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STM32H725VET6TR

STMicroelectronics

STM32H725VET6TR by STMicroelectronics

STM32H725VET6TR microcontroller from STMicroelectronics features a powerful Cortex-M7 CPU, 577KB RAM, and 2 DAC channels. It operates at a max clock frequency of 50 MHz and supports various connectivity options like Ethernet and USB. Ideal for advanced embedded applications requiring high performance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,044 parts In-Stock

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5,044

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Anansix

USA . 2,895 parts In-Stock

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2,895

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Digiode

USA . 664 parts In-Stock

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664

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Distributors (Availability)

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AZTECH Wire

Italy . 54 parts In-Stock

1+ parts

$11.870

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54

$11.870

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IDEA Electronic Components Group

UK . 60 parts In-Stock

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$62.050

100+ parts

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$55.845

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60

$62.050

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$55.845

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MKK Technologies

India . 1,970 parts In-Stock

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$116.682

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1,970

$116.682

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DigiPath Technology Company

USA . 1,970 parts In-Stock

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$116.682

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1,970

$116.682

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Corphita

USA . 2,089 parts In-Stock

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2,089

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Parana Technologies

USA . 1,058 parts In-Stock

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$74.191

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1,058

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$74.191

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Overview

Unlock the future of innovation with the STM32H725VET6TR microcontroller from STMicroelectronics. Renowned for exceptional quality and reliability, this advanced Cortex-M7 powerhouse is perfect for diverse applications, from industrial automation to smart home devices. With integrated analog converters and versatile connectivity options, it empowers developers to create efficient, high-performance solutions while enjoying unmatched support from a trusted leader in semiconductor technology. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and thermal stability, making it suitable for various applications.

Integrated Cache: YES

The presence of integrated cache enables faster data access, improving overall processing speed and efficiency.

Surface Mount: YES

Surface mount technology allows for a smaller footprint, facilitating compact designs and ease of integration on PCBs.

Maximum Supply Voltage: 3.6 V

With a relatively low maximum supply voltage, this microcontroller is well-suited for low-power applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width can efficiently handle simpler data operations, making it ideal for embedded systems.

Package Shape: SQUARE

The square package shape provides uniform dimensions for easier layout on circuit boards.

Bit Size: 32

A 32-bit architecture allows for handling larger data sizes and more complex calculations, enhancing performance.

DAC Channels: YES

Integrated DAC channels facilitate direct digital-to-analog conversion, useful in audio and sensor applications.

No. of Terminals: 100

A higher number of terminals allows for extensive connectivity options and versatility in peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style contributes to a sleek design, supporting modern compact electronic devices.

Minimum Supply Voltage: 1.71 V

Supports operation at lower voltages, making this microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in a wide range of environments.

CPU Family: CORTEX-M7

The Cortex-M7 core delivers high performance with advanced features, making it ideal for demanding applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, this microcontroller is suitable for industrial and outdoor applications.

ADC Channels: YES

Integrated ADC channels enhance the ability to process analog signals, essential in sensor interfacing.

DMA Channels: YES

Direct Memory Access (DMA) channels improve efficiency by allowing peripherals to transfer data without CPU intervention.

Terminal Position: QUAD

Quad terminal positioning offers more robust connections and helps in achieving better soldering quality.

ROM Words: 524288

A substantial ROM capacity provides ample space for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

The low seated height supports compact design layouts, essential for modern electronics.

Digital To Analog Converters: 2-Ch 12-Bit

Dual-channel 12-bit DACs enable precise analog signal generation, beneficial in audio and sensor applications.

Width: 14 mm

The compact width supports space-efficient designs in various electronic applications.

Boundary Scan: YES

Support for boundary scan enhances testing capabilities, simplifying the debugging and manufacturing process.

Peripherals: ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

A rich set of peripherals increases functionality, allowing for diverse applications in different domains.

Maximum Clock Frequency: 50 MHz

A maximum clock frequency of 50 MHz allows for high-speed operations, making this microcontroller suitable for performance-critical applications.

Length: 14 mm

The 14 mm length aids in fitting into tight spaces, reflecting its design for modern electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures efficient instruction execution, optimizing performance for embedded systems.

No. of Timers: 24

An extensive number of timers enables precise timing control, essential in real-time applications.

RAM Bytes: 577536

A large RAM capacity supports complex computations and data handling, enhancing overall functionality.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, suitable for compact designs.

Terminal Form: GULL WING

Gull wing terminals provide reliable electrical connections and ease of soldering, enhancing manufacturing efficiency.

Analog To Digital Converters: 26-Ch 16-Bit, 4-Ch 12-Bit

Having multiple ADC channels with high-bit resolution allows for accurate signal conversion and data acquisition, making it versatile for various applications.

Maximum Supply Current: 360 mA

A maximum supply current of 360 mA ensures the device can drive multiple peripherals while maintaining stable operation.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8 V decreases power consumption, aiding in energy-efficient designs.

No. of DMA Channels: 16

The presence of 16 DMA channels enables efficient data handling, maximizing throughput and freeing up CPU resources.

No. of Serial I/Os: 12

With 12 serial I/O lines, connectivity is flexible and sufficient for interfacing with multiple devices.

PWM Channels: YES

PWM channels allow for effective motor control and dimming functions, enhancing the microcontroller's versatility.

Connectivity: ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(4), USART(4), USB

A broad range of connectivity options makes the product adaptable for various communication tasks across different applications.

ROM Programmability: FLASH

Flash ROM programmability allows easy updates and modifications to the firmware, enhancing the flexibility of the device.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact PCB layout and higher density designs, accommodating more features in limited space.

Format: FLOATING POINT

Floating point format enables complex mathematical computations, enhancing the calculation capabilities of the microcontroller.

Speed: 550 rpm

Operating at a speed of 550 rpm indicates good processing capability for applications needing high responsiveness.

Low Power Mode: YES

Support for low power mode makes it suitable for battery-operated devices, improving energy efficiency.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for simple instruction encoding, making it suitable for straightforward applications.

No. of I/O Lines: 67

Having 67 I/O lines provides extensive interfacing options, allowing for complex system integration.

Technical Specifications

Microcontrollers STM32H725VET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

67

No. of Serial I/Os:

12

No. of Terminals:

100

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(4), USART(4), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

26-Ch 16-Bit, 4-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725VET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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