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STM32G0C1KET6N

STMicroelectronics

STM32G0C1KET6N by STMicroelectronics

STM32G0C1KET6N from STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 12 ADC channels, and low power modes. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$6.980

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 28 parts In-Stock

1+ parts

$6.980

100+ parts

$3.940

1k+ parts

$2.870

10k+ parts

$2.800

28

$6.980

$3.940

$2.870

$2.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 57 parts In-Stock

1+ parts

$5.244

100+ parts

-

1k+ parts

-

10k+ parts

-

57

$5.244

-

-

-

Vyrian

USA . 7,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,782

-

-

-

-

Anansix

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,380

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,235 parts In-Stock

1+ parts

$4.968

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$4.968

-

-

-

Component Stockers USA

USA . 87 parts In-Stock

1+ parts

$6.350

100+ parts

$4.670

1k+ parts

-

10k+ parts

-

87

$6.350

$4.670

-

-

Microchip USA

USA . 5,428 parts In-Stock

1+ parts

$25.962

100+ parts

-

1k+ parts

-

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5,428

$25.962

-

-

-

IDEA Electronic Components Group

UK . 1,451 parts In-Stock

1+ parts

$77.711

100+ parts

-

1k+ parts

$69.940

10k+ parts

-

1,451

$77.711

-

$69.940

-

MKK Technologies

India . 1,184 parts In-Stock

1+ parts

$146.131

100+ parts

-

1k+ parts

-

10k+ parts

-

1,184

$146.131

-

-

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DigiPath Technology Company

USA . 1,184 parts In-Stock

1+ parts

$146.131

100+ parts

-

1k+ parts

-

10k+ parts

-

1,184

$146.131

-

-

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Parana Technologies

USA . 887 parts In-Stock

1+ parts

-

100+ parts

$92.916

1k+ parts

-

10k+ parts

-

887

-

$92.916

-

-

Overview

Elevate your projects with the STM32G0C1KET6N microcontroller from STMicroelectronics—a leader in innovative technology. This compact powerhouse boasts exceptional performance and versatility, perfectly suited for applications ranging from industrial automation to IoT devices. With its low power consumption and extensive connectivity options, you’ll enjoy increased efficiency and reliability, ensuring your designs stand out while driving value and innovation. Discover limitless possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and lightweight characteristics suitable for various applications in electronics.

Surface Mount: YES

Surface mount technology allows for easier assembly and integration into compact circuit designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of power supply systems.

On Chip Data RAM Width: 8

An 8-bit on-chip data RAM width is efficient for applications needing compact data storage.

Package Shape: SQUARE

The square package shape facilitates space-efficient placement on circuit boards.

Bit Size: 32

A 32-bit architecture enhances processing power and performance, making it suitable for complex computing tasks.

DAC Channels: YES

Integrated DAC channels allow for direct analog signal generation, making the MCU suitable for audio and sensor applications.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample I/O connectivity for various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is advantageous for space-constrained applications.

Minimum Supply Voltage: 1.7 V

Supporting a minimum supply voltage of 1.7V allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C makes this MCU suitable for industrial and high-temperature applications.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family provides an efficient architecture focused on low power consumption and performance.

Minimum Operating Temperature: -40 °C

An operating range that extends down to -40 °C ensures reliability in extreme conditions.

ADC Channels: YES

Integrated ADC channels allow for effective signal processing from sensors, adding versatility to the MCU.

DMA Channels: YES

Presence of DMA channels facilitates fast data transfers between peripherals without CPU intervention, enhancing performance.

Terminal Position: QUAD

Quad terminal positioning simplifies board layout and soldering processes.

ROM Words: 524288

With 524288 ROM words, the microcontroller can store extensive program code and applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a low-profile design, suitable for compact devices.

Digital To Analog Convertors: 2-Ch 12-Bit

Two 12-bit DAC channels enhance the microcontroller's capability for high-fidelity analog signal output.

Width: 7 mm

A compact width of 7 mm ensures easy integration into space-restricted applications.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Diverse integrated peripherals enhance functionality, allowing for high levels of integration and application versatility.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for efficient processing while maintaining low power consumption.

Length: 7 mm

The 7 mm length aids in maintaining a compact form factor for modern electronic designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures signifies robustness and reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it delivers high performance with a simplified instruction set and low power consumption.

No. of Timers: 14

Having 14 timers allows for complex timing applications, enabling accurate control of processes.

RAM Bytes: 147456

With 147456 bytes of RAM, this microcontroller can handle complex applications and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical stability and ease of soldering during assembly.

Analog To Digital Convertors: 12-Ch 12-Bit

A 12-channel, 12-bit ADC provides high-resolution digital representation of analog signals, ideal for sensor applications.

Maximum Supply Current: 9.4 mA

A maximum supply current of 9.4 mA aids in power-efficient designs, prolonging battery life.

Nominal Supply Voltage: 3 V

Supports a nominal supply voltage of 3V, ideal for many applications utilizing standard battery voltages.

No. of DMA Channels: 12

Twelve DMA channels allow efficient data handling between peripherals, enhancing system performance.

No. of Serial I/Os: 8

With 8 serial I/O interfaces, this MCU can connect to multiple serial devices for communication.

PWM Channels: YES

Integrated PWM channels enable effective control of motors and other actuators, making it suitable for diverse applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Rich connectivity options support various communication protocols, enhancing integration capabilities with multiple devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications of the embedded software.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for a compact layout while maintaining ease of handling and soldering.

Format: FIXED POINT

The fixed-point format suggests efficient arithmetic operations useful in embedded applications.

Speed: 64 rpm

Operating at 64 rpm allows for stable performance in applications requiring steady control.

Low Power Mode: YES

The low power mode feature is essential for battery-operated devices, extending operational lifetime.

On Chip Program ROM Width: 8

An 8-bit program ROM width is sufficient for simple programming needs, optimizing performance.

No. of I/O Lines: 29

With 29 I/O lines, the microcontroller offers extensive flexibility for peripheral connectivity and sensor integration.

Technical Specifications

Microcontrollers STM32G0C1KET6N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

29

No. of Serial I/Os:

8

No. of Terminals:

32

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1KET6N Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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