Loading...

STM32G431V8T6

STMicroelectronics

STM32G431V8T6 by STMicroelectronics

STM32G431V8T6 microcontroller from STMicroelectronics features a 32-bit Cortex-M4 CPU, operates at up to 48 MHz, and includes 23 ADC channels. With low power modes and extensive connectivity options, it's ideal for IoT applications. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,637

-

-

-

-

Digiode

USA . 3,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,607

-

-

-

-

Anansix

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,487 parts In-Stock

1+ parts

$4.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3,487

$4.670

-

-

-

AZTECH Wire

Italy . 170 parts In-Stock

1+ parts

$13.380

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$13.380

-

-

-

Microchip USA

USA . 3,798 parts In-Stock

1+ parts

$15.632

100+ parts

-

1k+ parts

-

10k+ parts

-

3,798

$15.632

-

-

-

Component Stockers USA

USA . 2,161 parts In-Stock

1+ parts

$52.050

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$52.050

-

-

-

IDEA Electronic Components Group

UK . 1,708 parts In-Stock

1+ parts

$64.367

100+ parts

-

1k+ parts

$57.930

10k+ parts

-

1,708

$64.367

-

$57.930

-

MKK Technologies

India . 948 parts In-Stock

1+ parts

$121.038

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$121.038

-

-

-

DigiPath Technology Company

USA . 948 parts In-Stock

1+ parts

$121.038

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$121.038

-

-

-

Corphita

USA . 4,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,465

-

-

-

-

Parana Technologies

USA . 627 parts In-Stock

1+ parts

-

100+ parts

$76.960

1k+ parts

-

10k+ parts

-

627

-

$76.960

-

-

Eastek

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Overview

Unlock limitless potential with the STM32G431V8T6 microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for efficiency and versatility, this 32-bit powerhouse excels in applications ranging from IoT devices to industrial automation. Enjoy enhanced performance, low power consumption, and seamless connectivity options, empowering your projects with reliability and speed. Elevate your designs with quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, ensuring long-lasting performance.

Integrated Cache: YES

Improves processing speed and efficiency, making it suitable for performance-critical applications.

Surface Mount: YES

Allows for compact design and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of power supplies while maintaining low power consumption.

On Chip Data RAM Width: 8

Provides flexibility for various data processing requirements.

Package Shape: SQUARE

Facilitates efficient use of PCB space, ideal for compact applications.

Bit Size: 32

Offers improved performance and precision for complex computations.

DAC Channels: YES

Enables high-quality analog signal generation for applications requiring audio or control signals.

No. of Terminals: 100

Provides extensive connectivity options for peripherals and expansions.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Supports high-density layouts and reduces overall system height.

Minimum Supply Voltage: 1.71 V

Ensures versatility in various power supply environments for energy efficiency.

Maximum Operating Temperature: 85 °C

Reliable performance even in high-temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M4

A powerful architecture that supports a range of applications, from automation to consumer electronics.

No. of External Interrupts: 16

Enables responsive design for real-time applications, enhancing interactivity.

Minimum Operating Temperature: -40 °C

Ideal for extreme conditions, ensuring reliability in harsh environments.

ADC Channels: YES

Allows for efficient data acquisition from a variety of analog sensors.

DMA Channels: YES

Improves data handling efficiency by facilitating direct memory access without CPU intervention.

Terminal Position: QUAD

Enhances ease of soldering and assembly on PCBs.

ROM Words: 65536

Provides ample storage for firmware and application code.

Maximum Seated Height: 1.6 mm

Low profile design allows for space-saving applications.

Digital To Analog Converters: 4-Ch 12-Bit

Supports high-resolution signal output, beneficial for precise control operations.

Width: 14 mm

Compact size eases integration into space-constrained designs.

Boundary Scan: YES

Facilitates testing and debugging, ensuring robust product development.

Peripherals: BOR, COMPARATOR(4), DMA(12), POR, RTC, TIMER(12), WDT(2)

Rich peripheral set enhances functionality for diverse applications.

Maximum Clock Frequency: 48 MHz

Ensures fast processing speeds suitable for performance-sensitive tasks.

Length: 14 mm

Compact dimensions for easy integration into various electronic designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Combines high performance with low power consumption, ideal for embedded systems.

No. of Timers: 12

Provides extensive timing options for event scheduling and control functions.

RAM Bytes: 32768

Adequate memory for efficient processing and data handling.

Technology: CMOS

Offers low power consumption along with high-speed performance.

Terminal Form: GULL WING

Optimizes soldering process and enhances mechanical stability.

Analog To Digital Converters: 23-Ch 12-Bit

Supports high-fidelity data collection suitable for various applications.

Maximum Supply Current: 29 mA

Ensures efficient power usage while providing reliable operation under load.

Nominal Supply Voltage: 3 V

Standard voltage level compatible with many systems, promoting ease of integration.

No. of DMA Channels: 12

Facilitates efficient data transfers, improving overall system performance.

No. of Serial I/Os: 6

Provides sufficient connectivity for various serial communication protocols.

PWM Channels: YES

Enables precise control of motors and other actuators using pulse width modulation.

Connectivity: FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), UART, USART(3), USB

Rich connectivity options allow for versatile interfacing with external devices and networks.

ROM Programmability: FLASH

Supports easy updates and changes to firmware, enhancing versatility.

Terminal Pitch: 0.5 mm

Allows for dense PCB layouts, optimizing available board space.

Format: FLOATING POINT

Enables efficient handling of real numbers for complex calculations.

Speed: 170 rpm

Useful for applications requiring consistent and stable speed control.

Low Power Mode: YES

Extends battery life in portable applications, ensuring energy efficiency.

On Chip Program ROM Width: 8

Facilitates optimized program storage and execution efficiency.

No. of I/O Lines: 86

Offers extensive interfacing capabilities for various peripheral devices.

Technical Specifications

Microcontrollers STM32G431V8T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

86

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

32768

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

170 rpm

Maximum Supply Current:

29 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(4), DMA(12), POR, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

23-Ch 12-Bit

Digital To Analog Convertors:

4-Ch 12-Bit

Trade Compliance

STM32G431V8T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20