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STM32G473RBT6TR

STMicroelectronics

STM32G473RBT6TR by STMicroelectronics

STM32G473RBT6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, operating at max 48 MHz. It features 131072 bytes of RAM and ROM, 26 ADC channels, and 16 DMA channels. Ideal for industrial applications requiring high-speed processing, analog-to-digital conversion, and extensive peripheral connectivity like I2C, I2S, QSPI, and USART.

Median Price

$3.245

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.245

10k+ parts

$3.126

8,000

-

-

$3.245

$3.126

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 15,227 parts In-Stock

1+ parts

-

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-

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15,227

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Vyrian

USA . 4,750 parts In-Stock

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4,750

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-

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Digiode

USA . 1,353 parts In-Stock

1+ parts

-

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1,353

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Anansix

USA . 1,269 parts In-Stock

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1,269

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 858 parts In-Stock

1+ parts

$4.000

100+ parts

-

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-

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-

858

$4.000

-

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$11.252

100+ parts

-

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723

$11.252

-

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Microchip USA

USA . 3,043 parts In-Stock

1+ parts

$14.530

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3,043

$14.530

-

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IDEA Electronic Components Group

UK . 652 parts In-Stock

1+ parts

$19.355

100+ parts

-

1k+ parts

$17.419

10k+ parts

-

652

$19.355

-

$17.419

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$28.052

100+ parts

$26.649

1k+ parts

$26.649

10k+ parts

-

5,000

$28.052

$26.649

$26.649

-

Semicontronic

India . 929 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

929

$34.000

$33.150

$32.980

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MKK Technologies

India . 1,455 parts In-Stock

1+ parts

$36.396

100+ parts

-

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1,455

$36.396

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DigiPath Technology Company

USA . 1,455 parts In-Stock

1+ parts

$36.396

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1,455

$36.396

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Aztec Data Supply Inc.

USA . 315 parts In-Stock

1+ parts

$49.840

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315

$49.840

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Corohmni

South Africa . 365 parts In-Stock

1+ parts

$73.347

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365

$73.347

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Continental Prestige Electronics

USA . 6,488 parts In-Stock

1+ parts

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6,488

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Corphita

USA . 4,295 parts In-Stock

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4,295

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Argo Parts USA

USA . 3,977 parts In-Stock

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3,977

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Parana Technologies

USA . 1,549 parts In-Stock

1+ parts

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100+ parts

$23.142

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1,549

-

$23.142

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

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50

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Overview

Discover the STM32G473RBT6TR by STMicroelectronics, a high-quality microcontroller that offers exceptional value and benefits to customers. With its advanced features and cutting-edge technology, this product is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. Trust in STMicroelectronics' reputation for reliability and innovation, and unlock the full potential of your designs with the STM32G473RBT6TR. Elevate your projects to new heights with this powerful microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources to be used with the microcontroller.

On Chip Data RAM Width: 8

Provides sufficient memory for storing and accessing data quickly during operation.

Package Shape: SQUARE

Simplifies the design and layout process when integrating the microcontroller into a system.

Bit Size: 32

Enables the microcontroller to process 32 bits of data in a single operation, improving overall performance.

DAC Channels: YES

Allows for analog output capabilities, useful for generating sound, controlling motors, and more.

No. of Terminals: 64

Provides a sufficient number of connection points for interfacing with other components or systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates compact and space-saving designs, ideal for applications with limited space availability.

Minimum Supply Voltage: 1.71 V

Allows for operation in low-voltage environments, expanding the range of applications the microcontroller can be used in.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, increasing the versatility of the microcontroller.

CPU Family: CORTEX-M4

Features a powerful and efficient CPU architecture for handling complex tasks and calculations.

No. of External Interrupts: 16

Enables the microcontroller to respond quickly to external events or signals, enhancing its real-time capabilities.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold temperatures, making the microcontroller suitable for a wide range of environments.

ADC Channels: YES

Enables the microcontroller to convert analog signals into digital data, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Simplifies the connection of external components or modules to the microcontroller, enhancing usability and flexibility.

ROM Words: 131072

Provides ample storage for storing program instructions and data, allowing for complex applications to be executed.

Maximum Seated Height: 1.6 mm

Allows for a low-profile design, making the microcontroller suitable for compact and slim devices.

Digital To Analog Convertors: 7-Ch 12-Bit (4)

Offers multiple DAC channels with high resolution, ideal for applications requiring precise analog output.

Width: 10 mm

Compact size enables easy integration into various electronic devices and systems.

Boundary Scan: YES

Facilitates testing and debugging of the microcontroller during manufacturing and development stages.

Peripherals: RTC, TIMER(14), WDT(2)

Includes a range of peripherals for precise timing, communication, and watchdog functionality, enhancing the microcontroller's capabilities.

Maximum Clock Frequency: 48 MHz

Provides high-speed processing capabilities, ideal for applications requiring quick data processing and response times.

Length: 10 mm

Compact dimensions make the microcontroller suitable for small form factor designs and portable devices.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial operating conditions, ensuring reliability and durability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a RISC architecture for efficient and optimized performance, suitable for a wide range of applications.

No. of Timers: 14

Provides multiple timer channels for precise timing control and event handling, enhancing the microcontroller's functionality.

RAM Bytes: 131072

Offers a large memory capacity for storing and manipulating data during runtime, suitable for complex algorithms and applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, ideal for battery-powered devices and energy-efficient applications.

Terminal Form: GULL WING

Facilitates easy soldering and assembly onto circuit boards, simplifying the manufacturing process.

Analog To Digital Convertors: 26-Ch 12-Bit

Provides multiple ADC channels with high resolution, essential for accurate and reliable analog-to-digital conversion.

Nominal Supply Voltage: 3 V

Standard voltage level ensures compatibility with a wide range of power sources and components.

No. of DMA Channels: 16

Enables efficient data transfer and processing between peripherals and memory, improving system performance and responsiveness.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) outputs for precise control of analog signals, useful for motor control and LED dimming applications.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

Offers multiple communication interfaces for connecting to external devices and peripherals, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Allows for easy and flexible reprogramming of the microcontroller's firmware, facilitating iterative development and updates.

Terminal Pitch: 0.5 mm

Provides a fine pitch for connections, enabling high-density mounting on circuit boards and compact design layouts.

Format: FLOATING POINT

Supports floating-point calculations for handling complex mathematical operations and algorithms with precision.

Speed: 170 rpm

High-speed processing capabilities make the microcontroller suitable for real-time control and fast data processing applications.

On Chip Program ROM Width: 8

Efficiently stores program instructions on the microcontroller for quick access and execution during operation.

No. of I/O Lines: 52

Provides a sufficient number of Input/Output lines for interfacing with external devices and peripherals, enhancing the microcontroller's connectivity.

Technical Specifications

Microcontrollers STM32G473RBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Terminals:

64

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

26-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473RBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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