it suitable for applications that require analog input processing.

DAC Channels: YES

Having Digital-To-Analog Converters (DAC) channels allows the microcontroller to generate analog signals, making it suitable for applications that require analog output capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computing (RISC) microcontroller simplifies the instruction set, leading to faster execution of instructions and efficient use of resources, making it a good choice for embedded applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for fast operation and execution of instructions, making it suitable for real-time applications and tasks that require high computational speed.

Connectivity: CAN(2), ETHERNET, I2C(4), I2S(3), SAI(4), SPI(6), UART(5), USART(4), USB

Having a wide range of connectivity options such as Ethernet, I2C, SPI, UART, and USB makes the microcontroller versatile and enables it to communicate with different devices and systems, making it suitable for applications that require communication with various interfaces.

Technical Specifications

Microcontrollers STM32H745IGK6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B201

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

128

No. of Serial I/Os:

11

No. of Terminals:

201

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,15X15,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1048576

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

480 rpm

Maximum Supply Current:

462 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(4), I2S(3), SAI(4), SPI(6), UART(5), USART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(22), WDT(4)

Analog To Digital Convertors:

36-Ch 16-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

STM32H745IGK6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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