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STM32G431RBI3

STMicroelectronics

STM32G431RBI3 by STMicroelectronics

STM32G431RBI3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 48 MHz clock frequency, and 131072 ROM words. It features 23-Ch 12-Bit ADC channels, 4-Ch 12-Bit DAC channels, and low power mode for applications requiring high-speed processing and analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,380 parts In-Stock

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8,380

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Anansix

USA . 1,670 parts In-Stock

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1,670

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Digiode

USA . 164 parts In-Stock

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164

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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AZTECH Wire

Italy . 574 parts In-Stock

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$9.580

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574

$9.580

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Corohmni

South Africa . 135 parts In-Stock

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$21.642

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135

$21.642

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Microchip USA

USA . 7,615 parts In-Stock

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$31.704

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7,615

$31.704

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Semicontronic

India . 584 parts In-Stock

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$33.000

100+ parts

$32.175

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$32.010

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584

$33.000

$32.175

$32.010

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Ampacity Inc.

Singapore . 449 parts In-Stock

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$34.000

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449

$34.000

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Aztec Data Supply Inc.

USA . 244 parts In-Stock

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$34.660

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244

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IDEA Electronic Components Group

UK . 1,596 parts In-Stock

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$45.693

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$41.123

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$41.123

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MKK Technologies

India . 84 parts In-Stock

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$85.922

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$85.922

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DigiPath Technology Company

USA . 84 parts In-Stock

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$85.922

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Corphita

USA . 4,872 parts In-Stock

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Argo Parts USA

USA . 3,249 parts In-Stock

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Continental Prestige Electronics

USA . 2,340 parts In-Stock

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Parana Technologies

USA . 2,152 parts In-Stock

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$54.633

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$54.633

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience unmatched performance and reliability with the STM32G431RBI3 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch microcontrollers with integrated cache, DAC channels, DMA support, and more. Ideal for a wide range of applications, this high-quality product offers customers exceptional value, efficiency, and versatility. From its advanced features to its cutting-edge technology, the STM32G431RBI3 is designed to exceed your expectations and elevate your projects to new heights. Trust STMicroelectronics for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Integrated Cache: YES

Improves overall system performance by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring safe operation within specified limits.

Bit Size: 32

High bit size allows for efficient processing of large and complex data sets.

ADC Channels: YES

Ability to convert analog signals to digital data for accurate input processing.

No. of External Interrupts: 16

Enables efficient handling of external events and interrupts for timely responses.

ROM Words: 131072

Ample ROM capacity for storing program instructions and data.

No. of Timers: 12

Multiple timers for precise timing control and scheduling of tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and reduced instruction execution time.

Analog To Digital Convertors: 23-Ch 12-Bit

High number of ADC channels for versatile analog signal processing capabilities.

Connectivity: FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), UART, USART(3), USB

Wide range of connectivity options for interfacing with various external devices and peripherals.

Low Power Mode: YES

Enables energy-efficient operation and extends battery life in portable applications.

Technical Specifications

Microcontrollers STM32G431RBI3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

64

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

170 rpm

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), UART, USART(3), USB

Peripherals:

BOR, COMPARATOR(4), DMA(12), POR, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

23-Ch 12-Bit

Digital To Analog Convertors:

4-Ch 12-Bit

Trade Compliance

STM32G431RBI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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