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STM32G0B1REI7N

STMicroelectronics

STM32G0B1REI7N by STMicroelectronics

STM32G0B1REI7N by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU, 48 MHz clock frequency, and 147456 bytes of RAM. It features 2 DAC channels, 14 ADC channels, and low power mode. Ideal for industrial applications requiring high-speed processing and multiple I/O options like CAN, I2C, SPI, USART.

Median Price

$3.689

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 8,820 parts In-Stock

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$3.689

8,820

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$3.689

Vyrian

USA . 6,037 parts In-Stock

1+ parts

-

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6,037

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Digiode

USA . 1,682 parts In-Stock

1+ parts

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1,682

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Anansix

USA . 1,389 parts In-Stock

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1,389

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$9.189

100+ parts

-

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706

$9.189

-

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Ampacity Inc.

Singapore . 1,027 parts In-Stock

1+ parts

$23.000

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-

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-

1,027

$23.000

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Microchip USA

USA . 7,688 parts In-Stock

1+ parts

$30.139

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7,688

$30.139

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IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$48.800

100+ parts

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$43.920

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608

$48.800

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$43.920

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MKK Technologies

India . 1,697 parts In-Stock

1+ parts

$91.766

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1,697

$91.766

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DigiPath Technology Company

USA . 1,697 parts In-Stock

1+ parts

$91.766

100+ parts

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1,697

$91.766

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Corphita

USA . 2,628 parts In-Stock

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2,628

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

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100+ parts

$58.348

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1,701

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$58.348

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Overview

Experience the cutting-edge performance of the STM32G0B1REI7N microcontroller by STMicroelectronics, a leading manufacturer known for top-quality products. This powerful device boasts a wide range of applications in various industries, offering customers unparalleled value and benefits. With its advanced features like integrated cache, DAC channels, and low power mode, this microcontroller delivers superior performance and efficiency. Trust STMicroelectronics to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the STM32G0B1REI7N and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and resistance to external factors, making the microcontroller suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the microcontroller, making it ideal for handling complex tasks.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power input options, enabling the microcontroller to be used in various power supply configurations.

On Chip Data RAM Width: 8

The wider data RAM width enhances the microcontroller's capability to handle larger amounts of data simultaneously, improving overall performance.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, making it easier to integrate the microcontroller into compact designs.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process data in larger chunks, leading to faster execution of instructions and better performance.

DAC Channels: YES

The presence of DAC channels enables the microcontroller to generate analog signals accurately, making it suitable for applications requiring precise analog output.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing the microcontroller to interface with a variety of external devices and components.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage helps in power optimization and allows the microcontroller to operate efficiently in low-power scenarios or battery-powered applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliability and robustness, making the microcontroller suitable for industrial applications exposed to varying temperature conditions.

Technical Specifications

Microcontrollers STM32G0B1REI7N attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

58

No. of Serial I/Os:

10

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1REI7N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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