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STM32G0B1VBI6

STMicroelectronics

STM32G0B1VBI6 by STMicroelectronics

STM32G0B1VBI6 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for industrial applications, it supports various connectivity options like CAN and USB. Its low power mode enhances efficiency in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,479 parts In-Stock

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4,479

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Digiode

USA . 1,639 parts In-Stock

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1,639

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Anansix

USA . 1,473 parts In-Stock

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1,473

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Distributors (Availability)

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AZTECH Wire

Italy . 770 parts In-Stock

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$12.820

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-

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770

$12.820

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IDEA Electronic Components Group

UK . 636 parts In-Stock

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$22.051

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$19.846

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636

$22.051

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$19.846

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MKK Technologies

India . 1,450 parts In-Stock

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$41.465

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1,450

$41.465

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DigiPath Technology Company

USA . 1,450 parts In-Stock

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$41.465

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1,450

$41.465

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Component Stockers USA

USA . 843 parts In-Stock

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$57.880

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843

$57.880

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 860 parts In-Stock

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$26.365

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860

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Corphita

USA . 632 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32G0B1VBI6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution ideal for applications ranging from industrial automation to smart home devices. This versatile MCU combines low power consumption with high performance, ensuring efficient operation tailored to your needs. Elevate your designs with reliable technology that empowers creativity and productivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy allows for lightweight and durable packaging, ensuring reliability in various environments.

Integrated Cache: YES

Having an integrated cache improves performance by allowing faster data access, making the microcontroller suitable for high-speed applications.

Surface Mount: YES

Surface mount technology saves space on PCBs, enabling compact designs which are crucial in modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows compatibility with a wide range of power supplies, enhancing versatility in applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width ensures efficient data processing for applications requiring moderate performance.

Package Shape: SQUARE

A square package shape simplifies PCB design and layout, allowing for more efficient use of space.

Bit Size: 32

The 32-bit architecture allows for more complex computations and handling of larger data types, benefiting advanced applications.

DAC Channels: YES

The inclusion of DAC channels allows for high-quality analog output, making it suitable for applications needing precise control of analog signals.

No. of Terminals: 100

Having 100 terminals supports a wide variety of connections for peripherals and interfaces, enhancing overall connectivity.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style minimizes space while maximizing connectivity, essential for modern, compact device designs.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows the microcontroller to function effectively in battery-operated devices, extending battery life.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in high-temperature environments, ideal for industrial applications.

CPU Family: CORTEX-M0

Being part of the Cortex-M0 family provides a strong balance of power efficiency and performance, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate as low as -40 °C makes this microcontroller suitable for outdoor and extreme environment applications.

ADC Channels: YES

With ADC channels, the microcontroller can interface with a variety of sensors, enabling robust data acquisition and control.

DMA Channels: YES

DMA channels enhance data transfer efficiency, allowing peripherals to communicate directly with memory without CPU intervention.

Terminal Position: BOTTOM

Bottom terminal positioning is optimal for robotic and surface mount applications, facilitating compact designs.

ROM Words: 131072

A large ROM size provides ample space for complex programs and algorithms, enhancing functionality.

Maximum Seated Height: 0.6 mm

A low seated height allows for slimmer device designs, aligning with the trend toward miniaturization in electronics.

Digital To Analog Converters: 2-Ch 12-Bit

The availability of dual-channel 12-bit DACs enables the output of quality analog signals for audio and control systems.

Width: 7 mm

A compact footprint of 7 mm contributes to smaller device designs, crucial for portable electronics.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

A rich set of peripherals enhances the versatility of the microcontroller, allowing it to suit a variety of applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz ensures adequate processing speed for most embedded applications.

Length: 7 mm

The minimal length aids in space-efficient PCB layouts, essential for small electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness, making it suitable for harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it promises efficient processing and minimal power consumption, ideal for battery-powered devices.

No. of Timers: 13

Multiple timers allow for complex timing operations crucial in control applications, enhancing functionality.

RAM Bytes: 147456

A sizable RAM allows for more significant data handling and complex computations in applications.

Technology: CMOS

CMOS technology offers lower power consumption, contributing to the energy efficiency of the microcontroller.

Terminal Form: BALL

Ball terminal form provides excellent thermal and electrical conductivity, ensuring better performance.

Analog To Digital Converters: 16-Ch 12-Bit

With 16 channels of 12-bit ADCs, this microcontroller can integrate numerous sensors, making it valuable for data-intensive applications.

Maximum Supply Current: 100 mA

Limiting supply current to 100 mA indicates energy-efficient design, essential for battery-operated devices.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V ensures compatibility with common power sources, facilitating ease of integration.

No. of DMA Channels: 12

Having 12 DMA channels promotes efficient data transfer operations and enhances the performance of I/O operations.

No. of Serial I/Os: 10

With 10 serial I/O lines, it supports extensive connectivity options for peripherals, enhancing its usability.

PWM Channels: YES

The inclusion of PWM channels allows for effective motor control and signal modulation, broadening application potential.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

A variety of connectivity options ensures compatibility with numerous protocols, facilitating integration into diverse systems.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and updates to the system's firmware, ensuring longevity of use.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is conducive for high-density layouts, catering to modern design needs.

Format: FIXED-POINT

A fixed-point format enhances ease of programming in applications where precise fixed decimal representation is necessary.

Speed: 64 rpm

The specified speed indicates performance metrics that are adaptable for specific applications requiring steady operations.

Low Power Mode: YES

Low power modes contribute to energy savings and prolonged battery life in portable applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides flexibility for efficient instruction handling in applications.

No. of I/O Lines: 94

With 94 I/O lines, this microcontroller supports extensive peripheral connections, enhancing system integration.

Technical Specifications

Microcontrollers STM32G0B1VBI6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

94

No. of Serial I/Os:

10

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1VBI6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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