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STM32H562RGT6

STMicroelectronics

STM32H562RGT6 by STMicroelectronics

STM32H562RGT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M33 CPU family. It features 22 timers, 16-ch ADC, and 2-ch DAC for versatile applications in IoT, industrial automation, and consumer electronics. With a clock frequency of up to 50 MHz and low power mode support, it offers high performance and energy efficiency.

Median Price

$5.800

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 140 parts In-Stock

1+ parts

$5.790

100+ parts

$3.700

1k+ parts

$3.100

10k+ parts

$2.580

140

$5.790

$3.700

$3.100

$2.580

Mouser Electronics

USA . 836 parts In-Stock

1+ parts

$5.810

100+ parts

$3.740

1k+ parts

$3.230

10k+ parts

-

836

$5.810

$3.740

$3.230

-

DigiKey

USA . 412 parts In-Stock

1+ parts

$5.810

100+ parts

$3.738

1k+ parts

$3.364

10k+ parts

$3.271

412

$5.810

$3.738

$3.364

$3.271

Farnell

UK . 200 parts In-Stock

1+ parts

$5.850

100+ parts

$3.770

1k+ parts

$3.450

10k+ parts

-

200

$5.850

$3.770

$3.450

-

Future Electronics

Canada . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.580

10k+ parts

-

960

-

-

$2.580

-

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$4.120

1k+ parts

$3.750

10k+ parts

-

200

-

$4.120

$3.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$3.860

-

-

-

TME

Poland . 138 parts In-Stock

1+ parts

$5.440

100+ parts

$4.120

1k+ parts

-

10k+ parts

-

138

$5.440

$4.120

-

-

Digiode

USA . 1,621 parts In-Stock

1+ parts

$6.090

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

$6.090

-

-

-

IBS Electronics

USA . 14,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.871

10k+ parts

-

14,400

-

-

$3.871

-

Chip Stock

USA . 11,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,100

-

-

-

-

Vyrian

USA . 8,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,836

-

-

-

-

Anansix

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,139

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,938 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

$2.770

-

-

-

Semicontronic

India . 1,864 parts In-Stock

1+ parts

$2.890

100+ parts

$2.818

1k+ parts

$2.803

10k+ parts

-

1,864

$2.890

$2.818

$2.803

-

Argo Parts USA

USA . 4,137 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,137

$3.860

-

-

-

Continental Prestige Electronics

USA . 2,701 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

$3.783

2,701

$3.860

-

-

$3.783

Bastille Electronics

Australia . 3,818 parts In-Stock

1+ parts

$3.860

100+ parts

$3.667

1k+ parts

$3.484

10k+ parts

$3.435

3,818

$3.860

$3.667

$3.484

$3.435

Corphita

USA . 172 parts In-Stock

1+ parts

$5.769

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$5.769

-

-

-

Overview

Unlock the full potential of your next project with the STM32H562RGT6 microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers reliable and efficient solutions for various applications. This microcontroller offers integrated cache, multiple ADC and DAC channels, and a wide range of peripherals for enhanced connectivity. With low power modes and high-speed performance, the STM32H562RGT6 provides unmatched value and benefits to customers looking to optimize their designs. Experience the convenience and power of this cutting-edge microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for various applications.

Integrated Cache: YES

Having integrated cache helps improve the overall performance and speed of the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of devices.

CPU Family: CORTEX-M33

Being part of the Cortex-M family ensures reliable and efficient performance for embedded applications.

ADC Channels: YES

Having ADC channels allows for analog input, making the microcontroller suitable for tasks that require analog-to-digital conversion.

ROM Words: 1048576

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and optimized processing of instructions.

Maximum Clock Frequency: 50 MHz

The high clock frequency allows for fast execution of program instructions and tasks.

Analog To Digital Convertors: 16-Ch 12-Bit

Having multiple ADC channels with high resolution allows for accurate conversion of analog signals.

Connectivity: CAN, I2C(4), I2S(3), I3C, LPUART, SAI(2), SDMMC, SPI(4), UART(5), USART(5), USB

The wide range of connectivity options makes the microcontroller versatile and suitable for various communication interfaces.

Technical Specifications

Microcontrollers STM32H562RGT6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of I/O Lines:

49

No. of Serial I/Os:

12

No. of Terminals:

64

No. of Timers:

22

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

659456

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

250 rpm

Maximum Supply Current:

164 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(4), I2S(3), I3C, LPUART, SAI(2), SDMMC, SPI(4), UART(5), USART(5), USB

Peripherals:

BOR, POR, RTC, TIMER(22), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32H562RGT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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