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STM32G473CET3TR

STMicroelectronics

STM32G473CET3TR by STMicroelectronics

STM32G473CET3TR microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates b/w -40 °C to 125 °C, and supports up to 48 MHz clock speed. It includes 20 ADC channels and 7 DACs for versatile applications. Ideal for automotive and industrial control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,198 parts In-Stock

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8,198

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Digiode

USA . 1,200 parts In-Stock

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1,200

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Anansix

USA . 280 parts In-Stock

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280

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Distributors (Availability)

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AZTECH Wire

Italy . 403 parts In-Stock

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$11.410

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403

$11.410

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IDEA Electronic Components Group

UK . 980 parts In-Stock

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$44.752

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$40.277

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980

$44.752

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$40.277

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MKK Technologies

India . 2,265 parts In-Stock

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$84.154

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$84.154

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DigiPath Technology Company

USA . 2,265 parts In-Stock

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$84.154

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2,265

$84.154

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Corphita

USA . 1,720 parts In-Stock

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1,720

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Parana Technologies

USA . 311 parts In-Stock

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$53.508

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Overview

Unlock innovation with the STM32G473CET3TR microcontroller from STMicroelectronics, a leader in cutting-edge technology. This powerful 32-bit MCU delivers unmatched performance and versatility, perfect for automotive, industrial, and IoT applications. With integrated DACs, advanced connectivity options, and robust temperature handling, it empowers your designs to excel. Experience reliability and superior quality that drive efficiency and elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental conditions, making it suitable for various applications.

Integrated Cache: YES

Having integrated cache enhances data access speed, improving overall performance and response time of applications.

Surface Mount: YES

Surface mounting allows for compact PCB designs, saving space and enabling the production of smaller devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, it can operate efficiently in low-power environments, making it ideal for battery-powered applications.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data processing suited for a wide range of applications.

Package Shape: SQUARE

A square package shape provides even distribution of thermal and electrical properties, improving performance.

Bit Size: 32

The 32-bit architecture supports a larger range of data types and enhances computational power, suitable for complex processing.

DAC Channels: YES

Having DAC channels enables the microcontroller to output analog signals, making it versatile for various applications.

No. of Terminals: 48

A higher number of terminals allows for more connections and functionalities, providing greater flexibility in design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This design contributes to a sleek profile best suited for modern, compact electronic designs.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage enables operation in low-power scenarios, beneficial for energy-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it is ideal for automotive and high-temperature applications.

CPU Family: CORTEX-M4

The Cortex-M4 core is widely used for its efficiency and performance in embedded applications, ensuring robust operation.

No. of External Interrupts: 16

Having 16 external interrupts allows for responsive and interactive application designs, catering to demanding tasks.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it suitable for automotive and industrial applications exposed to harsh environments.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to process analog signals, enhancing versatility in data acquisition.

DMA Channels: YES

DMA channels enhance data handling efficiency by allowing background data transfers, improving system performance.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing and connectivity options in PCB design, promoting better layout flexibility.

ROM Words: 524288

With a large ROM capacity, it supports complex applications and extensive firmware which is beneficial for advanced features.

Maximum Seated Height: 1.6 mm

A low seated height is ideal for compact designs, allowing for slimmer devices.

Digital To Analog Converts: 7-Ch 12-Bit (4)

Multiple DAC channels increase design flexibility for applications requiring high-resolution output signals.

Width: 7 mm

A compact width facilitates space-saving designs in electronic devices, perfect for modern applications.

Boundary Scan: YES

Boundary scan capability enhances debug and test access to internals of the microcontroller, improving reliability and maintainability in production.

Peripherals: RTC, TIMER(14), WDT(2)

Having a range of peripherals increases functionality, allowing for time-sensitive applications and better overall system management.

Maximum Clock Frequency: 48 MHz

A higher clock frequency improves processing speeds, making it ideal for applications that demand swift response.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in vehicles, meeting rigorous industry standards.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance through simplified instruction sets, leading to energy-efficient processing.

No. of Timers: 14

Having multiple timers enables precise timing operations, essential for complex applications in signal generation and monitoring.

RAM Bytes: 131072

Ample RAM supports complex algorithms and data manipulation, facilitating robust application development.

Technology: CMOS

CMOS technology enhances power efficiency, making it suitable for battery-operated devices and portable applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability in PCB mounting.

Analog To Digital Convertors: 20-Ch 12-Bit

A large number of ADC channels with high resolution allow for detailed signal processing in various applications.

Nominal Supply Voltage: 3 V

This standard operating voltage aligns with many battery and power supply designs, simplifying integration into existing systems.

No. of DMA Channels: 16

Having 16 DMA channels enhances data handling capacity, improving throughput and responsiveness in high-performance applications.

PWM Channels: YES

Support for PWM channels enables the microcontroller to control the speed of motors and brightness of LEDs, broadening its applicability.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

Robust connectivity options allow for easy integration with various devices and peripherals, enhancing application development flexibility.

ROM Programmability: FLASH

Flash programmability allows for quick updates and reprogramming, making it suitable for field upgrades and iterative development.

Terminal Pitch: 0.5 mm

The small terminal pitch supports high-density PCB layouts, essential in miniaturized electronic devices.

Format: FLOATING POINT

Floating-point format allows for precise calculations in applications requiring high numerical accuracy, beneficial in various engineering solutions.

Speed: 170 rpm

A defined speed rating is useful for applications requiring controlled motion, such as robotics and automation.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for compatibility with various software architectures, supporting diverse application programming.

No. of I/O Lines: 38

A higher number of I/O lines provide flexibility for interfacing with multiple peripherals, enhancing the microcontroller's capability.

Technical Specifications

Microcontrollers STM32G473CET3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473CET3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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