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STM32G473CCU3TR

STMicroelectronics

STM32G473CCU3TR by STMicroelectronics

STM32G473CCU3TR from STMicroelectronics is a 32-bit microcontroller featuring a Cortex-M4 CPU, integrated cache, and up to 48 MHz clock speed. It supports automotive applications with 21 ADC channels and 7 DACs. This compact chip offers robust connectivity options including I2C and USART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,078 parts In-Stock

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Anansix

USA . 1,243 parts In-Stock

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Digiode

USA . 577 parts In-Stock

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577

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Distributors (Availability)

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Microchip USA

USA . 6,792 parts In-Stock

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$15.944

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6,792

$15.944

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AZTECH Wire

Italy . 1,189 parts In-Stock

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$19.200

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IDEA Electronic Components Group

UK . 2,023 parts In-Stock

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$55.809

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$50.228

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2,023

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Component Stockers USA

USA . 1,707 parts In-Stock

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$81.100

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MKK Technologies

India . 1,803 parts In-Stock

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$104.945

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DigiPath Technology Company

USA . 1,803 parts In-Stock

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$104.945

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Parana Technologies

USA . 1,761 parts In-Stock

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$66.728

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Corphita

USA . 986 parts In-Stock

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Overview

Unlock endless possibilities with the STM32G473CCU3TR microcontroller from STMicroelectronics, a leader in innovation and quality. This powerhouse combines advanced performance with energy efficiency, ideal for automotive applications and beyond. Its robust features enable seamless connectivity and real-time processing, empowering developers to create smart solutions. Elevate your projects with a trusted partner that delivers reliability and cutting-edge technology!

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache improves the performance of the microcontroller by allowing faster access to frequently used data.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating high-density assemblies in modern electronic applications.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage ensures compatibility with low-power applications, making it suitable for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width can handle a range of applications, providing sufficient data processing capabilities for various tasks.

Package Shape: SQUARE

Square package shapes are often easier to design for and fit into existing PCB layouts, enhancing design flexibility.

Bit Size: 32

The 32-bit architecture allows for more complex calculations and processing, ideal for advanced applications requiring higher performance.

DAC Channels: YES

The presence of DAC channels enables analog signal generation, which is essential for applications needing audio or control output.

No. of Terminals: 48

A higher number of terminals provides more I/O options, facilitating complex interactions with other components or sensors.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances heat dissipation and supports compact designs, suitable for space-constrained environments.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage allows the microcontroller to operate in energy-efficient mode, extending the longevity of battery-powered devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this microcontroller ideal for automotive and industrial applications.

CPU Family: CORTEX-M4

Based on the CORTEX-M4 architecture, this microcontroller offers advanced features such as DSP and floating-point capabilities, enhancing performance.

No. of External Interrupts: 16

Having 16 external interrupts allows for handling multiple simultaneous signals, increasing responsiveness in real-time applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller suitable for harsh environments and automotive applications.

ADC Channels: YES

The presence of ADC channels allows for analog signal conversion, essential for integrating sensors into the system.

DMA Channels: YES

DMA channels facilitate efficient memory access and data transfer, improving overall system performance by offloading tasks from the CPU.

Terminal Position: QUAD

Quad terminal positioning enables better space utilization and ease of connection on PCBs, making it versatile for various designs.

ROM Words: 262144

A substantial ROM capacity allows for inclusion of complex programs and data, supporting more feature-rich applications.

Maximum Seated Height: 0.6 mm

The low seated height enables compact designs, suitable for miniaturized electronic devices.

Digital To Analog Converters: 7-Ch 12-Bit (4)

Multiple high-resolution DACs improve versatility in generating precise analog outputs for varied applications.

Width: 7 mm

A narrow width caters to tight layout constraints and encourages space-efficient designs.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging processes, enhancing reliability in manufacturing.

Peripherals: RTC, TIMER(14), WDT(2)

Rich peripheral support provides a wide range of functionality, equipping developers with tools to manage time and control processes effectively.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz enables quick processing and reaction times, vital for real-time applications.

Length: 7 mm

The compact length allows for effective integration into various designs, critical for minimizing space in electronic assemblies.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this microcontroller can perform reliably under stringent conditions, enhancing safety and performance in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides efficient instruction execution, optimizing performance for embedded applications.

No. of Timers: 14

Having numerous timers allows for precise timing control in various applications, enhancing system efficiency.

RAM Bytes: 131072

With ample RAM, this microcontroller can handle complex tasks and large data sets, making it suitable for demanding applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high integration levels, ideal for modern electronic devices.

Terminal Form: NO LEAD

No-lead terminals facilitate a smaller footprint and improve thermal performance, catering to advanced packaging needs.

Analog To Digital Converters: 21-Ch 12-Bit

A high number of ADC channels supports extensive analog sensor integration, making it versatile for various sensing applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is suitable for common power supplies, ensuring compatibility in various circuits.

No. of DMA Channels: 16

A total of 16 DMA channels allows for efficient multi-tasking, improving data transfer and processing speed.

PWM Channels: YES

PWM support enhances control over motors and other systems, providing versatility in applications like automation and robotics.

Connectivity: I2C(4), I2S(2), QSPI, USART(3)

Diverse connectivity options allow easy integration with various peripherals and facilitate communication protocols, enhancing system scalability.

ROM Programmability: FLASH

Flash ROM programmability allows easy updating and flexibility for applications, improving the longevity of the product.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables denser arrangements on PCBs, accommodating modern miniaturization trends.

Format: FLOATING POINT

Floating point support provides enhanced mathematical capabilities, crucial for applications requiring precise calculations.

Speed: 170 rpm

This speed indicates the capability for high-frequency operations, catering to fast-response applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width enables efficient data storage and management, aiding in rapid application development.

No. of I/O Lines: 42

A high number of I/O lines provides extensive interfacing options, supporting diverse project requirements.

Technical Specifications

Microcontrollers STM32G473CCU3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

42

No. of Terminals:

48

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

170 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C(4), I2S(2), QSPI, USART(3)

Peripherals:

RTC, TIMER(14), WDT(2)

Analog To Digital Convertors:

21-Ch 12-Bit

Digital To Analog Convertors:

7-Ch 12-Bit (4)

Trade Compliance

STM32G473CCU3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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