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STM32H725AGI3

STMicroelectronics

STM32H725AGI3 by STMicroelectronics

STM32H725AGI3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 577536 bytes of RAM, and 1048576 ROM words. It features 38-Ch 16-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like Ethernet, CAN(3), and USB. Ideal for applications requiring high-speed processing and extensive connectivity options.

Median Price

$6.940

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 9,219 parts In-Stock

1+ parts

-

100+ parts

$6.940

1k+ parts

-

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9,219

-

$6.940

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 96 parts In-Stock

1+ parts

$11.680

100+ parts

-

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-

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96

$11.680

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Digiode

USA . 217 parts In-Stock

1+ parts

$13.690

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-

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217

$13.690

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-

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IBS Electronics

USA . 9,625 parts In-Stock

1+ parts

-

100+ parts

$9.271

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-

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9,625

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$9.271

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Vyrian

USA . 8,968 parts In-Stock

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8,968

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Chip Stock

USA . 3,996 parts In-Stock

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3,996

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Anansix

USA . 2,205 parts In-Stock

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2,205

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,836 parts In-Stock

1+ parts

$6.370

100+ parts

$6.211

1k+ parts

$6.179

10k+ parts

-

2,836

$6.370

$6.211

$6.179

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$11.446

100+ parts

-

1k+ parts

$10.989

10k+ parts

-

2,000

$11.446

-

$10.989

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Continental Prestige Electronics

USA . 1,046 parts In-Stock

1+ parts

$11.680

100+ parts

-

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-

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$11.446

1,046

$11.680

-

-

$11.446

Corphita

USA . 1,316 parts In-Stock

1+ parts

$12.969

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-

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1,316

$12.969

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Ampacity Inc.

Singapore . 2,879 parts In-Stock

1+ parts

$13.860

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-

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2,879

$13.860

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Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$20.349

100+ parts

$19.331

1k+ parts

$19.331

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-

650

$20.349

$19.331

$19.331

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Microchip USA

USA . 3,780 parts In-Stock

1+ parts

$30.754

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3,780

$30.754

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Corohmni

South Africa . 561 parts In-Stock

1+ parts

$45.867

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-

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561

$45.867

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IDEA Electronic Components Group

UK . 145 parts In-Stock

1+ parts

$48.254

100+ parts

-

1k+ parts

$43.429

10k+ parts

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145

$48.254

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$43.429

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Aztec Data Supply Inc.

USA . 1,619 parts In-Stock

1+ parts

$67.010

100+ parts

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1,619

$67.010

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MKK Technologies

India . 2,299 parts In-Stock

1+ parts

$90.738

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2,299

$90.738

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DigiPath Technology Company

USA . 2,299 parts In-Stock

1+ parts

$90.738

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2,299

$90.738

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Lixinc

USA . 8,260 parts In-Stock

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8,260

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GreenTree Electronics

Israel . 7,488 parts In-Stock

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7,488

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Argo Parts USA

USA . 1,630 parts In-Stock

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1,630

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Parana Technologies

USA . 152 parts In-Stock

1+ parts

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100+ parts

$57.695

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152

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$57.695

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Overview

Unlock unparalleled performance and reliability with the STM32H725AGI3 microcontroller by industry leader STMicroelectronics. Designed for a wide range of applications, this cutting-edge device offers integrated cache, advanced peripherals, and low power modes for optimal efficiency. With a maximum clock frequency of 50 MHz and a multitude of connectivity options including USB, Ethernet, and CAN, the STM32H725AGI3 provides unmatched versatility and flexibility. Trust STMicroelectronics for top-quality products that deliver exceptional value and performance to meet all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable or rugged applications.

Integrated Cache: YES

The integrated cache improves the overall performance and efficiency of this microcontroller, allowing for faster data access and processing.

Surface Mount: YES

The surface mount capability simplifies the assembly process and makes this microcontroller suitable for compact designs with minimal space requirements.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can accommodate a wide range of power sources and external components, enhancing its versatility.

On Chip Data RAM Width: 8

The 8-bit data RAM width enables efficient data storage and retrieval, contributing to the overall speed and responsiveness of this microcontroller.

Package Shape: SQUARE

The square package shape offers a compact footprint, making this microcontroller easy to integrate into various electronic devices without wasting space.

Bit Size: 32

The 32-bit architecture of this microcontroller allows for high-speed processing and advanced computational capabilities, suitable for demanding applications.

DAC Channels: YES

The presence of DAC channels enables accurate analog signal generation, making this microcontroller well-suited for applications that require precise control over analog outputs.

No. of Terminals: 169

The extensive number of terminals provides ample input and output options, enhancing the connectivity and functionality of this microcontroller.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, offers optimized signal integrity and thermal performance, making this microcontroller suitable for high-density designs.

Technical Specifications

Microcontrollers STM32H725AGI3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M7

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

121

No. of Serial I/Os:

14

No. of Terminals:

169

No. of Timers:

24

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA169,13X13,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

577536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

550 rpm

Maximum Supply Current:

360 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, CAN(3), I2C(5), I2S(4), LPUART, SAI(2), SDMMC(2), SPI(6), SWPMI, UART(5), USART(5), USB

Peripherals:

ANALOG COMPARATOR(2), BOR, DMA(16), LCD, POR, RTC, TIMER(24), WDT(2)

Analog To Digital Convertors:

38-Ch 16-Bit, 17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H725AGI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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