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STM32G473QET6TR

STMicroelectronics

STM32G473QET6TR by STMicroelectronics

STM32G473QET6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at up to 48 MHz, and includes 42 ADC channels. With a supply voltage range of 1.71V to 3.6V, it’s ideal for industrial applications requiring precision control. Its compact design supports various connectivity options like I2C and USART.

Median Price

$6.732

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 12,000 parts In-Stock

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12,000

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Distributors (In-Stock)

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IBS Electronics

USA . 19,251 parts In-Stock

1+ parts

-

100+ parts

$6.732

1k+ parts

$7.349

10k+ parts

-

19,251

-

$6.732

$7.349

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Vyrian

USA . 4,134 parts In-Stock

1+ parts

-

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4,134

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Anansix

USA . 2,418 parts In-Stock

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2,418

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Digiode

USA . 651 parts In-Stock

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651

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Distributors (Availability)

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AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$20.950

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-

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570

$20.950

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IDEA Electronic Components Group

UK . 2,249 parts In-Stock

1+ parts

$62.352

100+ parts

-

1k+ parts

$56.117

10k+ parts

-

2,249

$62.352

-

$56.117

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MKK Technologies

India . 1,445 parts In-Stock

1+ parts

$117.249

100+ parts

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1,445

$117.249

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DigiPath Technology Company

USA . 1,445 parts In-Stock

1+ parts

$117.249

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1,445

$117.249

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Corphita

USA . 3,292 parts In-Stock

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3,292

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Parana Technologies

USA . 595 parts In-Stock

1+ parts

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100+ parts

$74.551

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595

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$74.551

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Overview

Unlock the potential of your innovative projects with the STM32G473QET6TR microcontroller from STMicroelectronics. Engineered for excellence, this versatile and compact device offers exceptional performance and reliability across various applications—from industrial automation to IoT devices. With advanced features like integrated DACs and ADCs, it empowers developers to create smarter, more efficient solutions. Elevate your designs and enjoy unmatched quality backed by STMicroelectronics' renowned expertise in the field!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures protection against environmental factors, making it ideal for various applications.

Integrated Cache: YES

The presence of integrated cache improves processing speed and efficiency, enhancing overall performance.

Surface Mount: YES

Surface mount technology allows for compact design and easier assembly, contributing to space-saving applications.

Maximum Supply Voltage: 3.6 V

A relatively low maximum supply voltage promotes energy efficiency and reduces thermal output.

On Chip Data RAM Width: 8

An 8-bit data RAM width enables handling of a diverse range of applications, providing adequate processing capability.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and allows for uniform placement.

Bit Size: 32

A 32-bit architecture supports advanced computing capabilities, enabling complex processing tasks.

DAC Channels: YES

The availability of DAC channels allows for high-quality analog signal generation, useful in audio applications.

No. of Terminals: 128

A higher number of terminals provides extensive connectivity options, allowing for flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is suited for compact designs and high-density applications, optimizing space utilization.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage, the microcontroller operates efficiently across a wide range of power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability in demanding environments.

CPU Family: CORTEX-M4

The CORTEX-M4 CPU family provides advanced processing capabilities, particularly in real-time applications.

No. of External Interrupts: 16

A significant number of external interrupts enables responsive and flexible interfacing with various peripherals.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes it suitable for harsh environments, ensuring versatility.

ADC Channels: YES

Integrated ADC channels support the conversion of analog signals to digital data, essential for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) channels facilitate efficient data transfer, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for better connectivity and layout design flexibility on PCBs.

ROM Words: 524288

A large configurable ROM size offers considerable space for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

A low seated height enables compact designs, promoting miniaturization in electronic devices.

Digital To Analog Converters: 7-Ch 12-Bit (4)

Multiple high-resolution DACs provide enhanced performance in applications requiring precise analog output.

Width: 14 mm

A small width supports tight layout designs, advantageous for modern compact electronics.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, ensuring reliability in production environments.

Peripherals: RTC, TIMER(14), WDT(2)

A rich set of peripherals enables various functionalities, making it suitable for a wide range of applications.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency allows for fast processing, enhancing performance in time-sensitive tasks.

Length: 14 mm

A compact length contributes to smaller device footprints, promoting design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microcontroller exhibits robustness and reliability in challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture enables faster instruction execution and efficient coding, benefiting various applications.

No. of Timers: 14

Multiple timers offer extensive timing capabilities, essential for applications involving precise time measurements.

RAM Bytes: 131072

Sufficient RAM capacity allows for efficient data handling and processing, especially in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing terminals enhance solderability and reliability in connections, crucial for durability in devices.

Analog To Digital Converters: 42-Ch 12-Bit

A high number of ADC channels with good resolution enables versatile interfacing with a variety of sensors.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3 V supports broad compatibility with various power supplies and systems.

No. of DMA Channels: 16

Having multiple DMA channels allows efficient and parallel data processing, improving application performance.

PWM Channels: YES

PWM channels support precise control of motors and other actuators, ideal for various automation applications.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

Diverse connectivity options provide flexibility in interfacing with multiple devices and systems.

ROM Programmability: FLASH

Flash memory allows for easy firmware updates and modifications, enhancing the product's longevity.

Terminal Pitch: 0.5 mm

A tighter terminal pitch facilitates higher density designs, crucial for modern electronic applications.

Format: FLOATING POINT

Floating point format supports complex mathematical operations, making it suitable for advanced computational tasks.

Speed: 170 rpm

This speed metric suggests the microcontroller can efficiently handle applications requiring quick processing.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows compatibility with a wide range of software solutions.

No. of I/O Lines: 107

A large number of I/O lines offers extensive interfacing options, enabling the microcontroller to serve various roles.

Technical Specifications

Microcontrollers STM32G473QET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

107

No. of Terminals:

128

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

42-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473QET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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