Loading...

STM32G0B1RCT3

STMicroelectronics

STM32G0B1RCT3 by STMicroelectronics

STM32G0B1RCT3 by STMicroelectronics is a 32-bit microcontroller with Cortex-M0 CPU family, operating at up to 48 MHz. It features 16-Ch 12-Bit ADC channels, 2-Ch 12-Bit DAC channels, and low power mode for automotive applications. With a package size of 10mm x 10mm and terminal pitch of 0.5 mm, it offers high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,518

-

-

-

-

Digiode

USA . 899 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

899

-

-

-

-

Anansix

USA . 884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

884

-

-

-

-

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 577 parts In-Stock

1+ parts

$17.174

100+ parts

-

1k+ parts

-

10k+ parts

-

577

$17.174

-

-

-

Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$18.004

100+ parts

$17.104

1k+ parts

$17.104

10k+ parts

-

31

$18.004

$17.104

$17.104

-

Semicontronic

India . 160 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

1k+ parts

$22.310

10k+ parts

-

160

$23.000

$22.425

$22.310

-

Ampacity Inc.

Singapore . 160 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

160

$25.000

-

-

-

Microchip USA

USA . 5,321 parts In-Stock

1+ parts

$28.333

100+ parts

-

1k+ parts

-

10k+ parts

-

5,321

$28.333

-

-

-

IDEA Electronic Components Group

UK . 1,256 parts In-Stock

1+ parts

$64.619

100+ parts

-

1k+ parts

$58.157

10k+ parts

-

1,256

$64.619

-

$58.157

-

Aztec Data Supply Inc.

USA . 323 parts In-Stock

1+ parts

$78.910

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$78.910

-

-

-

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$86.746

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$86.746

-

-

-

MKK Technologies

India . 1,482 parts In-Stock

1+ parts

$121.512

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$121.512

-

-

-

DigiPath Technology Company

USA . 1,482 parts In-Stock

1+ parts

$121.512

100+ parts

-

1k+ parts

-

10k+ parts

-

1,482

$121.512

-

-

-

Continental Prestige Electronics

USA . 3,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,570

-

-

-

-

Argo Parts USA

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,625

-

-

-

-

Corphita

USA . 2,446 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,446

-

-

-

-

Parana Technologies

USA . 1,596 parts In-Stock

1+ parts

-

100+ parts

$77.262

1k+ parts

-

10k+ parts

-

1,596

-

$77.262

-

-

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Unlock the potential of your next project with the STM32G0B1RCT3 microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers cutting-edge technology that guarantees reliability and performance. Ideal for a wide range of applications, this microcontroller offers integrated cache, DAC channels, and DMA channels, providing versatility and efficiency. With a compact design and maximum clock frequency of 48 MHz, the STM32G0B1RCT3 is a game-changer in the world of microcontrollers. Experience the value and benefits of this innovative product and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable for various applications.

Integrated Cache: YES

With integrated cache, this microcontroller can perform complex tasks efficiently and quickly.

Surface Mount: YES

Being surface mountable allows for easy and compact integration into electronic devices.

Maximum Supply Voltage: 3.6 V

Operates within a safe voltage range for stable performance and reliability.

On Chip Data RAM Width: 8

The 8-bit data RAM width enhances data processing capabilities for optimal performance.

Package Shape: SQUARE

The square package shape facilitates efficient placement on circuit boards for space-saving designs.

Bit Size: 32

The 32-bit architecture enables high-speed processing and handling of data-intensive tasks.

DAC Channels: YES

The presence of DAC channels allows for accurate analog signal generation for diverse applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch design offers versatility and compatibility for various mounting options.

Minimum Supply Voltage: 1.7 V

Operates efficiently at a low supply voltage, making it suitable for low-power applications.

Maximum Operating Temperature: 125 °C

A high operating temperature range ensures reliability in harsh environmental conditions.

CPU Family: CORTEX-M0

The Cortex-M0 CPU family offers a balance of performance and power efficiency for optimal operation.

Minimum Operating Temperature: -40 °C

The wide temperature range enables operation in extreme cold environments.

ADC Channels: YES

With ADC channels, this microcontroller can accurately convert analog signals to digital data for processing.

DMA Channels: YES

The availability of DMA channels enhances data transfer speeds and efficiency for high-performance applications.

Terminal Position: QUAD

The quad terminal position simplifies connection to external devices for seamless integration.

ROM Words: 262144

The large ROM capacity of 262144 words allows for ample storage of program instructions and data.

Maximum Seated Height: 1.6 mm

The low seated height makes this microcontroller suitable for compact designs with minimal space requirements.

Digital To Analog Convertors: 2-Ch 12-Bit

The dual 12-bit DACs provide high-resolution analog output for precision control systems.

Width: 10 mm

The compact width enables easy placement in tight spaces for efficient board layout designs.

Peripherals: BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

The variety of peripherals offer versatile functions for a wide range of applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for fast execution of instructions for demanding tasks.

Length: 10 mm

The short length makes this microcontroller suitable for applications where space is limited.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this microcontroller meets industry standards for performance and durability.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of this microcontroller offers efficient data processing capabilities for various applications.

No. of Timers: 13

The 13 timers provide precise timing control for time-sensitive tasks and applications.

RAM Bytes: 147456

The large RAM capacity of 147456 bytes allows for efficient data storage and retrieval during operation.

Technology: CMOS

The CMOS technology used in this microcontroller ensures low power consumption and high-speed operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates soldering and secure connection with the circuit board.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit ADCs offer high-resolution conversion of analog signals for accurate data acquisition.

Maximum Supply Current: 100 mA

The maximum supply current of 100 mA ensures operational stability under varying load conditions.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides a stable operating voltage for consistent performance.

No. of DMA Channels: 12

The 12 DMA channels facilitate fast data transfer and memory access for efficient task handling.

No. of Serial I/Os: 10

The 10 serial I/O ports offer flexible connectivity options for interfacing with external devices.

PWM Channels: YES

The presence of PWM channels allows for precise control of output signals for various applications.

Connectivity: CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

The multiple connectivity options enable seamless integration with a wide range of communication protocols and devices.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick updates of program instructions and data.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting for compact electronic designs.

Format: FIXED-POINT

The fixed-point format simplifies numerical calculations and processing tasks for better accuracy and efficiency.

Speed: 64 rpm

With a speed of 64 rpm, this microcontroller can handle real-time processing requirements efficiently.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation, extending battery life in portable devices.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width ensures efficient storage and retrieval of program instructions.

No. of I/O Lines: 60

The 60 I/O lines provide ample input/output interfaces for connecting peripherals and external devices.

Technical Specifications

Microcontrollers STM32G0B1RCT3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

3-ch internal adc available

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of I/O Lines:

60

No. of Serial I/Os:

10

No. of Terminals:

64

No. of Timers:

13

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

147456

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), I2S(2), LPUART(2), SPI(3), USART(6), USB

Peripherals:

BOR, COMPARATOR(3), DMA(12), POR, RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32G0B1RCT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20