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STM32G474CCU3

STMicroelectronics

STM32G474CCU3 by STMicroelectronics

STM32G474CCU3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU family, featuring 131072 bytes of RAM and 262144 ROM words. With 16 DMA channels and 21 ADC channels, it offers versatile connectivity options including CAN, I2C, SPI, USART. Operating at a max clock frequency of 48 MHz, this chip is ideal for applications requiring high-speed data processing in compact form factors.

Median Price

-

Lifecycle Status

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5

In-Stock Inventory

1k+

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EBV Elektronik

Germany . 520 parts In-Stock

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520

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Vyrian

USA . 6,468 parts In-Stock

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6,468

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Digiode

USA . 3,481 parts In-Stock

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Anansix

USA . 2,505 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Vigor

Singapore . 2,838 parts In-Stock

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$5.310

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2,838

$5.310

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AZTECH Wire

Italy . 582 parts In-Stock

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$14.551

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582

$14.551

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Microchip USA

USA . 3,340 parts In-Stock

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$16.574

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Aztec Data Supply Inc.

USA . 289 parts In-Stock

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$26.120

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$26.120

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Semicontronic

India . 753 parts In-Stock

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$32.000

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$31.200

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$31.040

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753

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$31.040

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Ampacity Inc.

Singapore . 647 parts In-Stock

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$34.000

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647

$34.000

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IDEA Electronic Components Group

UK . 2,302 parts In-Stock

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$36.100

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$32.490

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Corohmni

South Africa . 32 parts In-Stock

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$65.568

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MKK Technologies

India . 572 parts In-Stock

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$67.883

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DigiPath Technology Company

USA . 572 parts In-Stock

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$67.883

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$77.953

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$74.056

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$77.953

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Argo Parts USA

USA . 4,783 parts In-Stock

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Continental Prestige Electronics

USA . 2,404 parts In-Stock

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Parana Technologies

USA . 1,043 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Corphita

USA . 305 parts In-Stock

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Overview

Unleash the power of innovation with the STM32G474CCU3 by STMicroelectronics, a top-tier microcontroller designed to elevate your projects to new heights. With integrated cache, a wide range of peripherals, and advanced technology, this chip is a game-changer in the world of electronics. Whether you're working on IoT devices, consumer electronics, or industrial applications, this microcontroller offers unparalleled speed, connectivity, and efficiency. Trust STMicroelectronics for quality and reliability, and experience the benefits of cutting-edge technology at your fingertips. Elevate your designs with the STM32G474CCU3 today.

Feature Benefit Bullets

Integrated Cache: YES

The integrated cache helps improve performance by storing frequently accessed data for quick retrieval.

Surface Mount: YES

This feature allows for easy installation on PCBs, making it suitable for mass production and compact designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power sources.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides efficient data processing capabilities for various applications.

Package Shape: SQUARE

The square package shape offers a convenient form factor for mounting on boards with limited space.

Bit Size: 32

The 32-bit architecture allows for fast and efficient processing of data and instructions.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to convert digital signals to analog outputs accurately.

No. of Terminals: 48

With 48 terminals, this microcontroller offers a sufficient number of I/O options for connecting external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles provide flexibility in designing and integrating the microcontroller into various systems.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for operation in energy-efficient and battery-powered applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the microcontroller can withstand harsh environmental conditions.

CPU Family: CORTEX-M4

Belonging to the Cortex-M4 family ensures compatibility with a wide range of software and development tools for the microcontroller.

No. of External Interrupts: 16

The availability of 16 external interrupts allows the microcontroller to quickly respond to external events or signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data accurately.

DMA Channels: YES

With DMA channels, the microcontroller can efficiently transfer data between peripherals without CPU intervention.

Terminal Position: QUAD

The quad terminal position offers a standardized layout for easy interfacing with other components on the PCB.

ROM Words: 262144

The large ROM capacity allows for storing a substantial amount of program data and instructions.

Maximum Seated Height: 0.6 mm

The low maximum seated height makes this microcontroller suitable for slim and compact designs.

Digital To Analog Convertors: 7-Ch 12-Bit

The presence of 7 12-bit DACs allows for high-resolution analog output generation.

Width: 7 mm

The compact width of the microcontroller makes it suitable for applications where space is limited.

Boundary Scan: YES

The boundary scan feature facilitates testing and debugging of the microcontroller during production and operation.

Peripherals: BOR, COMPARATOR(7), DMA(16), POR, RTC, TIMER(15), WDT(2)

The wide range of peripherals offers enhanced functionality and flexibility for various applications.

Maximum Clock Frequency: 48 MHz

With a high clock frequency, this microcontroller can execute instructions quickly, enhancing overall performance.

Length: 7 mm

The short length of the microcontroller helps in designing compact and portable devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and fast processing of instructions.

No. of Timers: 15

The availability of 15 timers allows for accurate timing and scheduling of tasks in the microcontroller.

RAM Bytes: 131072

The large RAM capacity enables storing a significant amount of data for processing and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the PCB assembly process and reduces the risk of soldering defects.

Analog To Digital Convertors: 21-Ch 12-Bit

The presence of 21 12-bit ADCs allows for precise and accurate conversion of analog signals to digital data.

Maximum Supply Current: 42 mA

With a moderate supply current requirement, this microcontroller is energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

The nominal supply voltage ensures compatibility with standard power sources and voltage regulators.

No. of Serial I/Os: 7

With 7 serial I/Os, the microcontroller can communicate with multiple external devices simultaneously.

PWM Channels: YES

The presence of PWM channels allows for generating precise and variable pulse-width modulation signals for controlling motors and actuators.

Connectivity: CAN(3), I2C(4), I2S(2), LPUART, QSPI, SAI, SPI(3), USART(3)

The diverse connectivity options enable seamless integration with a wide range of external devices and communication protocols.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and efficient programming of the microcontroller's memory for firmware updates and customization.

Terminal Pitch: 0.5 mm

The narrow terminal pitch offers high-density mounting options for compact PCB designs.

Format: FLOATING POINT

Supporting floating-point format enhances the microcontroller's ability to perform complex mathematical calculations accurately.

Speed: 170 rpm

With a high speed rating, this microcontroller can execute instructions rapidly, ensuring efficient operation.

Low Power Mode: YES

The low-power mode feature allows the microcontroller to conserve energy and extend battery life in portable and IoT applications.

On Chip Program ROM Width: 8

The 8-bit program ROM width enables the microcontroller to efficiently store and execute program instructions.

No. of I/O Lines: 42

The ample number of I/O lines offers versatile connectivity options for interfacing with external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers STM32G474CCU3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

42

No. of Serial I/Os:

7

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

170 rpm

Maximum Supply Current:

42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), I2C(4), I2S(2), LPUART, QSPI, SAI, SPI(3), USART(3),

Peripherals:

BOR, COMPARATOR(7), DMA(16), POR, RTC, TIMER(15), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit

Trade Compliance

STM32G474CCU3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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