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STM32G0B1VEI6

STMicroelectronics

STM32G0B1VEI6 by STMicroelectronics

STM32G0B1VEI6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates b/w -40 °C to 85 °C, and supports up to 100 mA supply current. It includes integrated ADC/DAC channels and multiple connectivity options like CAN and USB. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

$6.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,217 parts In-Stock

1+ parts

$6.090

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1,217

$6.090

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Vyrian

USA . 6,576 parts In-Stock

1+ parts

-

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6,576

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Anansix

USA . 2,312 parts In-Stock

1+ parts

-

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2,312

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ComSIT Distribution GmbH

Germany . 1,198 parts In-Stock

1+ parts

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1,198

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ComSIT USA

USA . 1,198 parts In-Stock

1+ parts

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1,198

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,829 parts In-Stock

1+ parts

$5.769

100+ parts

-

1k+ parts

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4,829

$5.769

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IDEA Electronic Components Group

UK . 927 parts In-Stock

1+ parts

$79.808

100+ parts

-

1k+ parts

$71.827

10k+ parts

-

927

$79.808

-

$71.827

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MKK Technologies

India . 1,338 parts In-Stock

1+ parts

$150.074

100+ parts

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1,338

$150.074

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DigiPath Technology Company

USA . 1,338 parts In-Stock

1+ parts

$150.074

100+ parts

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1,338

$150.074

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Parana Technologies

USA . 1,772 parts In-Stock

1+ parts

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100+ parts

$95.423

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1,772

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$95.423

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Overview

Unlock limitless possibilities with the STM32G0B1VEI6 microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this powerful 32-bit unit is designed to elevate your applications in automation, consumer electronics, and IoT devices. With low power consumption and a robust feature set, you'll enjoy enhanced performance and efficiency, making it the ideal choice for innovative projects that demand precision and versatility. Empower your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Integrated Cache: YES

Having integrated cache allows for faster data access and improved processing speed, which enhances overall performance in demanding applications.

Surface Mount: YES

Surface mount technology enables compact designs and is ideal for high-density applications, making it easy to integrate into modern electronics.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage allows versatility in power supply options while maintaining efficient operation across various systems.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient handling of data, suitable for low-power applications.

Package Shape: SQUARE

A square package shape optimizes space on the PCB, facilitating easy integration into diverse design layouts.

Bit Size: 32

The 32-bit architecture enhances computational capabilities, allowing for handling of complex algorithms and data processing tasks.

DAC Channels: YES

Having digital-to-analog converters (DAC) enables audio and signal generation capabilities, adding versatility for various applications.

No. of Terminals: 100

With 100 terminals, this microcontroller can support extensive input/output connectivity, ideal for complex systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile facilitates high-density applications and efficient thermal management.

Minimum Supply Voltage: 1.7 V

A low minimum supply voltage allows for energy-efficient designs and extends battery life in portable applications.

Maximum Operating Temperature: 85 °C

This temperature range ensures reliable operation in industrial environments, making it suitable for harsh conditions.

CPU Family: CORTEX-M0

The ARM Cortex-M0 family offers low power consumption alongside adequate processing capabilities for embedded applications.

Minimum Operating Temperature: -40 °C

With an extended low temperature range, the microcontroller is capable of functioning in extreme cold conditions, enhancing its application versatility.

ADC Channels: YES

The inclusion of analog-to-digital converters (ADC) supports sensor integration, making it ideal for monitoring and control applications.

DMA Channels: YES

Direct Memory Access (DMA) channels optimize data transfer between peripherals, enhancing overall system efficiency and performance.

Terminal Position: BOTTOM

Bottom terminal positioning improves routing flexibility on the PCB and aids in minimizing signal path lengths.

ROM Words: 524288

A substantial ROM capacity allows for storing complex programs and extensive data, broadening the application scope of the microcontroller.

Maximum Seated Height: 0.6 mm

The low seated height contributes to a compact design, supporting space-constrained applications in consumer electronics.

Digital To Analog Converters: 2-Ch 12-Bit

With dual channels and 12-bit resolution, the DAC allows for high-quality signal generation, suitable for audio and control applications.

Width: 7 mm

The compact width facilitates integration into space-limited designs while maintaining signal integrity and thermal performance.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

A rich set of onboard peripherals enhances functionality, enabling a wide range of applications from timers to real-time clocks.

Maximum Clock Frequency: 48 MHz

Operating at 48 MHz provides ample processing power to handle complex tasks and real-time operations efficiently.

Length: 7 mm

The 7 mm length reinforces the compact design aspect, allowing the microcontroller to fit well in various applications without compromising functionality.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability in demanding environments, making it ideal for industrial and automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller allows for efficient processing and reduced power consumption, making it suitable for low-power applications.

No. of Timers: 13

A high number of timers provides flexibility for scheduling tasks and time-based operations in various applications.

RAM Bytes: 147456

Ample RAM enables efficient data handling and enhances the microcontroller’s multitasking ability, suitable for sophisticated applications.

Technology: CMOS

Using CMOS technology allows for low power consumption and high-speed operation, making it effective for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates easier soldering and better mechanical stability, enhancing durability in electronic designs.

Analog To Digital Convertors: 16-Ch 12-Bit

The presence of 16 channels with 12-bit resolution in the ADC supports multiple sensor inputs for comprehensive data acquisition.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, this microcontroller can support power-hungry peripherals while remaining efficient.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V strikes a balance between performance and power efficiency, suitable for various applications.

No. of DMA Channels: 12

Having 12 DMA channels allows for efficient data transfer without burdening the CPU, enhancing overall system performance.

No. of Serial I/Os: 10

Ten serial I/O channels provide flexibility in communication options, making it suitable for diverse interfacing needs.

PWM Channels: YES

With PWM support, the microcontroller can control motors and other devices effectively, expanding its application in automation.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Multiple connectivity options ensure versatile interfacing capabilities for integration into various systems and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, which is essential for evolving applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables a dense layout, supporting modern PCB designs aimed at maximizing functionality in limited space.

Format: FIXED-POINT

The fixed-point format is efficient for processing numerical data without the overhead of floating-point calculations, suitable for embedded applications.

Speed: 64 rpm

Operating at 64 rpm indicates the capability to process signals or control devices at a reasonable speed for many applications.

Low Power Mode: YES

The inclusion of low power mode extends battery life and reduces thermal output in portable devices, enhancing user experience.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for efficient execution of code, particularly advantageous in energy-sensitive applications.

No. of I/O Lines: 94

With 94 I/O lines, this microcontroller offers extensive interfacing capabilities to connect multiple peripherals and devices.

Technical Specifications

Microcontrollers STM32G0B1VEI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VEI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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