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STM32H725VEH6

STMicroelectronics

STM32H725VEH6 by STMicroelectronics

STM32H725VEH6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 577536 bytes of RAM, and 24 timers. It features 26-Ch 16-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like Ethernet, CAN(3), and USB. Ideal for applications requiring high-performance computing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,678 parts In-Stock

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3,678

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Vyrian

USA . 3,546 parts In-Stock

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3,546

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Anansix

USA . 939 parts In-Stock

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939

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 927 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

927

$4.000

$3.900

$3.880

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AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$19.390

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612

$19.390

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Ampacity Inc.

Singapore . 330 parts In-Stock

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$21.000

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330

$21.000

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Microchip USA

USA . 4,263 parts In-Stock

1+ parts

$24.535

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4,263

$24.535

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Corohmni

South Africa . 960 parts In-Stock

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$41.902

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960

$41.902

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IDEA Electronic Components Group

UK . 341 parts In-Stock

1+ parts

$45.689

100+ parts

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$41.120

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341

$45.689

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$41.120

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Aztec Data Supply Inc.

USA . 1,578 parts In-Stock

1+ parts

$46.900

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1,578

$46.900

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$69.649

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$66.166

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$66.166

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2,000

$69.649

$66.166

$66.166

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MKK Technologies

India . 1,076 parts In-Stock

1+ parts

$85.915

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1,076

$85.915

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DigiPath Technology Company

USA . 1,076 parts In-Stock

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$85.915

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$85.915

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Argo Parts USA

USA . 3,906 parts In-Stock

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Continental Prestige Electronics

USA . 1,170 parts In-Stock

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1,170

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Parana Technologies

USA . 485 parts In-Stock

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$54.628

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485

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$54.628

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Corphita

USA . 443 parts In-Stock

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443

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock the power of innovation with the STM32H725VEH6 microcontroller by STMicroelectronics. Known for their top-quality products, STMicroelectronics delivers cutting-edge technology that exceeds expectations in the industry. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers looking for reliability and performance. Experience seamless connectivity, advanced features, and efficient operation with the STM32H725VEH6, setting a new standard in the world of microcontrollers. Elevate your projects to the next level with this versatile and high-performing device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable applications.

Integrated Cache: YES

The integrated cache enhances the performance of the microcontroller by reducing access times to frequently used instructions and data.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on a PCB, saving space and time during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options, allowing for use in a wide range of applications.

On Chip Data RAM Width: 8

With a data RAM width of 8, this microcontroller can handle and process data efficiently, contributing to high performance.

Package Shape: SQUARE

The square package shape makes this microcontroller easy to mount and secure on a PCB, ensuring stability in operation.

Bit Size: 32

The 32-bit architecture of this microcontroller enables it to process and handle large amounts of data, suitable for complex applications.

DAC Channels: YES

The presence of DAC channels allows for analog signal generation, making this microcontroller suitable for applications requiring precise analog outputs.

No. of Terminals: 100

The large number of terminals provides ample connectivity options for interfacing with various external devices and sensors.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch makes this microcontroller compact and ideal for space-constrained designs.

Technical Specifications

Microcontrollers STM32H725VEH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

74

No. of Serial I/Os:

14

No. of Terminals:

100

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(5), SWPMI, UART(6), USART(4), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

26-Ch 16-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725VEH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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