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STM32H742BGT6

STMicroelectronics

STM32H742BGT6 by STMicroelectronics

STM32H742BGT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 26-bit address bus, and 8-bit on-chip data RAM. It features 2 DAC channels, 32 ADC channels, and 21 timers for industrial applications requiring high-speed processing at up to 48 MHz clock frequency.

Median Price

$8.480

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.480

10k+ parts

-

1,080

-

-

$8.480

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.231

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$15.231

-

-

-

Vyrian

USA . 10,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,455

-

-

-

-

Digiode

USA . 4,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,860

-

-

-

-

Anansix

USA . 1,866 parts In-Stock

1+ parts

-

100+ parts

-

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-

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-

1,866

-

-

-

-

IBS Electronics

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.875

10k+ parts

-

1,080

-

-

$12.875

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,032 parts In-Stock

1+ parts

$7.790

100+ parts

$7.595

1k+ parts

$7.556

10k+ parts

-

1,032

$7.790

$7.595

$7.556

-

Ampacity Inc.

Singapore . 584 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

-

10k+ parts

-

584

$8.130

-

-

-

Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$15.230

100+ parts

$14.468

1k+ parts

-

10k+ parts

$13.555

450

$15.230

$14.468

-

$13.555

Continental Prestige Electronics

USA . 3,489 parts In-Stock

1+ parts

$15.231

100+ parts

-

1k+ parts

-

10k+ parts

$14.926

3,489

$15.231

-

-

$14.926

AZTECH Wire

Italy . 84 parts In-Stock

1+ parts

$18.050

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$18.050

-

-

-

Microchip USA

USA . 2,318 parts In-Stock

1+ parts

$42.647

100+ parts

-

1k+ parts

-

10k+ parts

-

2,318

$42.647

-

-

-

Aztec Data Supply Inc.

USA . 4,795 parts In-Stock

1+ parts

$51.050

100+ parts

-

1k+ parts

-

10k+ parts

-

4,795

$51.050

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$53.448

100+ parts

$50.775

1k+ parts

$50.775

10k+ parts

-

5,000

$53.448

$50.775

$50.775

-

IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$59.140

100+ parts

-

1k+ parts

$53.226

10k+ parts

-

1,890

$59.140

-

$53.226

-

Corohmni

South Africa . 379 parts In-Stock

1+ parts

$83.226

100+ parts

-

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379

$83.226

-

-

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MKK Technologies

India . 1,022 parts In-Stock

1+ parts

$111.210

100+ parts

-

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1,022

$111.210

-

-

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DigiPath Technology Company

USA . 1,022 parts In-Stock

1+ parts

$111.210

100+ parts

-

1k+ parts

-

10k+ parts

-

1,022

$111.210

-

-

-

Vigor

Singapore . 4,100 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,100

-

-

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Corphita

USA . 1,320 parts In-Stock

1+ parts

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1,320

-

-

-

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Parana Technologies

USA . 877 parts In-Stock

1+ parts

-

100+ parts

$70.711

1k+ parts

-

10k+ parts

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877

-

$70.711

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Argo Parts USA

USA . 65 parts In-Stock

1+ parts

-

100+ parts

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65

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-

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Overview

Unleash the power of innovation with the STM32H742BGT6 by STMicroelectronics. Built with top-notch quality and cutting-edge technology, this microcontroller offers unmatched performance and reliability. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product delivers exceptional value and benefits to customers. Trust in STMicroelectronics' expertise and elevate your designs with the STM32H742BGT6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache improves the performance of the microcontroller by reducing access times to frequently used data, enhancing overall speed and efficiency.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V provides flexibility and compatibility with various power sources.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels allows for the conversion of analog signals to digital data, enabling accurate sensor readings and data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels enable high-speed data transfer between peripherals and memory without CPU intervention, optimizing performance and efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller design, ensures efficient execution of instructions, lower power consumption, and faster processing speeds.

Connectivity: CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

Offering a wide range of connectivity options including CAN, I2C, UART, and USB enables seamless communication with various devices and interfaces, enhancing versatility and compatibility.

Low Power Mode: YES

Supporting low power modes helps in reducing power consumption during idle or low workload scenarios, prolonging battery life and promoting energy efficiency.

Technical Specifications

Microcontrollers STM32H742BGT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of I/O Lines:

168

No. of Serial I/Os:

11

No. of Terminals:

208

No. of Timers:

21

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP208,1.2SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

708608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

480 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

28 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(4), I2S(3), LPUART, SAI(4), SDMMC(2), UART(4), USART(4), USB(2)

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

32-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H742BGT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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