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STM32G0C1CCU6

STMicroelectronics

STM32G0C1CCU6 by STMicroelectronics

STM32G0C1CCU6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 48 MHz clock speed. With 17 ADC channels and dual DACs, it's ideal for industrial applications requiring precision control. Its compact design includes 48 terminals in a very thin profile package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,283 parts In-Stock

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4,283

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Digiode

USA . 1,372 parts In-Stock

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1,372

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Anansix

USA . 401 parts In-Stock

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401

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Distributors (Availability)

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AZTECH Wire

Italy . 1,174 parts In-Stock

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$9.400

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$9.400

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Microchip USA

USA . 6,508 parts In-Stock

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$23.957

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$23.957

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IDEA Electronic Components Group

UK . 905 parts In-Stock

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$37.412

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$33.671

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905

$37.412

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$33.671

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MKK Technologies

India . 471 parts In-Stock

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$70.350

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471

$70.350

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DigiPath Technology Company

USA . 471 parts In-Stock

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$70.350

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471

$70.350

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Corphita

USA . 3,605 parts In-Stock

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Parana Technologies

USA . 2,195 parts In-Stock

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$44.732

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2,195

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$44.732

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Overview

Unlock the potential of your next project with the STM32G0C1CCU6 microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics delivers a versatile solution ideal for industrial applications, consumer electronics, and IoT devices. This compact powerhouse combines efficiency with robust performance, featuring low power consumption and an array of connectivity options, ensuring seamless integration and impressive reliability. Experience enhanced productivity and creativity today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of PCB space.

Maximum Supply Voltage: 3.6 V

A maximum voltage of 3.6 V ensures compatibility with a wide range of power supply applications.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for applications requiring efficient data processing and storage.

Package Shape: SQUARE

The square shape facilitates easier heat dissipation and fitting in various PCB layouts.

Bit Size: 32

A 32-bit architecture provides enhanced performance for complex computations and tasks.

DAC Channels: YES

The presence of DAC channels allows for the output of analog signals, beneficial for audio or control applications.

No. of Terminals: 48

With 48 terminals, this microcontroller offers extensive connectivity and flexibility for multiple peripheral devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports effective heat management while maintaining a compact form factor.

Minimum Supply Voltage: 1.7 V

The lower supply voltage requirement enables operation in low-power applications, extending battery life.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes this microcontroller suitable for demanding industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 family is known for its efficiency, offering a balance of performance and power consumption.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions makes it viable for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels allow for real-time analog signal processing, enhancing data acquisition capabilities.

DMA Channels: YES

DMA support facilitates efficient data transfers, reducing CPU load and improving application performance.

Terminal Position: QUAD

Quad terminal positioning increases pin accessibility, aiding integration into various circuit designs.

ROM Words: 262144

This large ROM capacity supports complex firmware applications, enabling advanced functionalities.

Maximum Seated Height: 0.6 mm

A low seated height enhances the microcontroller's compatibility with various compact electronic designs.

Digital To Analog Converters: 2-Ch 12-Bit

Having multiple high-resolution DACs allows for better sound quality and more precise control in applications.

Width: 7 mm

The small width contributes to the overall compactness of designs, suitable for embedded systems.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

A rich set of peripherals enhances versatility for various applications, from timers to watchdogs.

Maximum Clock Frequency: 48 MHz

A clock speed of 48 MHz provides responsive performance for time-sensitive applications.

Length: 7 mm

The brief length allows for space-efficient placement in tight spaces on PCBs.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this microcontroller can withstand tough conditions, ensuring durability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture is optimized for speed and efficiency, ideal for performance-critical applications.

No. of Timers: 14

14 timers enable complex timing tasks and scheduling, enhancing application capability.

RAM Bytes: 147456

A significant RAM size supports complex applications and ensures smooth operation.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals enhance soldering options and pave the way for more environmentally friendly designs.

Analog To Digital Converters: 17-Ch 12-Bit

With many ADC channels, this controller can handle multiple input signals simultaneously, improving data collection.

Maximum Supply Current: 9.4 mA

A low maximum supply current keeps power consumption down, critical in energy-sensitive applications.

Nominal Supply Voltage: 3 V

Operating at 3 V aligns well with many standard digital circuits and battery packs.

No. of DMA Channels: 12

The inclusion of 12 DMA channels improves data handling efficiency, freeing up CPU time.

No. of Serial I/Os: 8

Eight serial I/Os provide comprehensive communication options with other devices.

PWM Channels: YES

PWM support allows for precise control in applications like motor control and signal modulation.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Diverse connectivity options make it adaptable for a variety of communication protocols in embedded systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing product longevity.

Terminal Pitch: 0.5 mm

A tight terminal pitch doesn't just save space but also allows for densely packed designs.

Format: FIXED POINT

Being fixed point facilitates easier numeric processing for many embedded applications where floating point isn't necessary.

Speed: 64 rpm

This speed capability supports slow-moving applications typical in specific industrial and consumer systems.

Low Power Mode: YES

Low power mode features extend battery life and reduce energy consumption in portable applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for compact and efficient memory usage for program storage.

No. of I/O Lines: 44

The availability of 44 I/O lines enhances versatility in application interfacing, supporting multiple peripheral connections.

Technical Specifications

Microcontrollers STM32G0C1CCU6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

0

No. of I/O Lines:

44

No. of Serial I/Os:

8

No. of Terminals:

48

No. of Timers:

14

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

9.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(21), WDT(2)

Analog To Digital Convertors:

17-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0C1CCU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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