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STM32G431K6U3

STMicroelectronics

STM32G431K6U3 by STMicroelectronics

STM32G431K6U3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M4 CPU, 48 MHz clock frequency, and 32768 ROM words. It features 11-Ch 12-Bit ADC channels, 4-Ch 12-Bit DAC channels, and low power mode. Ideal for applications requiring high-speed processing, analog-to-digital conversion, and power efficiency.

Median Price

$4.210

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 63 parts In-Stock

1+ parts

$4.210

100+ parts

-

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63

$4.210

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Chip Stock

USA . 6,700 parts In-Stock

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-

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6,700

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Vyrian

USA . 5,436 parts In-Stock

1+ parts

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5,436

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Digiode

USA . 2,561 parts In-Stock

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-

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2,561

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Anansix

USA . 78 parts In-Stock

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,134 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

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5,134

$3.100

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Continental Prestige Electronics

USA . 1,819 parts In-Stock

1+ parts

$4.210

100+ parts

-

1k+ parts

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10k+ parts

$4.126

1,819

$4.210

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-

$4.126

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.210

100+ parts

-

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1,000

$4.210

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Argo Parts USA

USA . 947 parts In-Stock

1+ parts

$4.210

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947

$4.210

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$11.820

100+ parts

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431

$11.820

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Ampacity Inc.

Singapore . 1,819 parts In-Stock

1+ parts

$20.000

100+ parts

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1,819

$20.000

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Microchip USA

USA . 7,383 parts In-Stock

1+ parts

$22.494

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7,383

$22.494

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Semicontronic

India . 1,670 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

10k+ parts

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1,670

$26.000

$25.350

$25.220

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Aztec Data Supply Inc.

USA . 1,059 parts In-Stock

1+ parts

$31.580

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1,059

$31.580

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$51.646

100+ parts

$49.064

1k+ parts

$49.064

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2,500

$51.646

$49.064

$49.064

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

1+ parts

$58.178

100+ parts

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1k+ parts

$52.360

10k+ parts

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2,316

$58.178

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$52.360

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Corohmni

South Africa . 984 parts In-Stock

1+ parts

$74.666

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984

$74.666

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MKK Technologies

India . 2,085 parts In-Stock

1+ parts

$109.400

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2,085

$109.400

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DigiPath Technology Company

USA . 2,085 parts In-Stock

1+ parts

$109.400

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2,085

$109.400

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Lixinc

USA . 10,735 parts In-Stock

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10,735

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Corphita

USA . 737 parts In-Stock

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737

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

-

100+ parts

$69.561

1k+ parts

-

10k+ parts

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582

-

$69.561

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-

Overview

Unlock the power of cutting-edge technology with the STM32G431K6U3 microcontroller by STMicroelectronics. Designed with integrated cache and a maximum clock frequency of 48 MHz, this compact chip offers unparalleled performance in a variety of applications. With features such as multiple DAC and ADC channels, low power mode, and a wide range of connectivity options including FDCAN and USB, the STM32G431K6U3 provides endless possibilities for innovation. Trust in the quality and expertise of STMicroelectronics to deliver a reliable solution that exceeds expectations. Elevate your projects with the STM32G431K6U3 microcontroller and experience the difference today.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache allows for faster access to frequently used data, improving overall performance of the microcontroller.

Surface Mount: YES

Surface mount package makes it easier to mount the microcontroller on a circuit board, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supporting a maximum supply voltage of 3.6 V allows for a wider range of power supply options for the application.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

The square package shape helps in ensuring uniformity and symmetry in the layout of the circuit board, aiding in better design aesthetics and alignment of components.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at a time, making the microcontroller suitable for complex applications that require high computational power.

DAC Channels: YES

Having Digital to Analog Converter channels enables the microcontroller to convert digital signals to analog voltages, making it suitable for applications that require analog output.

No. of Terminals: 32

Having 32 terminals provides sufficient I/O options for connecting the microcontroller to external devices and peripherals in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The variety in package styles offers flexibility in terms of heat dissipation, size constraints, and overall form factor of the final product.

Minimum Supply Voltage: 1.71 V

Supporting a minimum supply voltage of 1.71 V allows for operation in low power scenarios, making the microcontroller suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the microcontroller can withstand high temperature environments, increasing its reliability for industrial applications.

CPU Family: CORTEX-M4

Being part of the Cortex-M4 family offers high performance and energy efficiency, making the microcontroller suitable for real-time embedded systems and IoT applications.

No. of External Interrupts: 16

Having 16 external interrupt lines allows the microcontroller to respond quickly to external events, enhancing its responsiveness in interrupt-driven applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can function in harsh environmental conditions, making it suitable for outdoor or automotive applications.

ADC Channels: YES

Having Analog to Digital Converter channels enables the microcontroller to convert analog signals into digital values, making it suitable for applications that require analog input.

DMA Channels: YES

Direct Memory Access channels allow for data transfer between peripherals and memory without CPU intervention, improving system performance in data-intensive applications.

Terminal Position: QUAD

Having quad terminal position simplifies the layout and connection of external components, aiding in efficient design and setup of the system.

ROM Words: 32768

With 32768 ROM words, the microcontroller has sufficient memory for storing program instructions, making it suitable for firmware and software development.

Maximum Seated Height: 0.6 mm

Having a maximum seated height of 0.6 mm allows for compact and low-profile designs, making the microcontroller suitable for space-constrained applications.

Digital To Analog Convertors: 4-Ch 12-Bit

Four 12-bit Digital to Analog Converters provide high resolution and multiple output channels, making the microcontroller suitable for applications requiring precise analog control.

Width: 5 mm

With a width of 5 mm, the microcontroller is compact and space-efficient, allowing for integration into small electronic devices.

Boundary Scan: YES

Boundary scan capability allows for testing and debugging of the microcontroller during production, ensuring high quality and reliability in the final product.

Peripherals: BOR, COMPARATOR(4), DMA(12), POR, RTC, TIMER(12), WDT(2)

Having a variety of peripherals such as Brownout Reset, Comparators, DMA, Real-Time Clock, Timers, and Watchdog Timers enhance the functionality and versatility of the microcontroller for different applications.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, the microcontroller can execute instructions at high speeds, suitable for processing complex algorithms and tasks efficiently.

Length: 5 mm

Having a length of 5 mm ensures uniformity in dimensions and alignment on the circuit board, aiding in systematic placement and integration of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high performance and energy efficiency, making it suitable for embedded systems that require fast processing and low power consumption.

No. of Timers: 12

Having 12 timers provides flexibility in time-sensitive operations and scheduling tasks, making the microcontroller ideal for applications that require precise timing control.

RAM Bytes: 32768

With 32768 bytes of RAM, the microcontroller can store and manipulate data efficiently, enabling smooth operation of applications that require temporary data storage.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: NO LEAD

Having a no-lead terminal form simplifies the soldering and assembly process, enhancing the reliability and manufacturability of the final product.

Analog To Digital Convertors: 11-Ch 12-Bit

Eleven 12-bit Analog to Digital Converters provide high resolution and multiple input channels, making the microcontroller suitable for applications requiring accurate analog signal acquisition.

Maximum Supply Current: 34 mA

With a maximum supply current of 34 mA, the microcontroller consumes low power, making it energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V ensures compatibility with standard power sources, simplifying the design and deployment of electronic systems.

No. of DMA Channels: 12

Having 12 Direct Memory Access channels allows for efficient data transfer and management between peripherals and memory, improving overall system performance.

No. of Serial I/Os: 4

Having 4 serial I/O ports enables communication with external devices via serial interfaces, expanding the connectivity options and compatibility of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog signals, making the microcontroller suitable for applications that require adjustable power output and motor control.

Connectivity: FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), USART(2), USB

Supporting various communication interfaces like FDCAN, I2C, I2S, LPUART, SAI, SPI, USART, and USB allows for seamless integration with different devices and peripherals, enhancing the versatility of the microcontroller.

ROM Programmability: FLASH

Being programmable with FLASH memory enables easy updating and customization of the firmware, making the microcontroller adaptable for different system requirements and applications.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5 mm allows for fine-pitch mounting and compact PCB layout, facilitating high-density circuit designs and miniaturization of electronic devices.

Technical Specifications

Microcontrollers STM32G431K6U3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

16

No. of I/O Lines:

26

No. of Serial I/Os:

4

No. of Terminals:

32

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

32768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

170 rpm

Maximum Supply Current:

34 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

FDCAN, I2C(3), I2S(2), LPUART, SAI, SPI(3), USART(2), USB

Peripherals:

BOR, COMPARATOR(4), DMA(12), POR, RTC, TIMER(12), WDT(2)

Analog To Digital Convertors:

11-Ch 12-Bit

Digital To Analog Convertors:

4-Ch 12-Bit

Trade Compliance

STM32G431K6U3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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