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STM32H743XGH6

STMicroelectronics

STM32H743XGH6 by STMicroelectronics

STM32H743XGH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 36-Ch 16-Bit ADC, and 2-Ch 12-Bit DAC. It operates at up to 48 MHz, has 21 timers, and supports various connectivity options like CAN, I2C, UART. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$10.421

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,235 parts In-Stock

1+ parts

$10.421

100+ parts

-

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1,235

$10.421

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Verical

USA . 1,235 parts In-Stock

1+ parts

$10.421

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-

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1,235

$10.421

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Chip1Stop

Japan . 1,338 parts In-Stock

1+ parts

$13.495

100+ parts

-

1k+ parts

$12.206

10k+ parts

-

1,338

$13.495

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$12.206

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EBV Elektronik

Germany . 595 parts In-Stock

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595

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Distributors (In-Stock)

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Digiode

USA . 4,146 parts In-Stock

1+ parts

$11.623

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-

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4,146

$11.623

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Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$15.217

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42

$15.217

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Vyrian

USA . 9,879 parts In-Stock

1+ parts

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9,879

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Anansix

USA . 2,158 parts In-Stock

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2,158

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IBS Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$12.482

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20

-

$12.482

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 568 parts In-Stock

1+ parts

$10.540

100+ parts

-

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-

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568

$10.540

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-

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Semicontronic

India . 467 parts In-Stock

1+ parts

$10.540

100+ parts

$10.276

1k+ parts

$10.224

10k+ parts

-

467

$10.540

$10.276

$10.224

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Corphita

USA . 541 parts In-Stock

1+ parts

$11.012

100+ parts

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541

$11.012

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Continental Prestige Electronics

USA . 371 parts In-Stock

1+ parts

$15.214

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10k+ parts

$14.910

371

$15.214

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-

$14.910

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$15.217

100+ parts

$14.913

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1,000

$15.217

$14.913

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Corohmni

South Africa . 183 parts In-Stock

1+ parts

$17.111

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183

$17.111

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AZTECH Wire

Italy . 242 parts In-Stock

1+ parts

$19.700

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242

$19.700

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$26.879

100+ parts

$25.535

1k+ parts

$25.535

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-

2,000

$26.879

$25.535

$25.535

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Microchip USA

USA . 3,206 parts In-Stock

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$42.600

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3,206

$42.600

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IDEA Electronic Components Group

UK . 951 parts In-Stock

1+ parts

$49.614

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$44.652

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951

$49.614

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$44.652

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Aztec Data Supply Inc.

USA . 2,383 parts In-Stock

1+ parts

$55.970

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2,383

$55.970

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MKK Technologies

India . 1,389 parts In-Stock

1+ parts

$93.295

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1,389

$93.295

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DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$93.295

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1,389

$93.295

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Argo Parts USA

USA . 2,631 parts In-Stock

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2,631

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Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

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100+ parts

$59.321

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2,226

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$59.321

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

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100+ parts

$12.268

1k+ parts

$12.268

10k+ parts

$12.268

500

-

$12.268

$12.268

$12.268

GreenTree Electronics

Israel . 64 parts In-Stock

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64

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Overview

Unlock the full potential of your projects with the STM32H743XGH6 Microcontroller by STMicroelectronics. Built with top-quality materials and cutting-edge technology, this device offers unmatched performance and reliability. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller provides seamless integration, advanced features, and exceptional value. Elevate your designs and bring your ideas to life with the STM32H743XGH6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and reliability for the product.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and efficiency of the microcontroller.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the microcontroller on PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller is suitable for a wide range of applications.

On Chip Data RAM Width: 8

The 8-bit data RAM width offers sufficient memory for data storage and processing tasks.

Address Bus Width: 26

The 26-bit address bus width enables the microcontroller to access a large memory space efficiently.

Package Shape: SQUARE

The square package shape facilitates space-saving integration on PCBs.

Bit Size: 32

The 32-bit architecture provides enhanced computational capability for demanding applications.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to interface with analog components effectively.

No. of Terminals: 265

The abundance of terminals allows for versatile connectivity options in complex systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The unique package style offers high-density mounting and excellent thermal performance.

Minimum Supply Voltage: 1.62 V

The low minimum supply voltage makes this microcontroller energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions.

CPU Family: CORTEX-M7

The Cortex-M7 CPU family provides high performance and efficiency for embedded systems.

Minimum Operating Temperature: -40 °C

The wide operating temperature range (-40 to 85°C) ensures reliable operation in extreme environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data accurately.

DMA Channels: YES

The availability of DMA channels enhances data transfer efficiency and reduces CPU workload.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and assembly processes.

ROM Words: 1048576

The large ROM capacity of 1048576 words allows for storing a significant amount of program data.

Maximum Seated Height: 1.1 mm

The low maximum seated height makes this microcontroller suitable for compact designs.

Digital To Analog Convertors: 2-Ch 12-Bit

The high-resolution 12-bit DACs provide accurate analog output signals for precise control applications.

Width: 14 mm

The compact width of 14 mm enables easy integration into space-constrained designs.

Boundary Scan: YES

The boundary scan feature simplifies testing and debugging processes during product development.

External Data Bus Width: 32

The 32-bit external data bus width allows for fast data transfer between the microcontroller and external peripherals.

Technical Specifications

Microcontrollers STM32H743XGH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B265

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

168

No. of Serial I/Os:

11

No. of Terminals:

265

No. of Timers:

21

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA265,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1085440

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

480 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

36-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H743XGH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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