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STM32G473VCH3TR

STMicroelectronics

STM32G473VCH3TR by STMicroelectronics

STM32G473VCH3TR from STMicroelectronics is a versatile 32-bit microcontroller featuring a Cortex-M4 CPU, 131KB RAM, and 262KB Flash memory. It supports automotive applications with a max temp of 125 °C and offers extensive connectivity options like I2C and USART. Ideal for embedded systems, it includes ADC/DAC channels and multiple timers for precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,499 parts In-Stock

1+ parts

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5,499

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Digiode

USA . 2,996 parts In-Stock

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2,996

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Anansix

USA . 355 parts In-Stock

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355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,037 parts In-Stock

1+ parts

$15.800

100+ parts

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1k+ parts

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10k+ parts

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1,037

$15.800

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IDEA Electronic Components Group

UK . 683 parts In-Stock

1+ parts

$71.545

100+ parts

-

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$64.390

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683

$71.545

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$64.390

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MKK Technologies

India . 35 parts In-Stock

1+ parts

$134.535

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35

$134.535

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DigiPath Technology Company

USA . 35 parts In-Stock

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$134.535

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35

$134.535

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Corphita

USA . 3,738 parts In-Stock

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3,738

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Parana Technologies

USA . 1,100 parts In-Stock

1+ parts

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$85.543

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1,100

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$85.543

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Overview

Unlock the power of innovation with the STM32G473VCH3TR microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for automotive and industrial applications, this 32-bit MCU offers unparalleled performance, reliability, and versatility. With advanced features like integrated DAC and ADC channels, it empowers engineers to create efficient solutions across diverse fields, enhancing product quality and accelerating time to market—bringing your ideas to life seamlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures reliability and resistance to environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, allowing for faster data access and overall better performance in applications.

Surface Mount: YES

Surface mount technology allows for more compact circuit designs and easier assembly, reducing overall product size and manufacturing costs.

Maximum Supply Voltage: 3.6 V

This voltage level ensures compatibility with a wide range of power supply systems, making it versatile for various applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data manipulation and is suitable for low-power applications.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and facilitates easier routing of traces.

Bit Size: 32

A 32-bit architecture supports higher precision calculations and allows for more complex applications compared to 8-bit or 16-bit alternatives.

DAC Channels: YES

Incorporating Digital-to-Analog Converters enhances the capability to create analog outputs, increasing the microcontroller's versatility.

No. of Terminals: 100

With 100 terminals, this microcontroller offers multiple connectivity options, facilitating interfacing with a variety of peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This packaging style enables higher density component placement, reducing the overall size of circuits.

Minimum Supply Voltage: 1.71 V

The lower voltage capability enhances energy efficiency and enables operation in battery-powered applications.

Maximum Operating Temperature: 125 °C

This wide temperature range makes the microcontroller suitable for automotive and industrial applications where temperature conditions can vary significantly.

CPU Family: CORTEX-M4

The Cortex-M4 core provides advanced processing capabilities and supports digital signal processing tasks, ideal for applications requiring high performance.

No. of External Interrupts: 16

Having 16 external interrupts allows for responsive systems that can quickly react to multiple events concurrently.

Minimum Operating Temperature: -40 °C

This temperature tolerance is essential for automotive applications, ensuring reliable operation in extreme conditions.

ADC Channels: YES

The inclusion of Analog-to-Digital Converters adds flexibility for sensing applications, making it suitable for monitoring various analog signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, reducing CPU load and increasing system performance.

Terminal Position: BOTTOM

Bottom terminal positioning enhances PCB design options and thermal management.

ROM Words: 262144

The large ROM allows for storing extensive programs and data, suitable for complex applications.

Maximum Seated Height: 1.1 mm

The low seated height supports high-density designs, crucial for compact electronic devices.

Digital To Analog Converters: 7-Ch 12-Bit (4)

With multiple high-resolution DACs, this microcontroller can generate precise analog signals for diverse applications.

Width: 8 mm

A compact width facilitates integration into space-constrained designs, maintaining performance without compromising size.

Boundary Scan: YES

Boundary scan capabilities allow for easier testing and debugging of the PCB, improving manufacturability.

Peripherals: RTC, TIMER(14), WDT(2)

The inclusion of a real-time clock and multiple timers enhances the microcontroller's capability for timing-critical applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for faster processing and better performance in time-sensitive applications.

Length: 8 mm

A minimal length contributes to compact designs, essential for modern, portable electronics.

Temperature Grade: AUTOMOTIVE

This grade ensures the microcontroller meets strict automotive standards for reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is designed for efficient performance and low power consumption, making it ideal for embedded systems.

No. of Timers: 14

A high number of timers aids in precise timing and control within various applications, enhancing functionality.

RAM Bytes: 131072

Significant RAM size supports larger and more complex applications, improving multitasking and memory management.

Technology: CMOS

CMOS technology offers benefits like low power consumption and high noise immunity, contributing to better battery life in portable applications.

Terminal Form: BALL

Ball terminal design provides excellent electrical performance and supports advanced PCB layouts.

Analog To Digital Convertors: 42-Ch 12-Bit

A high number of ADC channels and the 12-bit resolution allow precise and efficient data conversion from analog to digital.

Nominal Supply Voltage: 3 V

This nominal supply voltage is ideal for a wide range of applications, balancing performance and power efficiency.

No. of DMA Channels: 16

Having multiple DMA channels supports efficient data handling and reduces the strain on the CPU during data-intensive operations.

PWM Channels: YES

Pulse Width Modulation channels enable various control applications, including motor control and signal modulation.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

Diverse and flexible connectivity options make this microcontroller ideal for integration with multiple peripheral devices.

ROM Programmability: FLASH

Flash programmability allows for easy updating of firmware, making it adaptable for long-term projects.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density designs, which is critical in space-constrained applications.

Format: FLOATING POINT

Floating point format support improves mathematical computations, allowing for complex algorithms and operations.

Speed: 170 rpm

A high-speed capability enables quick response times for varied applications, enhancing system performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for effective management of smaller programs, contributing to overall performance optimization.

No. of I/O Lines: 86

With 86 I/O lines, this microcontroller permits extensive interfacing options, facilitating integration into complex systems.

Technical Specifications

Microcontrollers STM32G473VCH3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

8 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

86

No. of Terminals:

100

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.1 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

42-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473VCH3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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